A system for measuring spatial coordinates of a measurement object, comprising a mobile computer device comprising a first optical sensor for capturing image data of the measurement object; a pose determination unit comprising an external tracking sensor, wherein the external tracking sensor is embodied separately from the mobile computer device and is configured to capture pose data indicative of a pose of the mobile computer device; and a control unit configured to determine the spatial coordinates of the measurement object on the basis of the image data of the measurement object and the pose data of the mobile computer device.

A surface texture measuring apparatus includes: a measurement sensor measuring, without contact, a surface texture of an interior wall of a cylinder portion of a measurable object while displacing in a normal direction of the interior wall at each measurement region into which the interior wall is divided in a circumferential direction of the cylinder portion; a W axis displacer displacing the measurement sensor in a W axis direction; a θ axis displacer displacing the measurement sensor in the circumferential direction, after measurement of the surface texture of a first measurement region, such that the measurement sensor faces a second measurement region adjacent to the first measurement region in the circumferential direction; and a controller adjusting a W axis direction measurement position for measuring the surface texture of the second measurement region while displacing the measurement sensor in the W axis direction.

An information processing apparatus includes an acquisition unit configured to acquire a plurality of captured images of a traveling surface where a movable apparatus travels, each of the captured images including distance information in a depth direction transverse to the traveling surface, the plurality of captured images having been captured using a plurality of stereo image capture devices, and an image processing unit configured to stitch together the plurality of images of the traveling surface captured by the plurality of stereo image capture devices by identifying partially overlapping portions of one or more pairs of the images captured by respective stereo image capture devices which are adjacent in a width direction of the traveling surface.

The invention relates to a method of visualizing the planeness of a ring surface (16) of a container (14), the method consisting in: lighting the ring surface from above using a peripheral incident light beam having radial rays with specular reflection on the ring surface; and using an optical system (24, 124) to form a plane image of the ring surface on a sensor (18), with an optical geometrical transformation that converts a real height difference (dZ) into an image radial offset (dR) on the image, and the image radial offset (dR) corresponding to a unit real height difference (dZ) is greater than the image radial offset corresponding to a real radial offset of the same dimension.

The invention also provides a device and an installation implementing such a method.

The present disclosure provides a backlight source flatness detection system and a backlight source flatness detection method. The backlight source flatness detection system includes: a working table, a support column, a detection device, a processor and a display device. The working table is transparent and carries a to-be-detected backlight source. The support column supports the working table. The detection device is below the working table and detects distances between the detection device and at least two detection positions of the to-be-detected backlight source. The at least two detection positions includes at least one position of a center area and at least one position of a peripheral area. The processor is connected to the detection device and processes a detection result from the detection device so as to acquire a warpage value. The display device is connected to the processor and to display the warpage value acquired by the processor.

A welding quality processing method and device, and a circuit board. The method includes: obtaining warpage data of each circuit board layer in a multi-layer circuit board under a preset welding temperature change curve; performing simulation according to a stacked state of the multi-layer circuit board and the warpage data to generate a warpage level of each region in the multi-layer circuit board in the stacked state; and processing the multi-layer circuit board according to the warpage level.

A wafer surface defect inspection method and a wafer surface defect inspection apparatus are provided. The method includes the following steps. Scanning information of a wafer is received, and the scanning information includes multiple scanning parameters. At least one reference point of the scanning information is determined, and path information is generated according to the at least one reference point and a reference value. Multiple first scanning parameters corresponding to the path information in the scanning parameters are obtained according to the path information to generate a curve chart. According to the curve chart, it is determined whether the wafer has a defect, and a defect type of the defect is determined.

[Technical Problem]

An object is to provide a method and apparatus for measuring a surface profile that enable correction or the like of the surface profile through measuring the surface profile of a semiconductor layer when forming the semiconductor layer by a vapor deposition method.

[Solution]

A single laser beam is reflected by a movable mirror to generate incident laser beams (Ld1, Ld2 and Ld3) separated substantially into three beams, and incident points (P1, P2 and P3) on the surface of a semiconductor layer (7) being formed in a chamber (2) are irradiated with the incident laser beams (Ld1, Ld2 and Ld3). A beam position sensor detects reflected laser beams (Lv1, Lv2 and Lv3) from the irradiation points (P1, P2 and P3) thereby to measure the surface profile of a film that includes the incident points (P1, P2 and P3).

Embodiments of systems for classifying interference signals are disclosed. In an example, a system for classifying interference signals includes an interferometer including a light source and a detector, and at least one processor. The interferometer is configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip. A spectrum of the light source is greater than a spectrum of white light. The at least one processor is configured to classify the interference signals into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip.

A tool for detecting deformation of a nominally straight element includes a first body element having first straight edge, means for biasing the first straight edge against the straight element, and a light source arranged to illuminate any space present between the straight element and the first straight edge of the first body element.