A system for measuring a radiant exposure of electromagnetic radiation includes an accumulation detection module having a detector and configured to continuously monitor an electromagnetic radiation received by the detector; and an adaptive circuit configured to periodically interrogate the accumulation detection module; adjust a frequency of interrogation of the accumulation detection module based on an intensity of the electromagnetic radiation received by the detector; and autonomously transmit information related to an amount of the electromagnetic radiation received by the detector to a remote device.

Imaging systems may include tunable polarization filters. A tunable polarization filter may be integrated directly into an image sensor package. For example, the tunable polarization filter may serve as cover glass for the image sensor package. Tunable polarization package glass may be incorporated into image sensor packages that have air gaps between the image sensor and the cover glass or that have transparent adhesive between the image sensor and the cover glass. The tunable polarization layer may be controlled at a global level, at a sub-array level, or at a pixel level. In some cases, the tunable polarization layer may be a tunable polarization filter. In this example, the direction of the polarization filter is tuned. In other cases, the tunable polarization layer may be a tunable polarization rotator. In this example, the tunable polarization layer selectively rotates the polarization of light that passes through the tunable polarization layer.

The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.

A sensor (2) for determining solar altitude information includes at least one diode (24) for measuring sun intensity. A computation module (20) has interfaces (72, 74) at its input side for time- and location-based data for determining the current sun position from said location-based data, said time-based data and sun intensity measured and for providing a sun output signal on an output interface (80).

A mobile terminal including a display panel, a light sensor, and a first polarizing component. The display panel is between the first polarizing component and the light sensor. The ambient light having passed through the first polarizing component is linear polarized light. The light sensor includes N first regions and M second regions, the total area of the N first regions is equal to that of the M second regions. Each of the first regions includes a second polarizing component and K photodetectors. The second polarizing component is located above the K photodetectors. Each of the second regions includes a third polarizing component and L photodetectors. The third polarizing component is located above the L photodetectors. The polarization direction of the second polarizing component is parallel to that of the first polarizing component. The polarization direction of the second polarizing component is perpendicular to that of the third polarizing component.

An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.

Various embodiments related to an electronic device and a method for controlling sensitivity of a sensor on the basis of window attributes are described. According to an embodiment, an electronic device may include: a housing; a window cover housed in the housing, in which an attribute of at least a partial area may be changed via an electrical control on the basis of at least one attribute; at least one sensor disposed below at least the partial area; and at least one processor, wherein the at least one processor is configured to identify control information related to an operation of changing the attribute of at least the partial area on the basis of the at least one attribute, to determine a sensitivity related to the at least one sensor corresponding to the at least one attribute at least on the basis of the control information, and to acquire peripheral information of the exterior of the electronic device by using the at least one sensor, at least on the basis of the determined sensitivity.

The invention features devices and methods for collecting and measuring light from external light sources. In general, the devices of the invention feature a light diffusing element, e.g., as a component of a light collector, connected by a light conducting conduit, e.g., a fiber optic cable, to a light measuring device, e.g., a spectrometer. This light diffusing element allows, e.g., for substantially uniform light diffusion across its surface and thus accurate measurements, while permitting the total footprint of the device to remain relatively small and portable. This light diffusing element also allows flexibility in scaling of the device to permit use in a wide range of applications.

A superconductor device according to some embodiments comprises a superconductor stack, which includes a superconductor layer and a silicon cap layer over the superconductor layer, the cap layer including amorphous silicon. The superconductor device further comprises a metal contact over a portion of the silicon cap layer and electrically-coupled to the superconductor layer. The metal contact comprises a core including a first metal, and an outer layer around the core that includes a second metal. The portion of the silicon cap layer is converted from silicon to a conductive compound including the second metal to provide low-resistance electrical coupling between the superconductor layer and the metal contact. The superconductor device further comprises a waveguide, and the first portion of the cap layer under the metal contact is at a sufficient lateral distance from the waveguide to prevent optical coupling between the metal contact and the waveguide.

An optoelectronic module including a light emitter to generate light to be emitted from the module, a plurality of spatially distributed light sensitive elements arranged to detect light from the emitter that is reflected by an object outside the module, and one or more dedicated spurious-reflection detection pixels.