Patent classifications
G01B11/306
INFORMATION PROCESSING DEVICE
An information processing device, to be used in an image capturing device that illuminates an object by an illumination means and captures reflected light from the object as a reflection image by a capturing means, includes a determination means for determining an irradiation angle range for irradiating the object by the illumination means, on the basis of two types of inclination statistic values that are values corresponding to the inclination distribution of the unevenness existing on a surface of the object.
MEASURING APPARATUS AND METHOD OF WAFER GEOMETRY
Embodiments of the present application provide a measuring apparatus and method of a wafer geometry. The measuring apparatus of the wafer geometry includes: an air-bearing chuck, configured to generate an air cushion to keep a wafer to be measured floating up on a top surface of the air-bearing chuck; and an interferometer, disposed on one side, away from the air-bearing chuck, of the wafer, and configured to obtain an interference fringe image of a front surface of the wafer to measure a geometry of the wafer based on the interference fringe image. An air cushion is generated by utilizing an air-bearing chuck to keep a wafer to be measured floating up on a top surface of the air-bearing chuck, thereby avoiding damage of the original shape of the wafer or contamination of the wafer by a clamping tool, and further reducing errors during measurement.
AIR-BEARING CHUCK
An air-bearing chuck includes a nozzle portion and a gas channel portion. The nozzle portion is provided with a plurality of support force nozzles for generating an air cushion on a top surface of the nozzle portion. The gas channel portion includes a first gas channel configured to transmit a first gas to the plurality of support force nozzles to provide support force. Embodiments of the present application can implement that the first gas channel transmits the first gas to the plurality of support force nozzles to provide support force, and an air cushion is generated on the top surface of the nozzle portion by regulating gas flow of the first gas in the first gas channel, thereby keeping a supported object supported by the air cushion stably floating up on one side, away from the top surface of the nozzle portion, of the air cushion.
OPTICAL INSPECTION APPARATUS, PROCESSING DEVICE, OPTICAL INSPECTION METHOD, AND NON-TRANSITORY STORAGE MEDIUM STORING OPTICAL INSPECTION PROGRAM
According to an embodiment, an optical inspection apparatus includes an imaging portion, a first wavelength selection portion, an illumination portion, and a second wavelength selection portion. The imaging portion includes an image sensor configured to capture a subject by light from the subject. The first wavelength selection portion is provided on an optical axis of the imaging portion and is configured to selectively pass a plurality of light components of predetermined wavelengths. The illumination portion is configured to illuminate the subject. The second wavelength selection portion is provided on an optical axis of the illumination portion and is configured to pass the plurality of light components of the predetermined wavelengths complementarily to the first wavelength selection portion.
Device for contactlessly determining the straightness of at least one long product and method for calibrating a device of this type
A device for contactlessly determining the straightness of at least one long product, where punctiform or linear measuring radiation is moved by a radiation source module over the long product at least transversely to the longitudinal direction of the long product during a measuring cycle. The intensity of detection radiation coming from an area of incidence of the measuring radiation is recorded by a radiation detection module in a time-resolved manner and is supplied to a control and evaluation unit. The spatial position of the areas of incidence and thus the straightness of a long product can be determined from location information regarding the areas of incidence in the longitudinal direction and from characteristic intensity values of the detection radiation. For a calibration, a reference straightness can be determined by carrying out multiple measuring cycles by rotating a long product of unknown straightness.
Three-dimensional surface roughness evaluating device, three-dimensional surface roughness evaluating method, three-dimensional surface roughness data acquiring device, and three-dimensional surface roughness data acquiring method
A three-dimensional surface roughness evaluating device wherein a two-dimensional laser displacement meter is disposed so that the width direction of the two-dimensional laser displacement meter coincides with a Y-axis direction, to be able to measure displacement data of coordinates in the Y-axis direction at fixed intervals, the measuring width of the two-dimensional laser displacement meter is at least two or more times mean width of the roughness profile elements RSm of elements of a measurement target, and a calculating device is configured to generate reference surface data of each coordinate by averaging in the Y-axis direction the displacement data acquired at fixed intervals in the X-axis direction by the two-dimensional laser displacement meter, and generate three-dimensional surface roughness data of the measurement target by subtracting the reference surface data of each coordinate from the displacement data of each X-Y plane coordinate.
METHODS AND SYSTEMS FOR MEASURING FLATNESS OF ALUMINUM ALLOY SHEET IN A HEAT TREATING FURNACE
The present disclosure relates to a method and system for measuring flatness and degree of sea gull in an aluminum alloy sheet continuously moving in a horizontally floating state through a continuous convection floating furnace. The method and system utilize two or more sensors that take readings indicative of flatness as the aluminum alloy sheet continuously moves through the continuous convection floating furnace. These readings may be compiled into one or more graphics indicative of flatness of the aluminum alloy sheet.
Tubular body inner surface inspection apparatus and tubular body inner surface inspection method
There is provided a tubular body inner surface inspection apparatus that detects a defect existing on an inner surface of a tubular body, the apparatus including: a tubular body imaging apparatus including N (N≥2) imaging units each including a laser light source that applies laser light, an optical element that reflects laser light applied from the laser light source in a circumferential direction of the inner surface of the tubular body, as annular laser light, an area camera that images a region of the inner surface of the tubular body where the annular laser light is applied, and thereby generates an annular beam image, and a linking member that links together and fixes the laser light source and the area camera, in which the imaging units are linked in series along a tube axial direction of the tubular body in such a manner that positions of the linking members in a plane orthogonal to a tube axis are different from each other; a movement apparatus that moves the tubular body imaging apparatus along the tube axial direction of the tubular body; and an arithmetic processing apparatus that, while moving the tubular body imaging apparatus by means of the movement apparatus, performs image processing on a plurality of annular beam images generated in each of the imaging units and assesses whether a defect exists on the inner surface of the tubular body or not.
METHOD FOR MEASURING WAFER PROFILE
A method for measuring a wafer profile while holding a periphery of the wafer by using a flatness measurement system, including first and second optical systems respectively located on first and second main surfaces of the wafer, the method including: a first step measuring each surface variation on the main surfaces using one of the optical systems; a second step of calculating a periphery-holding deformation amount, caused by holding the wafer periphery, through utilization of the surface variations measured with the optical system; and a third step of calculating an actual wafer Warp value through subtraction of the periphery-holding deformation amount from a Warp value outputted by the flatness measurement system. This provides a method for measuring a wafer profile to enable measurement of actual wafer Warp value by using a flatness measurement system, and to successfully acquire a Warp value with little influence from a difference among systems.
Method of measuring a flatness of an object and apparatus for performing the same
In a method of measuring a flatness of an object, a laser, which may have a wavelength reflectable from the object, may be converted into a laser array. The laser array may be irradiated to the object. The flatness of the object may be measured using a reflected laser array reflected from the object. Thus, the flatness of the object may be accurately measured to decrease process errors of a display device by correcting the flatness of the glass substrate.