An illumination device comprises one or more emitter modules having improved thermal and electrical characteristics. According to one embodiment, each emitter module comprises a plurality of light emitting diodes (LEDs) configured for producing illumination for the illumination device, one or more photodetectors configured for detecting the illumination produced by the plurality of LEDs, a substrate upon which the plurality of LEDs and the one or more photodetectors are mounted, wherein the substrate is configured to provide a relatively high thermal impedance in the lateral direction, and a relatively low thermal impedance in the vertical direction, and a primary optics structure coupled to the substrate for encapsulating the plurality of LEDs and the one or more photodetectors within the primary optics structure.

An optical measurement apparatus includes a thermal insulation housing, a first light-transmissive plate, a second light-transmissive plate, a heat-conductive layer, a cooling source and a photosensor. The thermal insulation housing, the first light-transmissive plate and the second light-transmissive plate define a chamber. The heat-conductive layer is disposed in the chamber, the cooling source is coupled to the heat-conductive layer, and the photosensor is disposed outside the chamber and on one side of the second light-transmissive plate facing away from the first light-transmissive plate.

A guidance system for a missile performs a method for guiding the missile. The guidance system includes a target detector and a window between a target and the target detector. The window including a first pane, a second pane and a channel between the first pane from the second pane. Radiation from the target passes through the window including the first pane, the second pane and the channel to be detected at the target detector. A gas is transported through the channel between the first pane and the second pane to control a temperature of the window.

A method can be applied to a terminal provided with a light sensor to determine a screen light intensity value. The method can include: obtaining a screen light intensity detection value detected by the light sensor, and obtaining a current environment temperature when the light sensor detects the screen light intensity detection value; determining a light intensity calibration coefficient corresponding to a value of the current environment temperature based on a corresponding relationship between a temperature and the light intensity calibration coefficient; and determining the screen light intensity value of the terminal based on the determined light intensity calibration coefficient and the screen light intensity detection value.

A portable electronic device includes a housing, a front cover defining a front side of the portable electronic device, a display stack below the front cover and comprising a plurality of display layers configured to produce a graphical output in a display region of the display stack, the graphical output visible through the front cover, and a light sensor module positioned at least partially within the housing and coupled to the display stack in the display region. The light sensor module may be configured to receive ambient light passing through the front cover and through the plurality of display layers and, while a blanking interval is positioned over the light sensor module, produce an output corresponding to the received ambient light, the portable electronic device configured to determine an ambient light value based at least in part on the output from the light sensor module.

A heat transfer device and method are disclosed. The device includes a working region (i.e., working substance) made from a first superconducting material having a superconducting state and a normal state when magnetized. The first superconducting material has a first energy gap while in the superconducting state. A substrate (i.e., cold reservoir) is connected to the working region at a first tunnel junction. The substrate may be a metallic substrate. A heat sink (i.e., hot reservoir) is connected to the working region at a second tunnel junction. The heat sink is made from a second superconducting material having a second energy gap that is larger than the first energy gap. In a particular example, the heat transfer device includes a metallic substrate is made from Copper, a working region made from Tantalum, a heat sink made from Niobium, and the first and second tunnel junctions are made from Tantalum Oxide.

A sensor device has a metal sensor housing with a housing base coupled to a frame base of a metal optical frame. A device mounting plate is orthogonal to the frame base. A securing device secures an optical communication device to the device mounting plate. A barrel mounting channel has first and second sidewalls, each extending obliquely to the frame base and defining a linear translation pathway along the frame base for a metal lens barrel. A fastener secures the metal lens barrel to the first and second sidewalls. A glass lens is in contact with three protrusions extending outward from an inner annular surface of the lens barrel. The optical communication device is configured to be in optical communication with the lens and is secured in a particular position in a translation plane mutually defined by the device mounting plate and the optical communication device.

An illustrative optical measurement system includes a light source configured to emit light directed at a target. The system further includes a detector configured to detect arrival times for photons of the light after the light is scattered by the target. The system further includes a temperature sensor configured to output a temperature signal representative of a temperature of the light source. The system further includes an optical sensor configured to output a power signal representative of an optical power level of the light emitted by the light source. The system further includes a driver circuit configured to output, based on the temperature signal and the power signal, an input current for the light source.

A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.

A system including an optical system having at least one refractive or reflective element, the optical system configured to substantially receive electromagnetic radiation emanating from a source, the optical system being located within a Dewar, a support structure, support structure being mechanically disposed between the optical system and a surface of the Dewar, the support structure having substantially low thermal conductance, a cold source; the cold source being located within the Dewar, a thermal link, the thermal link being mechanically disposed between the optical system and the cold source, the thermal link being substantially flexible and having substantially high thermal conductance.