A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

A method for reducing thermal induced error in real-time for a sensor in a region of interest. The method includes receiving at least one data point from a temperature sensor, the temperature sensor configured to determine temperature for the sensor of interest. The method includes receiving at least one data point from the sensor, the sensor having thermal sensitivity and offset shift for a given temperature range. The method includes determining at least three percentage change coefficients for thermal sensitivity. The method includes determining at least three percentage change coefficients for thermal zero offset. The method includes calculating real-time thermal error reduction.

A method for reducing thermal induced error in real-time for a sensor in a region of interest. The method includes receiving at least one data point from a temperature sensor, the temperature sensor configured to determine temperature for the sensor of interest. The method includes receiving at least one data point from the sensor, the sensor having thermal sensitivity and offset shift for a given temperature range. The method includes determining at least three percentage change coefficients for thermal sensitivity. The method includes determining at least three percentage change coefficients for thermal zero offset. The method includes calculating real-time thermal error reduction.

A system includes a measurement instrument including a first connector and a control module electrically connected to the first connector. A temperature probe including a shaft having a first end and a second end, a second connector being coupled to the first end, a thermocouple junction formed at a tip and configured to measure a change in temperature of a sample, and the second connector being received by the first connector when the temperature probe is attached to the measurement instrument. A storage module housed within the second connector and configured to store one or more parameters of the temperature probe. The control module being configured to: receive the one or more parameters; determine a temperature measurement based on a change in voltage; determine a first correction based on the one or more parameters; and determine an adjusted temperature measurement based on the temperature measurement and the first correction.

A system includes a measurement instrument including a first connector and a control module electrically connected to the first connector. A temperature probe including a shaft having a first end and a second end, a second connector being coupled to the first end, a thermocouple junction formed at a tip and configured to measure a change in temperature of a sample, and the second connector being received by the first connector when the temperature probe is attached to the measurement instrument. A storage module housed within the second connector and configured to store one or more parameters of the temperature probe. The control module being configured to: receive the one or more parameters; determine a temperature measurement based on a change in voltage; determine a first correction based on the one or more parameters; and determine an adjusted temperature measurement based on the temperature measurement and the first correction.

A device for sensing pressure and temperature in a fluid environment includes a cover defining an interior. A thermistor tube is positioned at least partially within the interior, the thermistor tube extending substantially along a longitudinal axis. A port body is also positioned at least partially within the interior, the port body forming a channel which extends along the longitudinal axis for receiving a fluid from the fluid environment. A diaphragm is affixed within the port body. The diaphragm has a first surface exposed to the fluid within the channel and a second surface sealed from the channel.

Apparatus, including a multiplexer, having a first output and multiple first inputs receiving analog input signals and an analog feedback signal and cycling through and selecting the signals for transfer in sequential signal groupings to the first output. The apparatus also includes an amplification circuit, having a second output and a second input connected to the multiplexer first output, that amplifies signals corresponding to the analog input signals with a selected gain so as to generate respective amplified analog signals at the second output. Circuitry selects a characteristic of the respective amplified analog signals from an initial signal grouping, feeds the characteristic back for input to the multiplexer as the analog feedback signal, selects a subsequent characteristic of the respective amplified analog signals from a subsequent signal grouping, and adjusts the amplification circuit gain so that the analog feedback signal and the subsequent characteristic have the same amplitude.

Apparatus, including a multiplexer, having a first output and multiple first inputs receiving analog input signals and an analog feedback signal and cycling through and selecting the signals for transfer in sequential signal groupings to the first output. The apparatus also includes an amplification circuit, having a second output and a second input connected to the multiplexer first output, that amplifies signals corresponding to the analog input signals with a selected gain so as to generate respective amplified analog signals at the second output. Circuitry selects a characteristic of the respective amplified analog signals from an initial signal grouping, feeds the characteristic back for input to the multiplexer as the analog feedback signal, selects a subsequent characteristic of the respective amplified analog signals from a subsequent signal grouping, and adjusts the amplification circuit gain so that the analog feedback signal and the subsequent characteristic have the same amplitude.

A temperature calibration device includes a thin-film thermocouple element having a pair of thin films made of dissimilar metals, connected to each other at a temperature measurement contact on one end side, and having a pair of external contacts at the other end, a pair of input terminals made of an electroconductive material and connectable to the pair of external contacts, a pair of output terminals made of an electroconductive material and connectable to a pair of conducting wires linked to a temperature display device calculating a temperature by using an input voltage and displaying the calculated temperature, computation circuit for calibrating a detected value of a voltage between the input terminals and computing a calibrated voltage, and voltage applicator for outputting the calibrated voltage between the output terminals. The calibrated voltage is output to the temperature display device.

A temperature calibration device includes a thin-film thermocouple element having a pair of thin films made of dissimilar metals, connected to each other at a temperature measurement contact on one end side, and having a pair of external contacts at the other end, a pair of input terminals made of an electroconductive material and connectable to the pair of external contacts, a pair of output terminals made of an electroconductive material and connectable to a pair of conducting wires linked to a temperature display device calculating a temperature by using an input voltage and displaying the calculated temperature, computation circuit for calibrating a detected value of a voltage between the input terminals and computing a calibrated voltage, and voltage applicator for outputting the calibrated voltage between the output terminals. The calibrated voltage is output to the temperature display device.