A temperature difference measuring apparatus includes: a bottomed tubular package in which a top face side is opened; a MEMS device disposed on an inner bottom face of the package, the MEMS device comprising at least one thermopile that measures a temperature difference, which is generated in the MEMS device by inflow heat through a bottom of the package; and a heat quantity increasing unit configured to increase a heat quantity flowing out from the MEMS device onto the top face side of the bottomed tubular package.

A temperature difference measuring apparatus includes: a bottomed tubular package in which a top face side is opened; a MEMS device disposed on an inner bottom face of the package, the MEMS device comprising at least one thermopile that measures a temperature difference, which is generated in the MEMS device by inflow heat through a bottom of the package; and a heat quantity increasing unit configured to increase a heat quantity flowing out from the MEMS device onto the top face side of the bottomed tubular package.

Techniques regarding determining and/or analyzing temperature distributions experienced by quantum computer devices during operation are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise a region component that can define a plurality of temperature regions from a quantum computing device layout. The computer executable component can also comprise a map component that can generate a map that characterizes a temperature distribution by determining at least one temperature achieved within the plurality of temperature regions during an operation of the quantum computing device layout.

Techniques regarding determining and/or analyzing temperature distributions experienced by quantum computer devices during operation are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise a region component that can define a plurality of temperature regions from a quantum computing device layout. The computer executable component can also comprise a map component that can generate a map that characterizes a temperature distribution by determining at least one temperature achieved within the plurality of temperature regions during an operation of the quantum computing device layout.

A method and an apparatus for testing thermal performance of a coating layer are provided. The method for testing thermal performance of a coating layer involves obtaining a first thermal gradient by exposing one side of a metal base test piece to heat and exposing another side of the metal base test piece to a cooling air; obtaining a second thermal gradient by exposing a coating layer side of a coating layer test piece to heat and exposing an opposite side to a cooling air; calculating an exterior temperature T.sub.f of a coating layer of the coating layer test piece and a temperature T.sub.e of a boundary side of the coating layer using the first thermal gradient; and calculating a temperature difference T.sub.Δ between the exterior temperature T.sub.f of the coating layer and the temperature T.sub.e of the boundary side of the coating layer.

An apparatus for determining thermograms of blood plasma or serum includes two or more reaction vessels that each comprise a temperature sensing coil and a heating coil that is coaxial with and exterior to, or interleaved with, the temperature sensing coil. The apparatus also includes a heat conductive body having two or more cavities formed therein for receiving the reaction vessels. A corresponding method includes activating the heating coils of the reaction vessels and collecting temperature data for the reaction vessels with the temperature sensing coils.

An apparatus for determining thermograms of blood plasma or serum includes two or more reaction vessels that each comprise a temperature sensing coil and a heating coil that is coaxial with and exterior to, or interleaved with, the temperature sensing coil. The apparatus also includes a heat conductive body having two or more cavities formed therein for receiving the reaction vessels. A corresponding method includes activating the heating coils of the reaction vessels and collecting temperature data for the reaction vessels with the temperature sensing coils.

An FC system disclosed herein may comprise a plurality of FC units, a cooler, and a controller. Each of the FC units may comprise a FC stack, a supply passage / a return passage / a circulating passage through which refrigerant passes, and first temperature sensor. The supply passage supplies the refrigerant from the cooler to the FC stack. The return passage returns the refrigerant to the cooler. The circulating passage is connected to the supply passage and the return passage. The first temperature sensor is configured to measure a temperature of the refrigerant in the supply passage at a position upstream of a merging point of the supply passage and the circulating passage. When measured values of the first temperature sensors of the plurality of the FC units do not match, the controller is configured to provide notification about malfunction of the first temperature sensor.

In variants, an automatically-identifiable temperature probe can include: a probe body, one or more sensors, a connector, and/or any other suitable components. In variants, the method for temperature determination can include: determining a set of electrical signals, determining a temperature probe type based on the set of electrical signals, determining a sensor resolution model based on the temperature probe type, and determining a set of final temperature estimates based on the set of electrical signals and the sensor resolution model.

In variants, an automatically-identifiable temperature probe can include: a probe body, one or more sensors, a connector, and/or any other suitable components. In variants, the method for temperature determination can include: determining a set of electrical signals, determining a temperature probe type based on the set of electrical signals, determining a sensor resolution model based on the temperature probe type, and determining a set of final temperature estimates based on the set of electrical signals and the sensor resolution model.