A contact temperature sensor is disclosed. In an embodiment a contact temperature sensor includes a contact body including a bottom wall configured to apply the contact temperature sensor on a test body and a carrier ceramics configured to thermally directly couple the contact temperature sensor to the test body, wherein the carrier ceramics is arranged on a side of the bottom wall facing the test body, and wherein the carrier ceramics includes a metallization on a side facing the test body. The contact temperature sensor further includes a temperature sensor element thermally coupled to the carrier ceramics.

The present disclosure relates to a method for manufacturing an apparatus for determining and/or monitoring temperature of a medium comprising method steps as follows: arranging a sensor element in a sensor head, producing a vacuum in an internal volume of the sensor head, introducing at least one fill material into at least a portion of the internal volume of the sensor head, and closing the sensor head. The present invention relates, moreover, to a correspondingly manufactured apparatus.

The present disclosure relates to a method for manufacturing an apparatus for determining and/or monitoring temperature of a medium comprising method steps as follows: arranging a sensor element in a sensor head, producing a vacuum in an internal volume of the sensor head, introducing at least one fill material into at least a portion of the internal volume of the sensor head, and closing the sensor head. The present invention relates, moreover, to a correspondingly manufactured apparatus.

A process fluid temperature estimation system includes a mounting assembly that is configured to mount the process fluid temperature estimation system to an external surface of a process fluid conduit. A sensor capsule has at least one temperature sensitive element disposed therein. Measurement circuitry is coupled to the sensor capsule and is configured to detect a characteristic of the at least one temperature sensitive element that varies with temperature and provide sensor capsule temperature information. A high temperature spacer has a known thermal conductivity and is configured to be interposed between the external surface of the process fluid conduit and the at least one temperature sensitive element. A controller is coupled to the measurement circuitry and is configured to obtain a reference temperature and employ a heat transfer calculation with the reference temperature, the sensor capsule temperature information and the known thermal conductivity of the high temperature spacer to generate an estimated process fluid temperature output.

An electrical connector including a housing having a terminal channel with a power terminal in the terminal channel. The electrical connector includes a temperature sensor assembly positioned in the chamber. The temperature sensor assembly includes a sealing pad holding the power terminal and a thermal shunt held by the sealing pad. A temperature sensor is coupled to the thermal shunt. The sealing pad is electrically insulative and has a terminal opening receiving the power terminal. The sealing pad is thermally coupled to the power terminal and thermally coupled to the thermal shunt. The thermal shunt has a thermal conductivity higher than a thermal conductivity of the sealing pad. The temperature sensor monitors the temperature of the power terminal through a thermal path defined by the sealing pad and the thermal shunt.

An internal temperature measuring apparatus includes: a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip including one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip; and a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package. An outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.

An internal temperature measuring apparatus includes: a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip including one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip; and a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package. An outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.

Packages for wireless temperature sensor nodes are described. These wireless temperature sensor nodes are suitable for sensing the temperature of remote objects, such as objects that are difficult to access. These packages are designed to enhance the sensor's ability to sense temperature. For example, these packages may be designed to provide a low thermal resistance path between the object and the temperature sensor, a high thermal resistance between an antenna of the wireless temperature sensor node and the object, and at least in some embodiments, immunity to vibrations. One such package includes means for providing a thermal conductive path from the temperature sensor to a thermally conductive support in contact with the object (for example with a thermal resistance less than 10 K/W), and means for thermally conductively decoupling the circuit board from the thermally conductive support (for example by at least 100 K/W).

Packages for wireless temperature sensor nodes are described. These wireless temperature sensor nodes are suitable for sensing the temperature of remote objects, such as objects that are difficult to access. These packages are designed to enhance the sensor's ability to sense temperature. For example, these packages may be designed to provide a low thermal resistance path between the object and the temperature sensor, a high thermal resistance between an antenna of the wireless temperature sensor node and the object, and at least in some embodiments, immunity to vibrations. One such package includes means for providing a thermal conductive path from the temperature sensor to a thermally conductive support in contact with the object (for example with a thermal resistance less than 10 K/W), and means for thermally conductively decoupling the circuit board from the thermally conductive support (for example by at least 100 K/W).

A temperature measurement facility for determining a medium temperature of a medium from first and second temperatures at a location immediately around a surface surrounding the medium includes a first and second sensors for determining the first and second temperatures, and a measured value processor connected to the first and second sensors by a first and second feed lines and which provides, cyclically over time, at a measurement interval the first and second temperatures as the measured value for determining the medium temperature, wherein an evaluator is configured to determine a rate of change, from a difference between the first and second temperatures, and depending on its value configured to provide a quality feature, and is further configured to transmit the quality feature, as an evaluation of a measurement accuracy of the medium temperature, together with the measured value of the medium temperature, to a higher-level system.