A temperature sensor (1) including: a temperature sensing element (3) including a temperature sensing portion (4) having an electrical characteristic which varies depending on temperature, and an electrode wire (5) for outputting an electrical signal from the temperature sensing portion (4); and a sheath core wire (signal wire) (15) electrically connected to the electrode wire (5). The electrode wire (5) is formed from a platinum-palladium-rhodium alloy containing Pt, Pd and Rh. The alloy contains a total of 0.1 to 1.2 mol % of at least one alkaline-earth metal selected from the group consisting of Ca, Sr and Ba; 0.1 to 43.0 mol % of Pd; and 1.0 to 43.0 mol % of Rh, and the balance is Pt and incidental impurities. In the platinum-palladium-rhodium alloy, second-phase precipitated grains mainly containing Pt, Pd and the alkaline-earth metal are dispersed in a matrix phase.

A temperature sensor having a structure in which electrode wires are butted against signal wires with their weld portions and a method for manufacturing the temperature sensor. In a temperature sensor (1), outer circumferential portions (57a) and (57b) of each of weld portions (55) between electrode wires (25) and sheath core wires (3) are located outward of a first straight line D1 and a second straight line D2, respectively. A forward end-side length L1 is set to be longer than a rear end-side length L2. In addition, the sheath core wires (3) are larger in diameter than the electrode wires (25).

An electronic power connector including a contact and a contact core. The contact is configured to electrically connect a power supply to a load. The contact core is configured to receive the contact. The contact core includes a transformer winding configured to sense a current and a sensor slot configured to receive a sensor. In some embodiments, the sensor is configured to sense a temperature. In some embodiments, the sensor is configured to sense a voltage.

A temperature-sensitive element including an element main body and a pair of lead wires that is drawn out from the element main body; a case accommodating the temperature-sensitive element and having a heat transfer surface configured to come into contact with a measurement object for temperature; a pair of lead frames electrically connected with each of the lead wires and drawn out from the case; and a filler covering the temperature-sensitive element accommodated in the case and the lead frames and holding the temperature-sensitive element and the lead frames in the case while maintaining a state of the connection.

A method of calibrating temperature of a resistive element having a material with a Curie temperature includes generating a standard resistance-temperature (R-T) curve for the resistive element in isothermal conditions to identify values of the R-T curve and an inflection point at the Curie temperature, generating operational R-T curves for the resistive element over an operational time period, comparing the standard R-T curve to the operational R-T curves, and adjusting the operational curves to the standard R-T curve at the Curie temperature to calibrate temperature of the resistive element.

An electronic component module with leads includes an electronic component including terminal electrodes at both ends of the electronic component body, and first and second leads including metal wires covered with insulating members and arranged side-by-side, the first and second leads are electrically connected to the terminal electrodes, wherein exposed metal wire portions where the metal wires are exposed respectively from the first and second leads are provided on joint surfaces of the first and second leads on a same side and used to join to the terminal electrodes, the exposed metal wire portion of the first lead and the exposed metal wire portion of the second lead are spaced apart from each other by a predetermined interval in a lead length direction, the terminal electrodes are electrically connected to the metal wire exposed portions of the first and second leads, respectively, by solder.

A device having a first terminal region and a second terminal region. The first terminal region includes fine-tune (FT) metal stripes that are separated from each other by a first distance along the longitudinal direction. The second terminal region is spaced apart from the first terminal region by at least an inter-terminal distance. The second terminal region includes coarse-tune (CT) metal stripes that are separated from each other by a second distance along the longitudinal direction. The second distance is greater than the first distance, and the inter-terminal distance greater than the second distance. Each of the FT metal stripes may be selected as a first access location, and each of the CT metal stripes may be selected as a second access location. A pair of selected first and second access locations access a sheet resistance defined by a distance therebetween.

A base having electrical conductivity and a plate shape for a semiconductor device evaluation jig has a front surface which includes a mount region where a semiconductor device is to be mounted. In this mount region, the base has a through hole extending through the base. A temperature detecting element is attached to the base. An electrode pad is electrically connected to the temperature detecting element and formed in the front surface side.

A positive temperature coefficient (PTC) heater apparatus is provided. The PTC heater apparatus includes a PTC heater, a resistance temperature detector (RTD) sensor mounted to the PTC heater and a controller logic unit electrically connected to the RTD sensor to receive readings of the RTD sensor, which, when the PTC heater is powered on, indicate whether the PTC heater is faulty.

A connection assembly includes an adapter to be mounted to a rear part of a subsea sensor, a sensor port being located in the adapter, through which at least a first and a second sensor connection are led to the subsea sensor; a first port for providing a connection to a first of the subsea cables; and a second port for providing a connection to a second of the subsea cables. A first penetrator is arranged in the first port to provide a liquid tight seal between an interior space of the adapter and a duct connected to the first port leading the first sensor connection through the first port, and a second penetrator is arranged in the second port providing a liquid tight seal between the interior space of the adapter and a duct connected to the second port and leading the second sensor connection through the second port.