An apparatus is provided which comprises: a thermal sensor comprising one or more n-type devices or p-type devices that suffer from subthreshold factor variation, wherein the thermal sensor is to generate an output digital code representing a temperature; and a calibration circuitry coupled to the thermal sensor, wherein the calibration circuitry is to trim the effects of subthreshold factor variation from the output digital code.

In a thermocouple, a pair of thermoelements extend within a protective sheath. The thermoelements are spaced from the sheath by an insulator. The sheath comprises an outer sheath formed from a metal alloy adapted to provide mechanical support and corrosion resistance during use of the thermocouple, typically at elevated temperature. The sheath further comprises an inner sheath positioned between the outer sheath and the thermoelements and formed from a nickel-based alloy containing less than 10 wt % Cr, to prevent diffusion of Cr and/or Mn from the outer sheath to the thermoelements.

Apparatus, including a multiplexer, having a first output and multiple first inputs receiving analog input signals and an analog feedback signal and cycling through and selecting the signals for transfer in sequential signal groupings to the first output. The apparatus also includes an amplification circuit, having a second output and a second input connected to the multiplexer first output, that amplifies signals corresponding to the analog input signals with a selected gain so as to generate respective amplified analog signals at the second output. Circuitry selects a characteristic of the respective amplified analog signals from an initial signal grouping, feeds the characteristic back for input to the multiplexer as the analog feedback signal, selects a subsequent characteristic of the respective amplified analog signals from a subsequent signal grouping, and adjusts the amplification circuit gain so that the analog feedback signal and the subsequent characteristic have the same amplitude.

Apparatus, including a multiplexer, having a first output and multiple first inputs receiving analog input signals and an analog feedback signal and cycling through and selecting the signals for transfer in sequential signal groupings to the first output. The apparatus also includes an amplification circuit, having a second output and a second input connected to the multiplexer first output, that amplifies signals corresponding to the analog input signals with a selected gain so as to generate respective amplified analog signals at the second output. Circuitry selects a characteristic of the respective amplified analog signals from an initial signal grouping, feeds the characteristic back for input to the multiplexer as the analog feedback signal, selects a subsequent characteristic of the respective amplified analog signals from a subsequent signal grouping, and adjusts the amplification circuit gain so that the analog feedback signal and the subsequent characteristic have the same amplitude.

Certain exemplary embodiments can provide a system, which can comprise a thermocouple input module. The thermocouple input module can be adapted to determine one or more calibration factors. The thermocouple input module can be adapted to store the calibration factors. The thermocouple input module can be adapted to apply the calibration factors to an incoming thermocouple voltage value to obtain an adjusted thermocouple voltage value.

Certain exemplary embodiments can provide a system, which can comprise a thermocouple input module. The thermocouple input module can be adapted to determine one or more calibration factors. The thermocouple input module can be adapted to store the calibration factors. The thermocouple input module can be adapted to apply the calibration factors to an incoming thermocouple voltage value to obtain an adjusted thermocouple voltage value.

A method for detecting an influence of microwaves on a measurement value of a temperature sensor of a core temperature probe of a cooking appliance, includes: recording the measurement value of the temperature sensor; determining the slope of the course of the recorded measurement values in at least one analysis interval (A, B) which is in a predetermined relation to a switch-on time and/or a switch-off time of a microwave generator; determining whether the slope lies above or below a predefined threshold; interpreting the exceedance of or falling below the threshold to the effect that the corresponding temperature sensor is not located in a food to be cooked and/or the core temperature probe is not correctly inserted into the food or into a receptacle provided for the same.

A device for detecting the profile of the rolling surface of a rolling body, in particular a tread of a tire for a vehicle includes a light source and an optical assembly configured for processing a first light beam emitted by the light source. The first light beam is a planar light beam having a divergent course, and the light source is configured for the emission of the first light beam towards the optical assembly. The optical assembly includes at least one first refractive member configured for collimating at least one portion of the first light beam incident thereon into a measurement beam that is directed towards a measurement section of the device to impinge upon the rolling surface.

A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.