A dual-purpose temperature measuring device includes a device main body, a signal control module, a first temperature measurement module, a movable structure, a second temperature measurement module and an information display module. The signal control module is disposed inside the device main body. The first temperature measurement module is disposed inside the device main body and electrically connected to the signal control module. The movable structure is movably disposed on the device main body. The second temperature measurement module is disposed inside the movable structure and electrically connected to the signal control module. The information display module is disposed on the device main body and electrically connected to the signal control module. Therefore, the user can selectively use one of the first temperature measurement module and the second temperature measurement module to measure the temperature of the same predetermined object or different predetermined objects according to different requirements.

The temperature measurement device provided by the present disclosure includes: a thermometer comprising: a casing, a first power module, a temperature sensing module, a first communication module, and a first antenna module located within the casing; a booster comprising a housing, a second power module, a second communication module, and a second antenna module located within the housing; wherein, the thermometer is connected to the booster by communication, and the booster amplifies signals of the thermometer and charges the thermometer.

The temperature measurement device provided by the present disclosure includes: a thermometer comprising: a casing, a first power module, a temperature sensing module, a first communication module, and a first antenna module located within the casing; a booster comprising a housing, a second power module, a second communication module, and a second antenna module located within the housing; wherein, the thermometer is connected to the booster by communication, and the booster amplifies signals of the thermometer and charges the thermometer.

The present disclosure relates to a thermocouple wafer calibration system including: a main body portion composed of a chamber forming a sealed space, and a support installed a lower edge of the chamber and supporting the chamber to be spaced apart from the ground; a thermocouple wafer composed of a plate installed to be horizontal inside the sealed space of the chamber, and a first thermocouple unit attached to a upper surface of the plate so as to form a plurality of first measurement contact points; a calibration portion provided with a second thermocouple unit penetrating the chamber in a space where the chamber spaced from the ground, then partially accommodated inside the sealed space, and calibrated to form a plurality of second measurement contact points in contact with a lower surface of the plate at a position corresponding to each of the first measurement contact points; a temperature measurement portion partially accommodated inside the sealed space of the chamber and measuring a temperature of the sealed space; a heating portion accommodated inside the sealed space of the chamber, allowing thermogenesis and being in thermal contact with the second thermocouple unit directly; a measurement portion connected to the first and second thermocouple units respectively, and measuring each thermal electromotive force for the first and second measurement contact points occurring when the first and second thermocouple units are in contact indirectly at both sides on the basis of the plate; and a temperature control portion calculating each temperature value for the first and second measurement contact points depending on values measured from the measurement portion, and, after comparing and analyzing the calculated temperature values and temperature values measured from the temperature measurement portion, allowing adjusting the temperature of the sealed space by controlling the heating portion based on the analysis result.

The present disclosure relates to a thermocouple wafer calibration system including: a main body portion composed of a chamber forming a sealed space, and a support installed a lower edge of the chamber and supporting the chamber to be spaced apart from the ground; a thermocouple wafer composed of a plate installed to be horizontal inside the sealed space of the chamber, and a first thermocouple unit attached to a upper surface of the plate so as to form a plurality of first measurement contact points; a calibration portion provided with a second thermocouple unit penetrating the chamber in a space where the chamber spaced from the ground, then partially accommodated inside the sealed space, and calibrated to form a plurality of second measurement contact points in contact with a lower surface of the plate at a position corresponding to each of the first measurement contact points; a temperature measurement portion partially accommodated inside the sealed space of the chamber and measuring a temperature of the sealed space; a heating portion accommodated inside the sealed space of the chamber, allowing thermogenesis and being in thermal contact with the second thermocouple unit directly; a measurement portion connected to the first and second thermocouple units respectively, and measuring each thermal electromotive force for the first and second measurement contact points occurring when the first and second thermocouple units are in contact indirectly at both sides on the basis of the plate; and a temperature control portion calculating each temperature value for the first and second measurement contact points depending on values measured from the measurement portion, and, after comparing and analyzing the calculated temperature values and temperature values measured from the temperature measurement portion, allowing adjusting the temperature of the sealed space by controlling the heating portion based on the analysis result.

Various embodiments of the invention provide systems and methods for accurately determining temperatures in harsh environments such as, for example, in a steam autoclave chamber during a sterilization cycle. In certain embodiments, temperature data accuracy is increased by utilizing an IC-based temperature logging device that monitors and compensates for inherent thermal delays that would otherwise cause a discrepancy between temperature as measured by a temperature sensor and the actual ambient gas temperature. By properly correcting for the thermal delay, the data accuracy of the measured gas temperature is thus greatly enhanced.

A soil temperature probe that can withstand the extremely high temperatures produced by wildfires is provided. Also provided are methods for using the probe to measure the temperature profile in the soil when a fire passes over the soil or when a fire burns in place over the soil. The device is designed for use during wildfires, prescribed fires, and/or slash pile burning to measure high temperatures in incremental temperature measurements at multiple precise depths to generate a soil temperature profile.

Embodiments for assessing energy in a thermal energy fluid transfer system in a cloud computing environment by a processor. Behavior of the thermal energy fluid transfer system, associated with a heating service, a cooling service, or a combination thereof, may be learned according to collected data to identify one or more energy usage events. An energy usage assessment operation may be performed using temperature signal disambiguation operations, with data collected over a selected time period by one or more non-intrusive Internet of Things (IoT) sensors located at one or more selected positions in the thermal energy fluid transfer system, to learn the system performance indicators, and when coupled with ingested expected policy behavior, identify one or more energy usage waste events according to the learned behavior in real time.

A method and apparatus may include activating, by a network node, power of a global-positioning-system receiver or power of an active antenna of the global-positioning-system receiver. The apparatus uses the global-positioning-system receiver to perform synchronization of the apparatus. The method may include receiving at least one measurement, wherein the at least one measurement includes real-time, predictive, or historic data. The method may also include determining a holdover duration based on the at least one measurement. The holdover duration corresponds to a length of time where the power of the global-positioning-system receiver or the power of the active antenna is to be turned off. The method may also include deactivating the power of the global-positioning-system receiver or the power of the active antenna for the holdover duration.

An actively-powered temperature data logger patch with wireless data communication includes a first substrate layer, a second substrate layer, a non-adhesive release layer, and an electronics inlay disposed between the first and second substrate layers. The electronics inlay includes a sealed, flexible battery, and a flexible circuit having a temperature sensor. An outer face of the non-adhesive release layer is has release properties. A replaceable adhesive includes a carrier substrate, a structural adhesive coated on a first face and attached to the outer face of the non-adhesive release layer, and a skin-contact approved adhesive coated on a second opposite face. In another example, an auxiliary sleeve having an exterior surface with an adhesive configured to be removably applied to a subject, may partially enclose the temperature data logger patch in an internal compartment.