Thin films of precious metals such as platinum and gold have the required ability to withstand high temperatures, but in pure form can suffer from grain growth, agglomeration and dewetting at high temperature. Grain boundaries must therefore be pinned by alloying with other metals and/or by inclusion of non-metallic nanoparticles. While such bulk materials are known in the prior art, they have not existed previously as printable inks that can be deposited by additive manufacturing direct-write methods. These materials have been formulated for the first time as alloy and composite inks so that they may be applied by direct-write additive manufacturing techniques directly onto three-dimensional components or on high temperature substrates that can be adhered to complex components.

A wiring board includes an insulating substrate composed of a stack of a plurality of insulating layers, the insulating substrate having an upper face, a lower face, and side faces; and a plurality of line conductors formed of platinum or a metallic material comprising platinum as a main component, the plurality of line conductors each including a first end and a second end located on a side opposite to the first end, the plurality of line conductors being respectively disposed in interlayers between the plurality of insulating layers, in the line conductors, a line width of a line conductor located in an interlayer among the interlayers which interlayer is closest to the upper face or the lower face of the insulating substrate being greater than a line width of a line conductor located in each of the other interlayers.

Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

The present invention measures a temperature of a heating element and includes a first insulating layer having an electrical insulating function; a sensor electrode provided on an upper side of the first insulating layer and having a change in intensity of a current according to a change in heat generated by the heating element; and a second insulating layer covering an upper side of the sensor electrode, wherein the sensor electrode is disposed in parallel with the first insulating layer and having a plurality of bent portions from one end of the sensor electrode to the other end of the sensor electrode.

The invention relates to a method of measuring the temperature of a coiled component comprising the injection of a known DC current into a gauge wire (1) made of resistive material, the resistance of the gauge wire varying with temperature according to a known law, the measurement of potential difference between the terminals (7a, 7b) of said gauge wire, and a step of calculation transforming the potential difference into a mean temperature of the gauge wire, said gauge wire (1) being wound inside the coil, and arranged as a series of “outbound” turns (5) and a series of “inbound” turns (6) associated pairwise with a geometry and a position that are substantially equal. It also relates to a component made in order to be able to implement this method and the measurement device as a whole.

A temperature sensor comprising a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers, one of the temperature sensor elements is heatable, and from each temperature sensor element at least one connection wire leads away, which is connected with a circuit board. The circuit board is arranged in the housing chamber. The circuit board is positioned in the housing chamber by a snap-in connection. A connection wire of a first temperature sensor element is led with strain relief in a first direction through the circuit board and connected with such. The housing chamber contains at least a first elastic body. The circuit board has a first number of cavities, for connection of connection wires and/or cables and a second number of cavities, for reducing thermal expansion of the circuit board. Also presented is a thermal, flow measuring device.

A temperature sensor comprising a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers, one of the temperature sensor elements is heatable, and from each temperature sensor element at least one connection wire leads away, which is connected with a circuit board. The circuit board is arranged in the housing chamber. The circuit board is positioned in the housing chamber by a snap-in connection. A connection wire of a first temperature sensor element is led with strain relief in a first direction through the circuit board and connected with such. The housing chamber contains at least a first elastic body. The circuit board has a first number of cavities, for connection of connection wires and/or cables and a second number of cavities, for reducing thermal expansion of the circuit board. Also presented is a thermal, flow measuring device.

In a temperature sensitive element, a covering member containing a glass as a main component and having a thermal expansion coefficient smaller than that of output lines is provided on pads to cover at least portions of output lines located on the pads. The pads are formed of a glass-based material which contains, as main components, a metal and a glass having a thermal expansion coefficient smaller than that of a ceramic substrate, and the thermal expansion coefficient of the pads is set to be smaller than that of the output lines. Accordingly, in the case where the temperature sensitive element is exposed to a temperature change between a high temperature and ordinary temperature, compressive stress can be applied to the output lines by the covering member and the pads. Thus, the fixing force between the output lines and the pads can be increased.

In a temperature sensitive element, a covering member containing a glass as a main component and having a thermal expansion coefficient smaller than that of output lines is provided on pads to cover at least portions of output lines located on the pads. The pads are formed of a glass-based material which contains, as main components, a metal and a glass having a thermal expansion coefficient smaller than that of a ceramic substrate, and the thermal expansion coefficient of the pads is set to be smaller than that of the output lines. Accordingly, in the case where the temperature sensitive element is exposed to a temperature change between a high temperature and ordinary temperature, compressive stress can be applied to the output lines by the covering member and the pads. Thus, the fixing force between the output lines and the pads can be increased.

The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.