A portable electronic device includes a housing, a front cover defining a front side of the portable electronic device, a display stack below the front cover and comprising a plurality of display layers configured to produce a graphical output in a display region of the display stack, the graphical output visible through the front cover, and a light sensor module positioned at least partially within the housing and coupled to the display stack in the display region. The light sensor module may be configured to receive ambient light passing through the front cover and through the plurality of display layers and, while a blanking interval is positioned over the light sensor module, produce an output corresponding to the received ambient light, the portable electronic device configured to determine an ambient light value based at least in part on the output from the light sensor module.

Disclosed are methods and devices for calibration in the field of optical sensors, e.g. characterizing and calibrating an optical sensor chip. In order to address complexity of sensor data with high accuracy the optical sensor, e.g. an optical sensor is not provided as an already calibrated unit. Rather, sensor response data may be recorded in a defined or standardized environment, e.g. at a production line, and with high precision. This high standard sensor response data can be obtained on a per device basis and, thus, is referenced with an unambiguous chip identification number, chip ID. The sensor data is complemented with a dedicated calibration algorithm which can be tailor-made to fit the optical sensor or the optical sensor chip. In order to retrieve the sensor response data and the calibration algorithm both can be made available by means of the chip ID, for example.

An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

A photoelectric detection device, including: a vacuum sealed housing, wherein the vacuum sealed housing includes a mounting interface for mounting the photodetector array so as to form a sealed space; the photodetector array has a detection surface facing an outside of the vacuum sealed housing and configured to receive multi-channel measurement optical signals; a photoelectric conversion and synchronous acquisition circuit and a high speed transmission circuit board are placed in the vacuum sealed housing, and the photodetector array is connected to the photoelectric conversion and synchronous acquisition circuit through a signal pin of the photodetector array; the photoelectric conversion and synchronous acquisition circuit is configured to synchronously convert the multi-channel measurement optical signals obtained by the photodetector array into multi-channel digital signals; and the high speed transmission circuit board is configured to perform a serial encoding processing on the converted multi-channel digital signals.

The present disclosure relates to an in-line compact measuring device, for example for optical measurements, comprising a housing having a process connection intended to be connected to a process vessel connection complementary to the process connection; at least one sensor assembly arranged in the housing; and a measuring circuit that is connected to the sensor assembly and is arranged in the housing. The in-line compact measuring device has at least one fluid line in thermally conductive contact with at least one housing wall of the housing, which fluid line can be connected to a cooling fluid supply arranged outside the housing.

A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

A thermal and environmental noise suppressing interface circuit which is configured to operate cold and is configured to perform biasing with suppression of noise currents from room temperature noise voltages and dc coupled rf readout of a superconducting device under test with a single coaxial cable or equivalent conductor pair. The circuit is configured to suppress the propagation of thermal and environmental noises to/from sensors operating at a different temperature from its operating and control equipment while maintaining a single input-output channel, and provides for the placement of a local grounding impedance on an intercept board.

An optical refrigerator for cooling an infrared detector or sensor, that includes a laser radiation source, a cooling crystal for receiving laser radiation from the source and to be cooled, an element to be cooled, and a thermal link in heat exchange between the crystal and the element to be cooled, in order to transfer frigories from the crystal to the element to be cooled. The thermal link comprises two plates having respective first ends in heat exchange with two distinct surfaces of the crystal, respectively, the two plates having second ends in heat exchange with the element to be cooled.

Embodiments of the present disclosure are directed toward techniques and configurations for a photonic apparatus with a photodetector with bias control to provide substantially constant responsivity. The apparatus includes a first photodetector, to receive an optical input and provide a corresponding electrical output; a second photodetector coupled with the first photodetector, wherein the second photodetector is free from receipt of the optical input; and circuitry coupled with the first and second photodetectors, to generate a bias voltage, based at least in part on a dark current generated by the second photodetector in an absence of the optical input, and provide the generated bias voltage to the first photodetector. The first photodetector is to provide a substantially constant ratio of the electrical output to optical input in response to the provision of the generated bias voltage. Additional embodiments may be described and claimed.

In some embodiments, a method and apparatus, as well as an article, may operate to determine downhole properties based on detected optical signals. An optical detection apparatus can include an optical detector including a superconducting nanowire single photon detector (SNSPD) for detecting light received at an input section of fiber optic cable. The optical detection apparatus can further include a cryogenic cooler configured to maintain the temperature of a light-sensitive region of the SNSPD within a superconducting temperature range of the SNSPD. Downhole properties are measured based on detected optical signals received at the optical detection apparatus. Additional apparatus, systems, and methods are disclosed.