G01K1/18

Sensor Arrangement Having a Temperature Sensor Element and Method For Its Production
20210381909 · 2021-12-09 · ·

A sensor arrangement includes a temperature sensor element, a connection device electrically connecting the sensor arrangement to an external device, a plurality of electrical lines electrically connecting the temperature sensor element to the connection device, a carrier holding the temperature sensor element and the electrical lines, and an encasing enclosing the temperature sensor element. The carrier has a measuring portion. The electrical lines are arranged directly on the carrier or on a separate line carrier arranged on the carrier. The electrical lines have a cross-sectional area equal to or less than 0.08 mm.sup.2.

MEASUREMENT DEVICE FOR MEASURING A TEMPERATURE
20220205848 · 2022-06-30 ·

A measurement device for measuring a temperature prevailing inside a container is disclosed. The measurement device comprises: a process connector including a connector body and a fastener configured to be mounted onto a corresponding counterpart surrounding an opening of the container; a measurement unit secured in an opening of the process connector such that a front surface of the measurement unit is facing into the container when the measurement device is mounted on the container; the measurement unit including or consisting of: a heat pipe and a temperature sensor; the heat pipe having two thermally conductive interfaces including a front interface exposable to the temperature to be measured and a second interface in thermal contact with the temperature sensor; and a thermal insulation surrounding the heat pipe and the temperature sensor.

Fast Response Temperature Sensors

Provided herein is a differential temperature sensor which utilizes multiple temperature sensors to quickly and accurately calculate ambient fluid temperature with a reduced response time. The provided systems and methods utilize a first fluid temperature sensor and a second probe temperature sensor to account for the thermal impact of the device on the ambient fluid temperature and the effect of heat within the device, or temperature difference between the probe and fluid temperature, on the first fluid temperature sensor measurement.

TEMPERATURE MONITORING APPARATUS AND BATTERY MODULE HAVING SAME

A temperature monitoring apparatus and a battery module having the temperature monitoring apparatus. The temperature monitoring apparatus comprises an isolation plate, a connecting aluminum bar, a flexible printed circuit board, and a temperature measuring assembly. A first mounting frame and a second mounting frame are provided on the isolation plate. The connecting aluminum bar is embedded in the first mounting frame. The flexible printed circuit board is laid on the surface of the isolation plate in a manner of partially overlapping with the second mounting frame. The temperature measuring assembly is provided on the part of the flexible printed circuit board where the flexible circuit board overlaps the second mounting frame.

Fast response temperature sensors

Provided herein is a differential temperature sensor which utilizes multiple temperature sensors to quickly and accurately calculate ambient fluid temperature with a reduced response time. The provided systems and methods utilize a first fluid temperature sensor and a second probe temperature sensor to account for the thermal impact of the device on the ambient fluid temperature and the effect of heat within the device, or temperature difference between the probe and fluid temperature, on the first fluid temperature sensor measurement.

Shielding and/or enhancement of temperature-sensing RFID devices

A temperature-sensing RFID device includes an RFID chip and an antenna electrically coupled thereto. The RFID chip includes a temperature sensor, while the antenna is adapted to receive energy from an RF field and produce a signal. A shielding structure and/or a thermally conductive or absorbent structure may be associated with the RFID chip. The shielding structure is oriented so as to be positioned between at least a portion of the RFID chip and an outside environment and configured to shield the temperature sensor from at least one environmental factor capable of affecting a temperature sensed by the temperature sensor of an article to which the RFID device is secured. The thermally conductive or absorbent structure is oriented so as to be positioned between at least a portion of the RFID chip and the article and configured to enhance thermal coupling between the temperature sensor and the article.

Temperature measuring device

Provided is a temperature measuring device which includes: a flexible printed circuit board with wiring; a thermistor element; a heat collecting plate; and a pressing member. The flexible printed circuit board is configured to be attached to a case that is fixed to an object to be measured, the thermistor element is electrically connected to the wiring, the heat collecting plate is disposed on a side opposite to the thermistor element via the flexible printed circuit board so as to be pressed against a temperature measuring point in the object to be measured, and the pressing member is made of a foam material and is configured to be compressed when the case is fixed to the object to be measured and to press the heat collecting plate against the object to be measured.

Fluid pump with a temperature sensor

A fluid pump with a housing, a fluid duct which is provided in the housing, a temperature sensor which is assigned to the fluid duct in order to detect the temperature of a medium situated therein, and a metal thermally conductive element.

TEMPERATURE MEASURING DEVICE

The present disclosure relates to a temperature measuring device for measuring a temperature of a pin-shaped electrical contact element, which includes a flexible circuit board with a first thermally conducting and electrically insulating substrate layer. The first substrate layer includes a contact surface that is configured to lie flat against a flange of the pin-shaped electrical contact element and an opening disposed in the contact surface. The pin-shaped electrical contact element is disposed at least partially in the opening. The flexible circuit board further includes a second thermally and electrically conducting layer that is disposed on a sensor surface opposite the contact surface of the first substrate layer and includes a sensor element connected to the sensor surface. The sensor element is configured to record a temperature of the pin-shaped electrical contact element when the pin-shaped electrical contact element is at least partially disposed in the opening.

SENSOR DEVICE AND VALVE ASSEMBLY WITH IMPROVED SEALING FEATURES
20230345657 · 2023-10-26 ·

A sensor device includes a housing, a circuit substrate, a sensing element, and a sleeve. The sensor device further includes an inner cavity and a channel located on different sides of the circuit substrate, respectively. The sleeve has a cylinder wall located on a periphery of the channel. A tail end of the cylinder wall in an axial direction of the channel is sealably connected to the circuit substrate. The housing is provided with a matching part including an accommodation part and a first peripheral wall part forming the accommodation part. The sleeve is at least partially accommodated in the accommodation part. The first peripheral wall part is sealably connected to the cylinder wall. The inner cavity is not communicated with the channel. The sealing performance between the inner cavity of the sensor device and the channel is good. Also provided is a valve assembly having the sensor device.