An electronic device includes: a sensor mounting portion; an inertial force sensor unit detecting an inertial force, the inertial force sensor unit being mounted on the sensor mounting portion; a mounting base substrate arranged in a housing; and a support beam having multiple connection portions connecting with the sensor mounting portion and having multiple connection portions connecting with the mounting base substrate, the support beam includes an angular portion at which an extension direction of the support beam is angled. The mounting base substrate defines a substrate penetration portion that penetrates the mounting base substrate in a thickness direction of the mounting base substrate. The sensor mounting portion is arranged at an inner side of the substrate penetration portion of the mounting base substrate when viewed from the thickness direction of the mounting base substrate.

A base member includes a via having a first hole and a second hole. When viewed from a direction in which a base surface extends, the first hole and the second hole have shapes becoming wider as getting closer to a first surface and a second surface of the base surface from a portion at which a lower end of the first hole and an upper end of the second hole are in contact with each other. When the first hole and the second hole are viewed from the direction in which the base surface extends, a smaller angle of angles formed by a generatrix of the first hole and a generatrix of the second hole is smaller in a thin region of the base member than in a thick region of the base member.

An inertial measurement unit includes: a substrate; a sealing member; a first inertial sensor module including a first inertial sensor and a first package accommodating the first inertial sensor; and a second inertial sensor module including a second inertial sensor and a second package accommodating the second inertial sensor. A material of the first package includes a resin. A material of the second package is an inorganic material. The first inertial sensor module is accommodated in a space between the substrate and the sealing member and thus airtightly sealed therein. The second inertial sensor module is provided outside the space.

An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

A gyroscope comprising a resonant structure and a plurality of transducers configured to drive a vibrational mode in the resonant structure and detect vibrations of the resonant structure, wherein at least one of the plurality of transducers comprises a piezoelectric mono crystal.

According to one embodiment, a sensor includes a sensor part including first and second sensor elements, and a circuit part. The first sensor element includes a first supporter, a first movable part capable of vibrating, first and second electrodes. The first electrode outputs a first signal corresponding to a vibration of the first movable part. The second electrode outputs a second signal corresponding to the vibration of the first movable part. The second sensor element includes a second supporter, a second movable part capable of vibrating, third and fourth electrodes. The third electrode outputs a third signal corresponding to a vibration of the second movable part. The fourth electrode outputs a fourth signal corresponding to the vibration of the second movable part. The circuit part includes a calculator. The calculator outputs a differential operation result between first and second processing signals.

According to one embodiment, a sensor includes a sensor part including first and second sensor elements, and a circuit part. The first sensor element includes a first supporter, a first movable part capable of vibrating, first and second electrodes. The first electrode outputs a first signal corresponding to a vibration of the first movable part. The second electrode outputs a second signal corresponding to the vibration of the first movable part. The second sensor element includes a second supporter, a second movable part capable of vibrating, third and fourth electrodes. The third electrode outputs a third signal corresponding to a vibration of the second movable part. The fourth electrode outputs a fourth signal corresponding to the vibration of the second movable part. The circuit part includes a calculator. The calculator outputs a differential operation result between first and second processing signals.

A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.