Mass flow controllers and methods for controlling mass flow controllers are disclosed. A method includes providing a gas through a thermal mass flow sensor of the mass flow controller and processing a flow sensor signal from the thermal mass flow sensor of the mass flow controller to produce a measured flow signal. The measured flow signal is corrected to produce a corrected flow signal by gradually changing non-linearity correction to the measured flow signal when a flow rate of the gas changes. A valve of the mass flow controller is controlled using the corrected flow signal and a setpoint signal.

A temperature drift compensation method includes pre-aging a thermocouple, during which the thermocouple is subjected to temperatures and/or pressures that cause or facilitate an oxidation growth on the conductor elements of the thermocouple. During the pre-aging, temperature readings of the thermocouple are recorded, and a model including a time-based exponential expression is derived from the temperature readings. In addition, a temperature sensor system includes a pre-aged thermocouple, and a temperature compensation circuit that modifies initial temperature readings from the pre-aged thermocouple according to a model including a time-based exponential expression.

Disclosed is a device for signaling the state of a product to be monitored (PTM) having a requirement to a temperature (T.sub.p) of or at delivery and administration thereof. The device comprises, integrated in a chip, a temperature sensor and a microcomputer (μC) that can be supplied with power from a power source (3), and comprises a display unit. The microcomputer (μC) has a function that is capable of calculating a thermal model of the current state of the product to be monitored and comprises a display for displaying or signaling the state or state variables calculated in the model or variables derived therefrom as a function of state values of or in the model(s).

Disclosed is a device for signaling the state of a product to be monitored (PTM) having a requirement to a temperature (T.sub.p) of or at delivery and administration thereof. The device comprises, integrated in a chip, a temperature sensor and a microcomputer (μC) that can be supplied with power from a power source (3), and comprises a display unit. The microcomputer (μC) has a function that is capable of calculating a thermal model of the current state of the product to be monitored and comprises a display for displaying or signaling the state or state variables calculated in the model or variables derived therefrom as a function of state values of or in the model(s).

A temperature sensing circuit a switched capacitor circuit selectively samples ΔVbe and Vbe voltages and provides the sampled voltages to inputs of an integrator. A quantization circuit quantizes outputs of the integrator to produce a bitstream. When a most recent bit of the bitstream is a logic zero, operation includes sampling and integration of ΔVbe a first given number of times to produce a voltage proportional to absolute temperature. When the most recent bit of the bitstream is a logic one, operation includes cause sampling and integration of Vbe a second given number of times to produce a voltage complementary to absolute temperature. A low pass filter and decimator filters and decimates the bitstream produced by the quantization circuit to produce a signal indicative of a temperature of a chip into which the temperature sensing circuit is placed.

A temperature sensing circuit a switched capacitor circuit selectively samples ΔVbe and Vbe voltages and provides the sampled voltages to inputs of an integrator. A quantization circuit quantizes outputs of the integrator to produce a bitstream. When a most recent bit of the bitstream is a logic zero, operation includes sampling and integration of ΔVbe a first given number of times to produce a voltage proportional to absolute temperature. When the most recent bit of the bitstream is a logic one, operation includes cause sampling and integration of Vbe a second given number of times to produce a voltage complementary to absolute temperature. A low pass filter and decimator filters and decimates the bitstream produced by the quantization circuit to produce a signal indicative of a temperature of a chip into which the temperature sensing circuit is placed.

A temperature sensor includes a block body, a first thermocouple, and a second thermocouple. The first thermocouple includes a first strand, a second strand, a first insulator surrounding the first strand and the second strand, and a first metal sheath surrounding the first insulator. The second thermocouple includes a third strand, a fourth strand, a second insulator surrounding the third strand and the fourth strand, and a second metal sheath surrounding the second insulator. An end portion of each of the first thermocouple and the second thermocouple is buried in the block body.

A system includes a measurement instrument including a first connector, a control module, and a display. A temperature probe includes a shaft and a tip. A second connector is coupled to a first end of the shaft. The tip is coupled to a second end of the shaft and measures a change in temperature of a sample. The second connector is received by the first connector when the temperature probe is attached to the measurement instrument. A storage module is housed within the second connector and stores parameters of the temperature probe. The control module receives the parameters, prompts a user to select the sample on the display, and determines a thermal conductivity and a stable time of the sample. When the stable time has elapsed, the control module determines a temperature measurement based on a change in voltage and displays the temperature measurement on the display.

A system includes a measurement instrument including a first connector, a control module, and a display. A temperature probe includes a shaft and a tip. A second connector is coupled to a first end of the shaft. The tip is coupled to a second end of the shaft and measures a change in temperature of a sample. The second connector is received by the first connector when the temperature probe is attached to the measurement instrument. A storage module is housed within the second connector and stores parameters of the temperature probe. The control module receives the parameters, prompts a user to select the sample on the display, and determines a thermal conductivity and a stable time of the sample. When the stable time has elapsed, the control module determines a temperature measurement based on a change in voltage and displays the temperature measurement on the display.

A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.