Exemplary embodiments of a portable paperless recorder are disclosed. According to one exemplary embodiment, a portable paperless recorder may include a recorder body, having a signal acquisition board and a main circuit board. The main circuit board is plugged into the signal acquisition board, and comprises a manual reset power loss protection circuit of the microprocessor reset of the paperless recorder. The signal acquisition board comprises an adapter component for connecting the external terminal, and one side of the adapter component comprises a channel cross-connect board for leading through the connection of the external terminal and the adapter components. The channel cross-connect board is engaged with the upper end of the recorder body. In the present disclosure, the signal acquisition board having the adapter component is attachedly connected with the recorder body by screwing. The channel cross-connect board is engaged to the recorder body to further convenience the assembly and disassembly of the signal acquisition board, the channel cross-connect board and the recorder body. When the manufacturers produce paperless recorders with different interfaces, no major changes are required to the paperless recorders for reducing the manufacturing costs.

A heat amount measuring method includes a first step of providing a heat-transferring component that transfers and receives heat to and from a heating component and measuring, while the heating component is generating heat, a first heat amount of heat transmitted from the heating component to the heat-transferring component, a first heating component temperature, and a first substrate temperature, a second step of changing an output of the heat-transferring component and measuring a second heat amount of heat transmitted from the heating component to the heat-transferring component, a second heating component temperature, and a second substrate temperature, and a third step of calculating a heat amount of heat transmitted from the heating component to a substrate by using the first heat amount, the first heating component temperature, the first substrate temperature, the second heat amount, the second heating component temperature, and the second substrate temperature.

An semiconductor device includes a substrate having a first surface and a second surface opposite the first surface, and a through-silicon via structure extending through the substrate. The through-silicon via structure includes a first through-silicon via containing a first conductivity type material and a second through-silicon via containing a second conductivity type material opposite the first conductivity type material. The semiconductor device also includes a first conductive layer on the first surface of the substrate and electrically coupled to a first end of the first through-silicon via and a first end of the second through-silicon via. The semiconductor device also includes a second conductive on the second surface and having a first portion coupled to a second end of the first through-silicon via and a second portion coupled to a second end of the second through-silicon via.

Described is a zone box for a differential scanning calorimeter. The zone box includes sheets of thermocouple alloy disposed between thermally conductive electrical insulator layers. A thermocouple alloy wire is electrically coupled to each one of the thermocouple alloy sheets. In addition, a pure metal wire is electrically coupled to each one of the thermocouple alloy sheets to enable remote measurement of voltage differences between the different thermocouple alloy sheets. The high thermal conductivity of the electrical insulator layers substantially reduces any thermal gradients across the sheets and maintains the connections of the thermocouple alloy wires and pure metal wires to the sheets to be at substantially the same temperature. The zone box reduces temperature difference measurement errors that result from inhomogeneity in the thermocouple alloy wires and variable temperature distributions along the length of the wires.

In one embodiment, a processor includes: a first plurality of intellectual property (IP) circuits to execute operations; and a second plurality of integrated voltage regulators, where the second plurality of integrated voltage regulators are oversubscribed with respect to the first plurality of IP circuits. Other embodiments are described and claimed.

A heater system is provided, which includes a plurality of heaters, a controller for supplying power to the plurality of heaters, a plurality sets of auxiliary wires extending from the plurality of heaters, and a wire harness for connecting the plurality sets of auxiliary wires to the controller. Each set of auxiliary wires includes three wires, two of the three wires being made of different materials and being joined to form a thermocouple junction, such that each of the plurality of heaters is operable to function as both a heater and a temperature sensor.

A thermal chamber includes a cavity that is enclosed by sides and one or more ports that expose the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component having a solid physical structure and configured to transfer thermal energy to and from an electrical device exposed via the cavity. The thermal chamber includes a bottom side open area of the thermal chamber located below the one or more ports. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.

Provided is programmable circuit for interfacing with a field device. The circuit includes only one analog-to-digital converter (ADC) configured to receive from the field device one from the group including a current signal and a voltage signal. The received one signal has frequency shift keying tones (FSK) superimposed thereon, the ADC being configured to extract information from the received one signal and the FSK tones simultaneously. Also included is only one digital-to-analog converter configured to drive an output signal to the field device, the output signal (i) including one from the group including a current signal and a voltage signal and (ii) being summed with an FSK-modulated signal.

A flexible sensor label including a reservoir chamber configured to store an activation medium, a plurality of first chambers, and a plurality of second chambers. Each first chamber has an associated first temperature and stores an irreversible thermochromic polymer that is altered and irreversibly changes color in response to the activation medium being released and coming into contact with the irreversible thermochromic polymer in the first chamber and an environmental temperature of the flexible sensor label corresponding to the associated first temperature of the first chamber. Each second chamber has an associated second temperature and stores a reversible thermochromic polymer that is altered and reversibly changes color in response to the activation medium being released and coming into contact with the reversible thermochromic polymer in the second chamber and the environmental temperature of the flexible sensor label corresponding to the associated second temperature of the second chamber.