A temperature sensor is described having a measuring resistor, a printed circuit board onto which the measuring resistor is soldered, a cover plate which is fastened onto the printed circuit board, the cover plate having a recess in which the measuring resistor sits.

A connection assembly includes an adapter to be mounted to a rear part of a subsea sensor, a sensor port being located in the adapter, through which at least a first and a second sensor connection are led to the subsea sensor; a first port for providing a connection to a first of the subsea cables; and a second port for providing a connection to a second of the subsea cables. A first penetrator is arranged in the first port to provide a liquid tight seal between an interior space of the adapter and a duct connected to the first port leading the first sensor connection through the first port, and a second penetrator is arranged in the second port providing a liquid tight seal between the interior space of the adapter and a duct connected to the second port and leading the second sensor connection through the second port.

A device having a first terminal region and a second terminal region. The first terminal region includes fine-tune (FT) metal stripes that are separated from each other by a first distance along the longitudinal direction. The second terminal region is spaced apart from the first terminal region by at least an inter-terminal distance. The second terminal region includes coarse-tune (CT) metal stripes that are separated from each other by a second distance along the longitudinal direction. The second distance is greater than the first distance, and the inter-terminal distance greater than the second distance. Each of the FT metal stripes may be selected as a first access location, and each of the CT metal stripes may be selected as a second access location. A pair of selected first and second access locations access a sheet resistance defined by a distance therebetween.

A device having a first terminal region and a second terminal region. The first terminal region includes fine-tune (FT) metal stripes that are separated from each other by a first distance along the longitudinal direction. The second terminal region is spaced apart from the first terminal region by at least an inter-terminal distance. The second terminal region includes coarse-tune (CT) metal stripes that are separated from each other by a second distance along the longitudinal direction. The second distance is greater than the first distance, and the inter-terminal distance greater than the second distance. Each of the FT metal stripes may be selected as a first access location, and each of the CT metal stripes may be selected as a second access location. A pair of selected first and second access locations access a sheet resistance defined by a distance therebetween.

An oscillator includes a container, an oscillation element housed in the container, a heating circuit housed in the container, and adapted to control a temperature of the oscillation element, a temperature detection circuit housed in the container, a temperature control circuit housed in the container, and adapted to control the heating circuit based on an output of the temperature detection circuit, at least one connecting wire housed in the container, and electrically connects a ground of the temperature detection circuit and a ground of the temperature control circuit to each other, and a ground external terminal disposed on an outer surface of the container, and electrically connected to the ground of the temperature detection circuit and the ground of the temperature control circuit.

Various examples provide an electronic device that includes first and second resistor segments. Each of the resistor segments has a respective doped resistive region formed in a semiconductor substrate. The resistor segments are connected between first and second terminals. The first resistor segment is configured to conduct a current in a first direction, and the second resistor segment is configured to conduct the current in a second different direction. The directions may be orthogonal crystallographic directions of the semiconductor substrate.

In variants, an automatically-identifiable temperature probe can include: a probe body, one or more sensors, a connector, and/or any other suitable components. In variants, the method for temperature determination can include: determining a set of electrical signals, determining a temperature probe type based on the set of electrical signals, determining a sensor resolution model based on the temperature probe type, and determining a set of final temperature estimates based on the set of electrical signals and the sensor resolution model.

An electronic power connector including a contact and a contact core. The contact is configured to electrically connect a power supply to a load. The contact core is configured to receive the contact. The contact core includes a transformer winding configured to sense a current and a sensor slot configured to receive a sensor. In some embodiments, the sensor is configured to sense a temperature. In some embodiments, the sensor is configured to sense a voltage.

A semiconductor apparatus includes: an insulating substrate including an insulating layer having first and second main surfaces, a metal plate on the first main surface, and first to fourth conductors on the second main surface; a semiconductor device including a rear electrode electrically connected to the first conductor and a front electrode electrically connected to the second conductor; a temperature detection device including a first electrode electrically connected to the third conductor and a second electrode electrically connected to the fourth conductor; a first terminal electrically connected to the third conductor; a second terminal positioned so as to be wire-connectable to the fourth conductor; and a third terminal electrically connected to the second conductor, wherein the fourth conductor is positioned so as to be wire-connectable to the second conductor.

The temperature sensor includes a temperature sensing element, a pair of element electrode wires, and a pair of terminals. An overlapping wire portion of each of the element electrode wires is connected to the terminal in such a manner as to overlap the terminal in an overlapping direction. A fillet portion is disposed on a side surface of the overlapping wire portion. The fillet portion has a pair of fillet pieces formed in such a manner as to crawl up from a specific main surface that is a main surface at the overlapping wire portion side in the terminal. In a cross section of the temperature sensor orthogonal to a sensor axis direction and passing through the fillet portion, the maximum length in a width direction of the fillet portion is defined as a fillet maximum width A, and a length in a width direction between a pair of boundary portions between the pair of fillet pieces and the specific main surface is defined as a boundary width B. The temperature sensor has, at least partly in the sensor axis direction, a specific cross section satisfying B?A, as a cross section of the temperature sensor orthogonal to the sensor axis direction and passing through the fillet portion.