A thermal sensor in some embodiments comprises two temperature-sensitive branches, each including a thermal-sensing device, such as one or more bipolar-junction transistors, and a current source for generating a current density in the thermal-sensing device to generate a temperature-dependent signal. The thermal sensor further includes a signal processor configured to multiply the temperature-dependent signal from the branches by respective and different gain factors, and combine the resultant signals to generate an output signal that is substantially proportional to the absolute temperature the thermal sensor is disposed at.

A sensor sheet includes unit sensor sheets configured to detect a physical property value at multiple points on a sensor layer, each unit sensor sheet including a first substrate, and an electrode layer and the sensor layer sequentially formed on one side of the first substrate; and a wiring substrate to which the unit sensor sheets are configured to be coupled, the wiring substrate including a second substrate, and a plurality of wirings provided on one side of the second substrate. One side of the wiring substrate and one side of each unit sensor sheet are facing each other. A conductive bonding member configured to electrically couple each unit sensor sheet and the wiring substrate with each other, is included between the electrode layer of each unit sensor sheet and at least one of the wirings of the wiring substrate.

An electronic device includes: a base substrate including an active region, which includes a sensing region, and a peripheral region adjacent to the active region; an input sensor including a sensing insulating layer, a plurality of first sensing electrodes, a plurality of second sensing electrodes, the second sensing electrodes being spaced apart from the first sensing electrodes; and a pressure sensor including a plurality of strain sensing patterns overlapping the sensing region, and strain connection patterns connecting the strain sensing patterns to each other, wherein each of the first sensing electrodes comprises a plurality of first sensing patterns overlapping the active region, each of the second sensing electrodes comprises a plurality of second sensing patterns overlapping the active region and on a same layer as the first sensing patterns, and a plurality of second connection patterns connecting the second sensing patterns.

Provided is a temperature sensor film comprising a metal-thin film patterned on a resin film substrate, and having high temperature measurement accuracy. A conductive film (102) that is used for producing a temperature sensor film has a nickel thin film (10) on one principal surface of a resin film substrate (50). It is preferable that the interplanar spacing of nickel (111) plane in the nickel thin-film is less than 0.2040 nm. The temperature sensor film is obtained by patterning the nickel thin film to form a temperature-measuring resistance part and a lead part connected to the temperature-measuring resistance part.

Provided is a temperature sensor film comprising a metal-thin film patterned on a resin film substrate, and having high temperature measurement accuracy. A conductive film (102) that is used for producing a temperature sensor film has a nickel thin film (10) on one principal surface of a resin film substrate (50). It is preferable that the interplanar spacing of nickel (111) plane in the nickel thin-film is less than 0.2040 nm. The temperature sensor film is obtained by patterning the nickel thin film to form a temperature-measuring resistance part and a lead part connected to the temperature-measuring resistance part.

A wearable environmental sensor device includes a temperature/humidity sensor disposed on a wall surface of a housing that is exposed to an environment and configured to measure ambient environmental information around a living body, and a protective structure formed around the temperature/humidity sensor. The temperature/humidity sensor is disposed, directly or via a support structure, on or over the wall surface of the housing, wherein the wall surface faces substantially downward from the living body when the wearable environmental sensor device is attached to the living body and the living body is in a standing posture. The protective structure has respective ventilation holes provided in two or more pairs of opposed surfaces thereof each facing in a direction other than a vertical direction of the living body when the wearable environmental sensor device is attached to the living body and the living body is in the standing posture.

A wearable environmental sensor device includes a temperature/humidity sensor disposed on a wall surface of a housing that is exposed to an environment and configured to measure ambient environmental information around a living body, and a protective structure formed around the temperature/humidity sensor. The temperature/humidity sensor is disposed, directly or via a support structure, on or over the wall surface of the housing, wherein the wall surface faces substantially downward from the living body when the wearable environmental sensor device is attached to the living body and the living body is in a standing posture. The protective structure has respective ventilation holes provided in two or more pairs of opposed surfaces thereof each facing in a direction other than a vertical direction of the living body when the wearable environmental sensor device is attached to the living body and the living body is in the standing posture.

A sensor module includes a first strain gauge including a first resistor, a second strain gauge including a second resistor, and a flexure element. The first strain gauge has the same characteristic as the second strain gauge. The first strain gauge and the second strain gauge are respectively disposed toward the same surface of the flexure element, via layers each of which has a different linear expansion coefficient.

The present disclosure relates to a method for manufacturing an apparatus for determining and/or monitoring temperature of a medium comprising method steps as follows: arranging a sensor element in a sensor head, producing a vacuum in an internal volume of the sensor head, introducing at least one fill material into at least a portion of the internal volume of the sensor head, and closing the sensor head. The present invention relates, moreover, to a correspondingly manufactured apparatus.

A power module. The power module includes a substrate and at least one power transistor arranged on a bottom side of the substrate. The power module includes at least one power connection connected to the substrate. A conductor loop for measuring temperature is arranged on an inner or outer substrate layer or a top side opposite the power transistor.