The present invention provides a surface shape measuring device and a surface shape measuring method which do not require a physical reference plane and can improve measurement accuracy without using a mechanical adjustment mechanism. The illumination light condensing point P.sub.Q and the reference light condensing point P.sub.L are arranged as mirror images of each other with respect to the virtual plane VP, and each data of the object light O, being a reflected light of the spherical wave illumination light Q, and the inline spherical wave reference light L is recorded on each hologram. On the virtual plane VP, the reconstructed object light hologram h.sup.V for measurement is generated, and the spherical wave optical hologram s.sup.V representing a spherical wave light emitted from the reference light condensing point P.sub.L is analytically generated. The height distribution of the surface to be measured of the object 4 is obtained from the phase distribution obtained by dividing the reconstructed object light hologram h.sup.V by the spherical wave light hologram s.sup.V. High-accuracy surface shape measurement without requiring a reference plane such as a glass substrate is realized by comparing the phase data of the reflected light acquired from the surface to be measured and the phase distribution on the plane cut surface of the spherical wave obtained analytically.

The present invention provides a measurement device for grinding wheel. One or more thickness measurement device is disposed slidably on a platform. A spinning device is disposed on the platform. A grinding wheel is fixed on the spinning device. The spinning shaft spins the grinding wheel. The one or more thickness measurement device measures the flatness condition of the grinding wheel. Furthermore, according to the present invention, a diameter measurement device is disposed inside the platform and measures the roundness of the outer periphery of the grinding wheel. Since the structure can be disassembled easily, the whole measurement device for grinding wheel can be carried conveniently. In addition, measurements can be performed by users on the site where the grinding wheel is located for real-timely understanding the real size and wear condition of grinding wheel.

A method of inspecting flatness of substrate is provided and includes providing a substrate. N first inspecting points are selected from the surface of the substrate along a first straight line, where the coordinate of the i-th first inspecting point is (X.sub.i,Y.sub.i,Z.sub.i). By using a formula “D=Σ.sub.i=1.sup.N−1√{square root over ((X.sub.i+1−X.sub.i).sup.2+(Y.sub.i+1−Y.sub.i).sup.2+(Z.sub.i+1−Z.sub.i).sup.2)}”, a first measurement length D is calculated. By using a formula “F=(D−S)/S”, a first flatness index F is calculated. S is the horizontal distance between 1.sup.st first inspecting point and N-th first inspecting point. When the first flatness index F is larger than a first threshold, the substrate is determined to be unqualified.

A method for monitoring flatness of a wafer table includes: acquiring a yield and original focus data of a wafer in real time; obtaining an edge flatness curve of a wafer table based on the original focus data; obtaining a yield curve of the wafer based on the yield of the wafer; obtaining a trend diagram of the edge flatness and the yield over time based on the edge flatness curve and the yield curve; and determining, based on the trend diagram, an edge flatness value of the wafer table when the wafer table is replaced.

The present invention is directed to a system for measuring surface flatness, deformation and/or coefficient of thermal expansion (CTE) of a specimen comprising an image capture and analysis processing calibration means for performing image capture and analysis processing calibration of said system, a measuring means for measuring surface flatness of a specimen in a specimen holder, a heating means for heating said sample holder with a predetermined profile, and a control means for providing the predetermined heating profile onto the surface of said specimen and controlling operations of said image capture and analysis processing calibration means, said measuring means, and said heating means.

The illumination light condensing point P.sub.Q and the reference light condensing point P.sub.L are arranged as mirror images of each other with respect to the virtual plane VP, and each data of the object light O, being a reflected light of the spherical wave illumination light Q, and the inline spherical wave reference light L is recorded on each hologram. On the virtual plane VP, the reconstructed object light hologram h.sup.V for measurement is generated, and the spherical wave optical hologram s.sup.V representing a spherical wave light emitted from the reference light condensing point P.sub.L is analytically generated. The height distribution of the surface to be measured of the object 4 is obtained from the phase distribution obtained by dividing the reconstructed object light hologram h.sup.V by the spherical wave light hologram s.sup.V.

An information processing method includes obtaining information on a deformation factor of a surface of a target substrate; obtaining a surface image of the target substrate; calculating a correction coefficient for correcting an image change due to deformation of the surface, based on the information on the deformation factor of the surface; and generating a corrected image of the target substrate by correcting the surface image of the target substrate using the correction coefficient.

Provided is an unevenness level inspecting device includes a target at a known distance from a to-be-inspected surface, a traveling unit for traveling on the to-be-inspected surface, a communication unit capable of making communication with a surveying instrument for measuring three-dimensional position coordinates of the target, and a control unit configured to calculate a height of the to-be-inspected surface corresponding to a measurement position of the target, the control unit calculates a height of the to-be-inspected surface corresponding to a measurement position of the target measured each time the unevenness level inspecting device travels a predetermined distance, and generates display data for displaying unevenness level information associating a difference between the height of the to-be-inspected surface and a reference height with inspecting device position coordinates in a manner that the unevenness level information is superimposed on a site design drawing.

The invention embodies methods and apparatuses to monitor and control the characteristics of a creping process. The method involves measuring optical properties of various points along a creped paper sheet and converting those measurements into characteristic defining data. The invention allows for determining the magnitude and distribution of crepe structures and their frequency and distribution. This allows for the generation of information that is accurate and is much more reliable than the coarse guessing that is currently used in the industry. Feeding this information to papermaking process equipment can result in increases in both quality and efficiency in papermaking.

Methods and systems for determining the integrity of a manufactured board are disclosed. An example system includes a testing platform configured to secure the manufactured board, a sensor configured to measure a parameter corresponding to a flatness of a surface of the board, and a controller. The controller is configured to identify regions on the surface corresponding to one of a peak or a valley based on the parameter, and calculate a score representing the integrity of the manufactured board based on the identified peaks and valleys. The controller adjusts a flow rate, a pressure, a temperature, and position of a deposited substance in a manufacturing process based on a comparison with a height of the peak and/or a depth of the valley to stored peak heights and/or valley depths. In some examples, a mechanical tester determines a compressive strength and a density of the board at the identified regions.