A method of calibrating temperature of a resistive element having a material with a Curie temperature includes generating a standard resistance-temperature (R-T) curve for the resistive element in isothermal conditions to identify values of the R-T curve and an inflection point at the Curie temperature, generating operational R-T curves for the resistive element over an operational time period, comparing the standard R-T curve to the operational R-T curves, and adjusting the operational curves to the standard R-T curve at the Curie temperature to calibrate temperature of the resistive element.

A temperature detection circuit (1) includes a first transistor (Q1) of a bipolar type, and a second transistor (Q2) of a bipolar type, wherein the first transistor (Q1) and the second transistor (Q2) form a current mirror circuit (10), and the temperature of the amplifier circuit (30) is detected based on a temperature change of the first transistor (Q1) and the second transistor (Q2).

A temperature-sensitive element including an element main body and a pair of lead wires that is drawn out from the element main body; a case accommodating the temperature-sensitive element and having a heat transfer surface configured to come into contact with a measurement object for temperature; a pair of lead frames electrically connected with each of the lead wires and drawn out from the case; and a filler covering the temperature-sensitive element accommodated in the case and the lead frames and holding the temperature-sensitive element and the lead frames in the case while maintaining a state of the connection.

The temperature sensor includes a temperature sensing element, a pair of element electrode wires, and a pair of terminals. An overlapping wire portion of each of the element electrode wires is connected to the terminal in such a manner as to overlap the terminal in an overlapping direction. A fillet portion is disposed on a side surface of the overlapping wire portion. The fillet portion has a pair of fillet pieces formed in such a manner as to crawl up from a specific main surface that is a main surface at the overlapping wire portion side in the terminal. In a cross section of the temperature sensor orthogonal to a sensor axis direction and passing through the fillet portion, the maximum length in a width direction of the fillet portion is defined as a fillet maximum width A, and a length in a width direction between a pair of boundary portions between the pair of fillet pieces and the specific main surface is defined as a boundary width B. The temperature sensor has, at least partly in the sensor axis direction, a specific cross section satisfying B≤A, as a cross section of the temperature sensor orthogonal to the sensor axis direction and passing through the fillet portion.

A device having a first terminal region and a second terminal region. The first terminal region includes fine-tune (FT) metal stripes that are separated from each other by a first distance along the longitudinal direction. The second terminal region is spaced apart from the first terminal region by at least an inter-terminal distance. The second terminal region includes coarse-tune (CT) metal stripes that are separated from each other by a second distance along the longitudinal direction. The second distance is greater than the first distance, and the inter-terminal distance greater than the second distance. Each of the FT metal stripes may be selected as a first access location, and each of the CT metal stripes may be selected as a second access location. A pair of selected first and second access locations access a sheet resistance defined by a distance therebetween.

An electronic power connector including a contact configured to electrically connect a power supply to a load. The electronic power connector further including a contact core configured to receive the contact, the contact core including a transformer winding wrapped around the contact core, the transformer winding configured to sense a current

Various examples provide an electronic device that includes first and second resistor segments. Each of the resistor segments has a respective doped resistive region formed in a semiconductor substrate. The resistor segments are connected between first and second terminals. The first resistor segment is configured to conduct a current in a first direction, and the second resistor segment is configured to conduct the current in a second different direction. The directions may be orthogonal crystallographic directions of the semiconductor substrate.

A heater module includes a thick-film heating element, the heating element including: a heating conductor; a temperature sensor; and a substrate supporting the heating conductor and the temperature sensor. The heater module includes a resistive conductor having at least one trimming cut formed by a trimming process.

A semiconductor apparatus includes: an insulating substrate including an insulating layer having first and second main surfaces, a metal plate on the first main surface, and first to fourth conductors on the second main surface; a semiconductor device including a rear electrode electrically connected to the first conductor and a front electrode electrically connected to the second conductor; a temperature detection device including a first electrode electrically connected to the third conductor and a second electrode electrically connected to the fourth conductor; a first terminal electrically connected to the third conductor; a second terminal positioned so as to be wire-connectable to the fourth conductor; and a third terminal electrically connected to the second conductor, wherein the fourth conductor is positioned so as to be wire-connectable to the second conductor.

An electronic power connector including a contact and a contact core. The contact is configured to electrically connect a power supply to a load. The contact core is configured to receive the contact. The contact core includes a transformer winding configured to sense a current and a sensor slot configured to receive a sensor. In some embodiments, the sensor is configured to sense a temperature. In some embodiments, the sensor is configured to sense a voltage.