A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.

Dynamic digital fringe projection (DDFP) techniques for measuring warpage. The DDFP technique generates a dynamic fringe pattern, in which a proper fringe intensity distribution is dynamically determined based on the surface reflectance of an unpainted sample in order to obtain better fringe image contrasts. The DDFP technique includes the automatic segmentation method to segment the chip package and PWB regions in an unpainted PWB assembly PWBA image. It also includes calibration methods to compensate the mismatches in coordinates and intensities between the projected and captured images.

The present disclosure relates to a device and a system for testing flatness. The device for testing flatness includes a base, a testing platform, and a ranging sensor. The testing platform is assembled on the base. The testing platform includes a supporting structure. The supporting structure is disposed on the side of the testing platform away from the base and is used to support a to-be-tested board. The structure matches the structure of the to-be-tested board. The ranging sensor is disposed on the side of the testing platform away from the base. After the to-be-tested board is placed on the testing platform, the ranging sensor is used to test distances between a number N of to-be-tested positions on the to-be-tested board and the ranging sensor, to obtain N pieces of distance information, and the N pieces of distance information are used to determine the flatness of the to-be-tested board, where N is an integer greater than 2. According to the embodiments of the present disclosure, the flatness of the glass substrate can be tested to improve the manufacturing process to reduce the flatness of the glass substrate, and avoid the problem that the glass substrate is easily broken when entering the subsequent process equipment and the process equipment is down.

A shape inspection apparatus includes N illumination light sources, a line sensor camera, a measurement control unit, and a data processing unit. The measurement control unit controls the illumination light sources to modulate luminescence intensities at a frequency that is 1/N of a frequency of a scan rate of the line sensor camera, and to emit lights by sequentially repeating N different patterns of illumination intensity ratios. The data processing unit generates a first separated image and a second separated image based on a photographed image, generates a first mixing elimination image acquired by removing an unnecessary illumination component from the first separated image, and a second mixing elimination image acquired by removing an unnecessary illumination component from the second separated image, and calculates an inclination of the surface of the strip-shaped body based on a difference between the first mixing elimination image and the second mixing elimination image.

The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.

An information processing apparatus includes an acquisition unit configured to acquire a plurality of captured images of a traveling surface where a movable apparatus travels, each of the captured images including distance information in a depth direction transverse to the traveling surface, the plurality of captured images having been captured using a plurality of stereo image capture devices, and an image processing unit configured to stitch together the plurality of images of the traveling surface captured by the plurality of stereo image capture devices by identifying partially overlapping portions of one or more pairs of the images captured by respective stereo image capture devices which are adjacent in a width direction of the traveling surface.

A method for selecting a template assembly includes: preparing a template assembly in which a template is concentrically attached on a base ring or a base plate having a larger outer diameter than the template, the template having a back pad to hold a workpiece back surface and a retainer ring positioned on the back pad and to hold an edge portion of the workpiece; non-destructively measuring a height position distribution of the retainer ring and the back pad on the template side of the template assembly, where an outer peripheral edge surface of the base ring or the base plate serves as a reference surface; calculating a flatness of the retainer ring and an average amount of step differences between the retainer ring and the back pad from the measured height position distribution; and selecting the template assembly based on the flatness and the average amount of step differences.

Disclosed is a device and method for distributed detection of straightness of a working face of a scraper conveyor based on optical fiber sensing. The device includes a broadband light source, a first optical fiber circulator array, a second optical fiber circulator array, a collimator array, a reflecting film array, a third optical fiber circulator array, and an optical path analyzer. During transmission of light emitted from the broadband light source, the light with different wavelengths is separated via several optical gratings etched on a single-mode optical fiber (SMF), and reaches reflecting films adhered to the working face of the scraper conveyor through first optical fiber circulators, second optical fiber circulators, and collimators. The light with the different wavelengths is then reflected back from the reflecting films, enters the SMF through third optical fiber circulators, and finally enters the optical path analyzer.

To reliably measure a surface of an object to be measured having a wide width. A surface measurement apparatus that measures a surface of an object to be measured moving in a predetermined moving direction on a plane or a surface of an object to be measured moving in a predetermined moving direction along a curved surface of a roll, the surface being along the curved surface, the apparatus includes: N (N being an integer of two or more) light sources provided in a width direction, the light sources each emitting line beam over the width direction, which is a direction perpendicular to the moving direction; a screen on which reflected images of N pieces of the line beam reflected on reflection regions of the surface of the object to be measured respectively are projected; an image capturing device that captures the reflected image projected on the screen and acquires a captured image; and an arithmetic processing device that measures the surface of the object to be measured by using the captured image, in which the reflected images are projected on the screen to be distinguishable from each other.

A device to ensure planarity of a semiconductor wafer during growth at an increased temperature in a growth chamber arranged in a reactor housing where the device includes a growth chamber having a port to allow the deposition of at least one wafer on a rotating susceptor in the growth chamber and the withdrawal of the wafer. The growth chamber has an inlet channel for a supply of process gases and an outlet channel for a discharge of not consumed process gases to create a process gas flow between said channels. Separate heaters are adjacent to the growth chamber to heat the rotating wafer with individually controlled heating zones both above and under the wafer. An instrument measures the bending of the wafer, and an automatic control circuit uses data from temperature sensors or measured data of power supplied to the heaters and the instrument measuring bending of the wafer to change the temperature in said temperature zones so that bending of the wafer is minimized.