Embodiments provide a proximity sensor located at a side edge of a terminal or a top side edge of the terminal. A first included angle is formed between light emitted by the proximity sensor and a touchscreen of the terminal. The terminal obtains data detected by a motion sensor, and motion data of the terminal based on the data detected by the motion sensor. The terminal determines whether the motion data is less than a first threshold. If the motion data is less than the first threshold, the terminal determines that no external object is currently approaching, and skips performing a mistouch prevention action. If the motion data is greater than or equal to the first threshold, the terminal determines, based on data detected by the proximity sensor, whether an external object is approaching, and determines, based on a determining result, whether to subsequently perform the mistouch prevention action.

In an embodiment, a slim imager is disclosed. The slim imager includes a substrate including an aperture, an image sensor, and an optics unit. The image sensor is on a bottom side of the substrate, spans the aperture, and has an aperture-facing top surface. The optics unit is on a top side of the substrate, spans the aperture, and includes a transmissive optical element having an aperture-facing bottom surface. A volume partially bound by the aperture-facing top surface and the aperture-facing bottom surface has a refractive index less than 1.01 at visible wavelengths.

A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly is disposed within the one or more cavities of the wafer assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly. The detector assembly is further configured to determine a temperature of one or more portions of the wafer assembly based on one or more characteristics of the one or more light sensors.

A complex optical proximity sensor includes a substrate, a light emitter coupled to the substrate, an application-specific integrated circuit chip coupled to the substrate with a proximity sensor thereon, a barrier disposed between the application-specific integrated circuit chip and the light emitter, and an ambient light detection chip manufactured in advance and then coupled to the application-specific integrated circuit chip thereon with a pre-determined height. Also, with the manufacturing method of the complex optical proximity sensor, the detection angle of the ambient light is thereby maximized and the one of the proximity sensor is thereby minimized.

A method and apparatus for determining a color and brightness of an LED, when the LED is biased with a current pulse. The apparatus includes a sensor having a plurality of filters and an output probe connected to the sensor, the output probe providing a color output and a brightness output in a single signal. The sensor may further include an input probe connected to the sensor providing power and a ground probe connected to the sensor providing a grounded connection to the sensor. The plurality of filters in the sensor are preferably configured in a matrix array of color receptors having different colors. The method of this invention utilizes pulsing/dynamic sampling to determine a frequency and/or a brightness of the LED output.

A photodetector including: a case including a light receiving surface provided on an upper surface and having a first region that transmits visible light and a second region that transmits less visible light than the first region; a printed circuit board provided to face the light receiving surface; and a plurality of electronic components provided on a light receiving surface side of the printed circuit board and including a first light receiving element configured to detect visible light. The first light receiving element is disposed at a first position of the printed circuit board exposed to the visible light transmitted through the first region. The number of mounted electronic components disposed at the first position is smaller than the number of mounted electronic components disposed at a second position of the printed circuit board other than the first position.

An optical module comprising: an optical waveguide transports light, the optical waveguide including a first mirror which reflects first light; an adhesive sheet formed over the optical waveguide, the adhesive sheet including a first gap above the first mirror; a first light-transmissive layer formed in the first gap; a lens sheet arranged over the adhesive sheet, the lens sheet including a first lens which is formed above the first light-transmissive layer; and a light-emitting device formed above the lens sheet, the light-emitting device including a light-emitting portion which emits the first light to the first lens.

The present invention relates to an ornamental connector for connecting an ornamental item to and elongate flexible member such as a strap, belt or chain. The ornamental connector includes abase including an aperture a recess for receiving the elongate flexible member, as well as an engaging arrangement for removably connecting an ornamental item. The ornamental connector can further include a locking arrangement for locking the ornamental connector to the base. The ornamental connector can further include a holding arrangement for preventing sliding movement of the ornamental connector along the elongate flexible member.

A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.

An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.