An appliance includes an appliance interface forming a plug connection with an appliance-side interface unit of a power cable. The appliance interface includes at least one power contact part forming a power connection with a power contact part of the appliance-side interface unit supplying the appliance with electrical energy from a supply grid. The appliance interface includes a first thermoelectric element contacting a second thermoelectric element of the appliance-side interface unit, when the power connection exists. The first thermoelectric element is coupled to a first measurement input of a control unit. The appliance interface includes a measurement contact part forming a measurement connection, between the second thermoelectric element and a second measurement input of the control unit, with a measurement contact part of the appliance-side interface unit. The control unit determines measurement data relating to a measurement voltage between the first and second measurement inputs.

An oscillator includes a container, an oscillation element housed in the container, a heating circuit housed in the container, and adapted to control a temperature of the oscillation element, a temperature detection circuit housed in the container, a temperature control circuit housed in the container, and adapted to control the heating circuit based on an output of the temperature detection circuit, at least one connecting wire housed in the container, and electrically connects a ground of the temperature detection circuit and a ground of the temperature control circuit to each other, and a ground external terminal disposed on an outer surface of the container, and electrically connected to the ground of the temperature detection circuit and the ground of the temperature control circuit.

A temperature sensor of a thermal monitoring system is provided for use in power distribution systems. The temperature sensor comprises ceramic printed circuit board (PCB) and a terminal. The ceramic PCB includes a temperature sensing element disposed on a side of the ceramic PCB. The terminal is configured to be fixed directly in contact with a measured point and is directly in touch with the ceramic PCB such that heat is conducted from the terminal, through the ceramic PCB and then to the temperature sensing element. The temperature sensing element is configured to generate an electrical signal in response to the heat such that the electrical signal is sent through a pair of lead wires to a controller for monitoring a temperature. The temperature sensor further comprises an epoxy to seal a portion of the terminal, the ceramic PCB in its entirety and a portion of the pair of lead wires to ensure a desired physical strength and a desired dielectric strength.

A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

A temperature sensing unit is provided, which includes a temperature sensor for measuring a temperature of an object and a mounting member. The mounting member is elastic and is attached to the temperature sensor for securing the temperature sensor around the object, and the temperature sensor in one form defines a first thermocouple ribbon and a second thermocouple ribbon with a very low profile and high temperature capability.

Provided is a thermocouple transition body apparatus comprising: a transition body, having at least one recess; a positive electrical terminal; a negative electrical terminal; and, at least one cap; wherein the transition body, positive terminal, and negative terminal are configured to attach to conductors without the use of epoxy or crimping. The thermocouple transition body apparatus is able to withstand temperatures exceeding 500 degrees Fahrenheit.

In variants, an automatically-identifiable temperature probe can include: a probe body, one or more sensors, a connector, and/or any other suitable components. In variants, the method for temperature determination can include: determining a set of electrical signals, determining a temperature probe type based on the set of electrical signals, determining a sensor resolution model based on the temperature probe type, and determining a set of final temperature estimates based on the set of electrical signals and the sensor resolution model.

An input module includes a terminal block and a removable printed circuit board (PCB). The terminal block includes first and second connector assemblies for electrically coupling first and second electrical wires of an external thermocouple to the PCB. At least one of the first or second connector assemblies includes an internal thermocouple. The internal thermocouple has two conductive legs which are formed of different materials and are separated at an end to form a jaw connector for connecting or disconnecting an edge of the printed circuit board to or from the terminal block respectively. The PCB includes a sensor for measuring a temperature on the PCB, and a processing circuit configured to perform cold junction compensation using a cold junction temperature which is determined based on temperature measurement from the sensor and a temperature or voltage measurement from the internal thermocouple, when measuring hot junction temperature of the external thermocouple.

The invention is directed to embodiments of a temperature sensor for use with a temperature measuring device, for example a digital thermometer. The temperature sensor includes at least two and preferably three wires joined at a thermocouple. The temperature sensor is designed to be mounted on terminals of the digital thermometer sensor to allow precise temperature measurements for a thermal device, for example a soldering tool or de-soldering tool.

A system includes a measurement instrument including a first connector and a control module electrically connected to the first connector. A temperature probe including a shaft having a first end and a second end, a second connector being coupled to the first end, a thermocouple junction formed at a tip and configured to measure a change in temperature of a sample, and the second connector being received by the first connector when the temperature probe is attached to the measurement instrument. A storage module housed within the second connector and configured to store one or more parameters of the temperature probe. The control module being configured to: receive the one or more parameters; determine a temperature measurement based on a change in voltage; determine a first correction based on the one or more parameters; and determine an adjusted temperature measurement based on the temperature measurement and the first correction.