A method for inspecting a nozzle includes: measuring a temperature of the nozzle; comparing the temperature of the nozzle with a reference temperature; and determining whether or not the nozzle is clogged based on the temperature of the nozzle.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

A configuration that enables easy implementation of wiping disinfection for a gripping handle for which an operating means is provided. The gripping handle, which is grasped by an operator, is formed as part of the lower case including part of the housing. The gripping handle is provided with an operating surface portion that the operator touches when initiating the reading process. There is a site on the inner side of the gripping handle, wherein the site is opposed to the operating surface portion. At this site on the inner surface side, a detector is provided to detect the state in which the operating surface portion is touched.

A configuration that enables easy implementation of wiping disinfection for a gripping handle for which an operating means is provided. The gripping handle, which is grasped by an operator, is formed as part of the lower case including part of the housing. The gripping handle is provided with an operating surface portion that the operator touches when initiating the reading process. There is a site on the inner side of the gripping handle, wherein the site is opposed to the operating surface portion. At this site on the inner surface side, a detector is provided to detect the state in which the operating surface portion is touched.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

A heater with an optical sensor for over-temperature protection. The heater includes a heating element and a sensor assembly including a coupler and an optical sensor. Wavelengths emanating from the heating element passes directly through the coupler to the optical sensor. The optical sensor provides an over-temperature feedback signal for limiting power to the heating element to avoid an over-temperature condition for the heating element.

The present invention relates to a detector assembly and method incorporating angled sensors, such that the area of coverage and detection sensitivity are maximized. The present invention finds particular applicability in the detection of sparks and the like in the presence of combustible gases, dusts, and the like via optical, infrared (IR), and ultraviolet (UV) methodologies and the like.

A method of monitoring the surface temperatures of wafers in real time by measuring them according to the present invention monitors the surface temperatures of a polishing pad in real time by measuring them, and can thus actively deal with irregular variations in temperature on the surface of the wafer attributable to chemical reaction and friction in the process of cleaning the wafer. A sensor for measuring the surface temperatures of a wafer according to the present invention can be used in an environment in which there is fume generated from a cleaning solution, and is responsible for temperatures at respective points of an infrared camera and allows the correction of temperatures in respective sections.

Disclosed is a pyranometer with a housing, a sensor in the housing, an inner window and an outer dome-shaped window both overlying the sensor. An air inlet duct and an air outlet duct extend in the housing and end in a space confined by the outer window for passing air through the space, from the inlet duct to the outlet duct. The housing is substantially closed such that no outside air flows are allowed into the housing and includes a ventilator, the inlet duct being in fluid communication with a high pressure side of the ventilator, the outlet duct being in fluid communication with a low pressure side of the ventilator. The air blown into the space below the outer window is heated by the ventilator power and optionally by and added electrical heater.