Provided is a filler connection part inspection method by which the connection state of both end surfaces of a belt-shaped filler that has been affixed annularly along the outer periphery of a bead core is inspected. The filler connection part inspection method includes a step of obtaining data of the distance between optical sensors and side surfaces of the filler by scanning, at the side surfaces of the filler, sections of the vicinity of the both end surfaces along the tangential direction of the filler over a predetermined scanning range with the optical sensors, a step of repeating the data obtaining step while the positions of the optical sensors are changed along the radial direction of the filler, and a step of comparing the obtained data with reference data that is set in advance.

Provided is an information processing apparatus including: an input unit into which shape data of a surface to be measured including a plurality of recesses is input; and a setting unit that detects each of the plurality of recesses on the basis of the input shape data and sets, for the detected recess, a region to be removed including the recess.

According to an embodiment of the present invention, a method of measuring a surface of an object having a curved shape by measuring a distance from a measurement head to the object, includes: setting a measuring region of the object and a threshold value of concave and convex; acquiring shape reference data including the curved shape of the object; acquiring three-dimensional data of the surface of the object by measuring the distance between the object in the measuring region and the measurement head; acquiring curve removed data by removing the shape reference data from the three-dimensional data; calculating second reference data by calculating first reference data based on the curve removed data, by removing data exceeding the threshold value with respect to the first reference data, from the curve removed data, and by averaging the curve removed data; and calculating shape data of the concave and convex.

A surface texture measuring apparatus includes an X axis displacement mechanism and a Y axis displacement mechanism displacing a measurable object having an interior wall along an XY plane; a measurement sensor measuring a surface texture of the interior wall without contact; a Z axis displacement mechanism displacing the measurement sensor in a Z axis direction orthogonal to the XY plane and bringing the measurement sensor to face the interior wall; a W axis displacement mechanism displacing the measurement sensor facing the interior wall in a normal direction of the interior wall; and a θ axis displacement mechanism displacing the measurement sensor facing the interior wall along the interior wall.

A surface texture measuring apparatus includes: a measurement sensor measuring, without contact, a surface texture of an interior wall of a cylinder portion of a measurable object while displacing in a normal direction of the interior wall at each measurement region into which the interior wall is divided in a circumferential direction of the cylinder portion; a W axis displacer displacing the measurement sensor in a W axis direction; a θ axis displacer displacing the measurement sensor in the circumferential direction, after measurement of the surface texture of a first measurement region, such that the measurement sensor faces a second measurement region adjacent to the first measurement region in the circumferential direction; and a controller adjusting a W axis direction measurement position for measuring the surface texture of the second measurement region while displacing the measurement sensor in the W axis direction.

A hand-held mobile 3D scanner (10) for scanning a scene. The scanner (10) comprises a range sensor (11) that is arranged to sense the location of surface points in the scene relative to the scanner (10) and generate representative location information, a texture sensor (12) that is arranged to sense the texture of each surface point in the scan of the scene and generate representative texture information, and a position and orientation sensor (13) that is arranged to sense the position and orientation of the scanner (10) during the scan of the scene and generate representative position and orientation information. A control system (14) is also provided that is arranged to receive the information from each of the sensors and generate data representing the scan of the scene.

A system includes an inspection robot for performing an inspection on an inspection surface with an inspection robot, the apparatus comprising a position definition circuit structured to determine an inspection robot position on the inspection surface; a data positioning circuit structured to interpret inspection data, and to correlate the inspection data to the inspection robot position on the inspection surface; and wherein the data positioning circuit is further structured to determine position informed inspection data in response to the correlating of the inspection data with the inspection robot position, wherein the position informed inspection data comprises absolute position data.

An estimation apparatus includes: an acquisition section that acquires a measurement result of a measurement unit that measures an object to be an estimation target of a contact sense in a contactless manner; a determination section that makes a determination as to an aspect of the object or a measurement condition of the object on a basis of the measurement result of the measurement unit; a selection section that selects, on a basis of a result of the determination, an estimation scheme to be used for estimation of the contact sense of the object from among a plurality of estimation schemes; and an estimation section that estimates the contact sense of the object using the selected estimation scheme.

A wafer surface defect inspection method and a wafer surface defect inspection apparatus are provided. The method includes the following steps. Scanning information of a wafer is received, and the scanning information includes multiple scanning parameters. At least one reference point of the scanning information is determined, and path information is generated according to the at least one reference point and a reference value. Multiple first scanning parameters corresponding to the path information in the scanning parameters are obtained according to the path information to generate a curve chart. According to the curve chart, it is determined whether the wafer has a defect, and a defect type of the defect is determined.

Methods of characterizing the topography of a surface of a creped material, devices for characterizing surface topography of a creped material, computer systems for characterizing surface topography of a creped material, and the like, are disclosed.