A management server, which is a temperature-monitoring device, monitors the temperature of a battery that is removably attached to an apparatus. The management server includes: a server-side acquisition unit that acquires the temperature of the battery when the battery is not in use after discharging electricity to the apparatus; and a determination process unit that performs a temperature determination process for determining whether or not the temperature while the battery is not in use is in a predetermined temperature range. The determination process unit excludes, from items on which the temperature determination process is to be performed, the temperature during an initial period from when the non-use of the battery has started to when a predetermined condition is satisfied.

A method and apparatus may include activating, by a network node, power of a global-positioning-system receiver or power of an active antenna of the global-positioning-system receiver. The apparatus uses the global-positioning-system receiver to perform synchronization of the apparatus. The method may include receiving at least one measurement, wherein the at least one measurement comprises real-time, predictive, or historic data. The method may also include determining a holdover duration based on the at least one measurement. The holdover duration corresponds to a length of time where the power of the global-positioning-system receiver or the power of the active antenna is to be turned off. The method may also include deactivating the power of the global-positioning-system receiver or the power of the active antenna for the holdover duration.

A wireless temperature-measurement system comprising (a) one or more temperature probes each including one or more energy-storage capacitors which supply the electrical energy for operation of the probe(s) and (b) a probe-charging station having circuitry configured to supply electric charge to the energy-storage capacitors prior to the temperature probes being positioned to measure temperature.

A temperature determination device includes: a temperature sensor; a mount; and at least one connection sensor. The temperature sensor is connectable to a process device via the mount. The temperature sensor acquires temperature data. The at least one connection sensor acquires connection status data relating to connection of the temperature sensor to the process device. The temperature determination device utilizes the temperature data and the connection status data with respect to a determination of a temperature of the process device.

A temperature determination device includes: a temperature sensor; a mount; and at least one connection sensor. The temperature sensor is connectable to a process device via the mount. The temperature sensor acquires temperature data. The at least one connection sensor acquires connection status data relating to connection of the temperature sensor to the process device. The temperature determination device utilizes the temperature data and the connection status data with respect to a determination of a temperature of the process device.

In some embodiments, apparatuses and methods are provided herein useful to monitoring temperature or movement of merchandise during and after transport of the merchandise. Some of these embodiments include systems for monitoring the temperature of merchandise items comprising: a temperature sensor disposed at or near one or more merchandise items; a control circuit operatively coupled to the temperature sensor, the control circuit configured to: read temperature measurements from the temperature sensor at predetermined time intervals; generate and encode a barcode with data representing a first temperature measurement; and update and encode the barcode with data representing the first temperature measurement and one or more subsequent temperature measurements; and an interface operatively coupled to the control circuit and configured to display the updated barcode.

The present disclosure relates to a thermocouple wafer calibration system including: a main body portion composed of a chamber forming a sealed space, and a support installed a lower edge of the chamber and supporting the chamber to be spaced apart from the ground; a thermocouple wafer composed of a plate installed to be horizontal inside the sealed space of the chamber, and a first thermocouple unit attached to a upper surface of the plate so as to form a plurality of first measurement contact points; a calibration portion provided with a second thermocouple unit penetrating the chamber in a space where the chamber spaced from the ground, then partially accommodated inside the sealed space, and calibrated to form a plurality of second measurement contact points in contact with a lower surface of the plate at a position corresponding to each of the first measurement contact points; a temperature measurement portion partially accommodated inside the sealed space of the chamber and measuring a temperature of the sealed space; a heating portion accommodated inside the sealed space of the chamber, allowing thermogenesis and being in thermal contact with the second thermocouple unit directly; a measurement portion connected to the first and second thermocouple units respectively, and measuring each thermal electromotive force for the first and second measurement contact points occurring when the first and second thermocouple units are in contact indirectly at both sides on the basis of the plate; and a temperature control portion calculating each temperature value for the first and second measurement contact points depending on values measured from the measurement portion, and, after comparing and analyzing the calculated temperature values and temperature values measured from the temperature measurement portion, allowing adjusting the temperature of the sealed space by controlling the heating portion based on the analysis result.

The present disclosure relates to a thermocouple wafer calibration system including: a main body portion composed of a chamber forming a sealed space, and a support installed a lower edge of the chamber and supporting the chamber to be spaced apart from the ground; a thermocouple wafer composed of a plate installed to be horizontal inside the sealed space of the chamber, and a first thermocouple unit attached to a upper surface of the plate so as to form a plurality of first measurement contact points; a calibration portion provided with a second thermocouple unit penetrating the chamber in a space where the chamber spaced from the ground, then partially accommodated inside the sealed space, and calibrated to form a plurality of second measurement contact points in contact with a lower surface of the plate at a position corresponding to each of the first measurement contact points; a temperature measurement portion partially accommodated inside the sealed space of the chamber and measuring a temperature of the sealed space; a heating portion accommodated inside the sealed space of the chamber, allowing thermogenesis and being in thermal contact with the second thermocouple unit directly; a measurement portion connected to the first and second thermocouple units respectively, and measuring each thermal electromotive force for the first and second measurement contact points occurring when the first and second thermocouple units are in contact indirectly at both sides on the basis of the plate; and a temperature control portion calculating each temperature value for the first and second measurement contact points depending on values measured from the measurement portion, and, after comparing and analyzing the calculated temperature values and temperature values measured from the temperature measurement portion, allowing adjusting the temperature of the sealed space by controlling the heating portion based on the analysis result.

Methods, systems, and devices for temperature exception tracking in a temperature log for a memory system are described. The memory system may store the temperature log separate from data to which the temperature information corresponds. For example, a memory device may store data in a relatively higher-level cell and the corresponding temperature information in a relatively lower-level cell. To perform a write operation, the memory system may determine a current temperature at which the data is being written or was written to a partition of a memory device and may indicate in the temperature log if the current temperature is entering a temperature range that is outside a threshold temperature (e.g., a nominal temperature). To perform a read operation, the memory system may determine if the data to read was written to the memory device outside the threshold temperature to determine whether to perform temperature compensation for the read operation.

Methods, systems, and devices for temperature exception tracking in a temperature log for a memory system are described. The memory system may store the temperature log separate from data to which the temperature information corresponds. For example, a memory device may store data in a relatively higher-level cell and the corresponding temperature information in a relatively lower-level cell. To perform a write operation, the memory system may determine a current temperature at which the data is being written or was written to a partition of a memory device and may indicate in the temperature log if the current temperature is entering a temperature range that is outside a threshold temperature (e.g., a nominal temperature). To perform a read operation, the memory system may determine if the data to read was written to the memory device outside the threshold temperature to determine whether to perform temperature compensation for the read operation.