An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.

The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.

An optical sensing module has a light source and an optical sensing integrated circuit device. The optical sensing integrated circuit device has an optical sensor and a grating. The optical sensor and the light source are arranged along a first direction. The grating is formed over the optical sensor and has multiple parallel wires. The multiple wires are perpendicular to the first direction.

A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.

Various embodiments of a light detection device and a method of using such device are disclosed. In one or more embodiments, the light detection device can include a housing including a top surface and a bottom surface, where the housing extends along a housing axis between the top surface and the bottom surface; and a support member connected to the housing and adapted to be selectively moved from a closed position to an open position. The support member is further adapted to maintain the light detection device in an upright position when the bottom surface and the support member are in contact with a working surface and the support member is in the open position.

A microchip has a rear face attached to a front mounting face of a support plate. An encapsulation cover for the microchip is mounted to the support plate. The encapsulation cover includes a front wall, a peripheral wall extending from the front wall and an inside partition extending from the front wall and between opposite sides of the peripheral wall. The inside partition passes locally above the microchip to delimit two cavities. A bonding material is interposed between encapsulation cover and the support plate and microchip. An end part of the inside partition of the cover, adjacent to the front face of the microchip, include an accumulation and containment recess that is configured to at least partly receive the bonding material.

A cylindrical package includes a cylindrical housing; a pedestal at a bottom of a cylindrical space surrounded by the cylindrical housing; an optical splitter in the cylindrical space and over the pedestal; a first photodetector in the cylindrical space and over the pedestal, wherein the first photodetector is configured to be optically coupled to the optical splitter; and a second photodetector in the cylindrical space and over the pedestal, wherein the second photodetector is configured to be optically coupled to the optical splitter.

A signal guide for a sensor device is disclosed herein. The signal guide can include a base having a first proximal aperture, where the first proximal aperture has a first cross-sectional profile, where the first proximal aperture is configured to be disposed proximate to a first transceiver element of the sensor device. The signal guide can also include a body disposed adjacent to the base, wherein the body comprises a first main channel that adjoins the first proximal aperture. The signal guide can further include a distal end disposed adjacent to the body opposite the base, where the distal end includes a first distal aperture that adjoins the first main channel, where the first distal aperture has a second cross-sectional profile, where the first distal aperture is configured to be disposed proximate to an ambient environment.

An optical sensor package includes a substrate, a wall disposed upon the substrate, and a cover layer disposed on the wall. The substrate, the wall, and the cover layer at least partially define a cavity. The optical sensor package also includes a sensor disposed upon the substrate within the cavity. A cloaking layer is disposed upon to the cover layer. The cloaking layer is transmissive to at least a portion of a light spectrum and is configured to at least partially conceal the sensor. In some examples, the optical sensor package also includes a light source disposed upon the substrate within another cavity at least partially defined by the wall and the cover layer.

A positioning device (10) for pivoting at least one relevant component (20) for a motor vehicle headlight about a first and a second axis (X, Y), comprising a holding element (100) for a relevant component (20), said holding element comprising a first sliding surface (110), which is designed as part of a spherical surface, a support frame (200), which comprises a second sliding surface (210), which is designed as part of a spherical surface, the holding element (100) being supported in the support frame (200) by means of a bearing apparatus such that the first sliding surface (110) of the holding element (100) can be displaced along the second sliding surface (210) of the support frame (200) about the first and second axis (X, Y), an adjusting apparatus (300), which has a positioning component (301) and a first moving apparatus (310) and a second moving apparatus (320), which are each arranged on the positioning component (301), which is mechanically connected to the holding element (100) by means of a connecting element (400), wherein the connecting element (400) passes through the support frame (200) via an opening (220), wherein the connecting element (400) is designed to transmit a movement of the positioning component (301) to the holding element (100), and wherein the connecting element is designed as a screw means, wherein the positioning component can be brought into a released state and a fastened state, wherein the positioning component can be displaced when in the released state, and the positioning component (301) can be clamped immovably against the support frame when in the fastened state by tightening the screw means.