A manufacturing method for a thermoelectric nanosensor includes the following steps. A first conductive material is prepared. A plurality of tellurium nanostructures are formed on the first conductive material. A second conductive material is prepared. The second conductive material is formed on the tellurium nanostructures.

A multi-purpose Micro-Electro-Mechanical Systems (MEMS) thermopile sensor able to use as a thermal conductivity sensor, a Pirani vacuum sensor, a thermal flow sensor and a non-contact infrared temperature sensor, respectively. The sensor comprises a rectangular membrane created in a silicon substrate which has a thin polysilicon layer and a thin residual thermal reorganized porous silicon layer both attached on its back side, and configured to have its three sides clamped to the frame formed in the silicon substrate which surrounds and supports the membrane and the other side free to the frame, a cavity created in the silicon substrate, positioned under the membrane and having its flat bottom opposite to the membrane, its three side walls shaped as curved planes and the other side wall shaped as a vertical plane, a heater or an infrared absorber positioned on the membrane, close to and parallel with the free side of the membrane and a thermopile positioned on the membrane and consists of several thermocouples connected in series and having its hot junctions close to the heater and its cold junctions extended to the frame.

A resistance temperature detector (RTD) that uses a ceramic matrix composite (CMC), such as a silicon carbide fiber-reinforced silicon carbide matrix, as an active temperature sensing element, which can operate at temperatures greater than 1000 C. or even 1600 C. Conductive indium tin oxide or a single elemental metal such as platinum is deposited on a dielectric or insulating layer such as mullite or an environmental barrier coating (EBC) on the substrate. Openings in the layer allow etching of the CMC surface in order to make high quality ohmic contacts with the conductive material, either directly or through a silicide diffusion barrier such as ITO. The RTD can measure both temperature and strain of the CMC. The use of an EBC, which typically is deposited on the CMC by the manufacturer, as the insulating or dielectric layer can be extended to other devices such as strain gages and thermocouples that use the CMC as a sensing element. The EBC can be masked and etched to form the openings. A conductive EBC can be used as the silicide diffusion barrier.

The present invention relates to a high-temperature thermocouple with a thermocouple wire including two dissimilar wires twisted together and covered with a polyimide-based leak-proof insulation coating. The thermocouple wire may include a welded hot junction attaching the two dissimilar wires together on one end and may be connected to a thermocouple connector located at an opposite end. A method for making the high-temperature thermocouple may include coating a pair of dissimilar wires with a leak-proof polyimide-based insulation coating by dipping of dissimilar wires in a liquid polyimide-based solution and curing the dissimilar wires with heat. The method may also include twisting the dissimilar wires around themselves, welding together the dissimilar wires to each other creating a welded hot junction, and attaching the opposite end of the dissimilar wires to a thermocouple connector. The leak-proof insulation coating and thermocouple connector may be rated for 800 degrees F. and 150 PSI.

A microscale thermocouple probe for intracellular temperature measurements comprises a cantilever structure including a suspended portion extending from a support, where the suspended portion includes first and second conductive lines on a surface thereof. The first and second conductive lines extend along the surface and meet at a tip of the suspended portion to define a thermocouple junction.

The subject of the present invention relates to a device that can be applied to the surface of a ceramic matrix composites (CMC) in such a way that the CMC itself will contribute to the extraordinarily large thermoelectric power. The present invention obtains greater resolution of temperature measurements, which can be obtained at exceedingly high temperatures.

A substrate and a display device are disclosed. The substrate includes: a base substrate; a first temperature sensing section disposed on the base substrate; and a first processing chip connected with the first temperature sensing section. The substrate includes a peripheral area and a central area; one part of the first temperature sensing section is disposed in the peripheral area of the substrate; another part of the first temperature sensing section is disposed in the central area of the substrate; and the first processing chip is configured to convert temperature sensing signals of the central area and the peripheral area of the substrate sensed by the first temperature sensing section into relevant control signals and output the signals. The above first temperature sensing section can more accurately measure the temperature difference between the peripheral area and the central area of the substrate.

The disclosed embodiments relate to the design of a temperature sensor, which is integrated into a semiconductor chip. This temperature sensor comprises an electro-thermal filter (ETF) integrated onto the semiconductor chip, wherein the ETF comprises: a heater; a thermopile, and a heat-transmission medium that couples the heater to the thermopile, wherein the heat-transmission medium comprises a polysilicon layer sandwiched between silicon dioxide layers. It also comprises a measurement circuit that measures a transfer function through the ETF to determine a temperature reading for the temperature sensor.

An arrangement for monitoring a freeze drying process includes product condition sensors for product condition measurement within product vials. The product condition sensors are bimetal junctions deposited on a substrate using an ink jet printing process. The substrate may be a flexible film applied to an interior surface of the product vial, or may be the vial surface itself. The bimetal junction may be printed using a roll-roll inkjet printing process with metallic nanoparticle inks. Multiple closely-spaced bi-metal junctions are provided in each measurement vial. Data from the sensors is transmitted to a data collection point via short range wireless digital communications. The location of a sublimation front may be calculated for each measured vial, and the freeze drying process may be controlled using the data.

A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.