A thermo-mechanical resonating microbolometer has a graphene absorber suspended above a metallic silicon substrate to form a mechanical resonator. Microelectronic circuitry electrically connected to the graphene resonator and the metallic silicon substrate drives electronically the motion of the graphene absorber. Shifts in the mechanical resonant frequency of the graphene layer due to the absorption of incident radiation is measured electronically or using optical interferometry. A bolometer sensor array may be fabricated using such graphene microbolometer elements.

A method of imaging infrared light is provided which comprises: exciting ultrasonic waves in a metal pillar (e.g., Cu pillar); measuring the Time-of-Flight (ToF) of the ultrasonic wave in the waveguide; whereas the ToF is a function of incident Infrared light energy on the waveguide, and reporting the infrared light energy to capture an image. An apparatus of imaging infrared light is provided which comprises: a transducer; a waveguide coupled with the transducer; and a pixel electronic circuit coupled to the transducer, wherein the transducer includes one or more of: PZT, LiNb, AlN, or GaN.

A method is provided. The method comprises: transmitting a periodic chirp to at least two pixels of a MEMS sensor array; determining a resonant frequency of each MEMS resonant sensor receiving the periodic chirp; determining the change in resonant frequency of each MEMS resonant sensor receiving the periodic chirp; determining a power level incident upon each pixel receiving the periodic chirp. In one embodiment, the method further comprises calibrating the MEMS sensor array. In another embodiment, calibrating comprises generating a reference resonant frequency for each MEMS resonant sensor. In a further embodiment, determining the power level comprises determining a difference between the determined resonant frequency and the reference resonant frequency.

Spherical detector array devices are provided, which are implemented using passive detector structures for thermal imaging applications. Passive detector structures are configured with unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in the thermal IR portion of the electromagnetic spectrum.

Spherical detector array devices are provided, which are implemented using passive detector structures for thermal imaging applications. Passive detector structures are configured with unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in the thermal IR portion of the electromagnetic spectrum.

A piezoelectric field disturbance sensing system includes a piezoelectric element for generating mechanical energy when electrically excited and for generating electrical energy when mechanically deformed. A mass is coupled to the piezoelectric element. A signal generator is coupled to the piezoelectric element for applying electrical energy thereto for a fixed period of time. As a result, the piezoelectric element undergoes mechanical deformation and the mass reverberates in response to such mechanical deformation. A charge monitor is coupled to the piezoelectric element for monitoring electrical energy generated thereby during a time period subsequent to the fixed period of time.

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum.

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum.

A thermal microring optical sensor is configured such that a portion of the optical resonator and its associated waveguide are encased within a cladding structure to minimize scattering losses along the waveguide and also provide improved evanescent coupling efficiency between the waveguide and the resonator. Functioning as a thermal sensor, incoming radiation modifies the temperature of the resonator, which changes its resonant frequency and, as a result, the percentage of light that it evanescently couples from the waveguide. The cladding structure also functions as a mechanical support for the resonator disk, eliminating the need for a pedestal to suspend the disk above the support substrate. Thermally-induced buckling of the optical waveguide is also reduced by encasing the susceptible portion of the waveguiding within the cladding structure.

A thermal microring optical sensor is configured such that a portion of the optical resonator and its associated waveguide are encased within a cladding structure to minimize scattering losses along the waveguide and also provide improved evanescent coupling efficiency between the waveguide and the resonator. Functioning as a thermal sensor, incoming radiation modifies the temperature of the resonator, which changes its resonant frequency and, as a result, the percentage of light that it evanescently couples from the waveguide. The cladding structure also functions as a mechanical support for the resonator disk, eliminating the need for a pedestal to suspend the disk above the support substrate. Thermally-induced buckling of the optical waveguide is also reduced by encasing the susceptible portion of the waveguiding within the cladding structure.