Pressure sensor systems that include a pressure sensor die and other components in a small, space-efficient package, where the package allow gas or liquid to reach either or both sides of a membranes of the pressure sensor die. A package can include a substrate and a cap, where either or both the substrate and the cap divide the package internally into two chambers. The substrate can have a solid bottom layer, a middle layer having a slot or path running a portion of the length of the layer, and a top layer having two through-holes that provide access to the slot or path. The cap can have two ports. A first port can lead to a first chamber where a top side of a pressure sensor is in the first chamber. A second port can lead to a second chamber and the slot or path, where the slot or path leads to a bottom side of the pressure sensor.

[Problem] To provide a pressure sensor that has a plurality of detection parts in a lamination direction, and moreover has improved detection accuracy. [Solution] A pressure sensor 10 has a membrane 22 in which deformation corresponding to pressure occurs, a first gauge layer 40 which is formed on the membrane 22, an intermediate insulation layer 50 which is formed on the first gauge layer 40, and a second gauge layer 60 which is formed on the intermediate insulation layer 50. The first gauge layer 40 and the second gauge layer 60 respectively include a first detection part 42 and a second detection part 62 which detect the deformation of the membrane. The distance from the surface of the membrane 22 to the second detection part 62 is no more than 30 μm.

A pressure-sensor assembly (1) for detecting the pressure of a fluid comprises:—- a pressure- sensitive component (2), having a generally cup-shaped sensor body (5), which includes a bottom portion (5a) and a peripheral portion (5b) that define an axial cavity (C.sub.1, C.sub.2), the bottom portion (5a) including an elastically deformable membrane part, which closes the axial cavity (C.sub.1, C.sub.2) at one end of the sensor body (5), and the peripheral portion (5b) having a distal edge opposite to the bottom portion (5a), which delimits an inlet of the axial cavity (C.sub.1, C.sub.2), the bottom portion (5a) having associated thereto at least one element for detecting deformation of the membrane part; and - a compensation element (3), configured for compensating possible variations of volume of the fluid, comprising at least one compensation body (8), made of a first elastically deformable or compressible material, and a core (9) fixed on which is the at least one compensation body (8), the core (9) being made of a second material stiffer than the first material. The sensor body (5) and the compensation

A pressure sensor comprises a substrate and a conductive layer disposed on the substrate and a spacer layer having a thickness larger than the thickness of the conductive layer. The pressure sensor also comprises an elastic membrane connected to the spacer layer, which overlays the conductive layer with the spacer layer providing a space therebetween and a sensing electrode layer arranged on a lower surface of the elastic membrane and spaced apart from the conductive layer. The sensing electrode layer forms at least two electrodes opposed and spaced apart from each other. The two electrodes are respectively connected to respective connectors and contact the conductive layer in response to an applied pressure on the elastic membrane. Each electrode transmits an output signal of resistance data to a processor through the respective connector.

A thermoresistive micro sensor device includes a semiconductor chip; a through hole, which runs through the semiconductor chip from an upper side to a lower side; electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip; an electrically insulating arrangement for electrically insulating the electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; and a contact arrangement including contacts, wherein each of the contacts is electrically connected to one of the first end sections or one of the second end sections, so that electrical energy is fed to at least one of the electrically conductive structures to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures is measured at the contact arrangement.

An interface pressure sensor includes a fluid pressure sensor disposed in a volume defined by a shear wall. The volume is enclosed, and the fluid pressure sensor is encapsulated by, an infill material. The infill material defines a sensing surface that, when pressed, can impart a force that is detectable by the fluid pressure sensor.

A semiconductor pressure sensor includes: a first silicon substrate including a first recessed part; and a second silicon substrate including a diaphragm covering a first space in the first recessed part, the second silicon substrate being configured to hermetically seal the first space. In cross-section, a plurality of second spaces are hermetically sealed in a state of being separated away from the first space between the first silicon substrate and the second silicon substrate, and are provided in one of or each of a first end side and a second end side of the first space.

A method of fabricating a plurality of individual microelectromechanical transducer elements includes forming a plurality of microelectromechanical transducer elements on a wafer. Each microelectromechanical transducer element has a sensitive region with a membrane and a sensing element monitoring at least one measurand and generating an electrical signal correlated with the at least one measurand, and an electrical contact outputting the electrical signal. The method includes providing, for each microelectromechanical transducer element, a sealing structure around a sensitive region and an electrical connection connected to the electrical contact. The sealing structure and the electrical connection are made out of a reflow solder material. The method includes dicing the wafer to form individual microelectromechanical transducer elements.

Provided is a pressure detection device including a pressure detection unit configured to detect a pressure to be transmitted to a pressure sensor, and a flow channel unit on which the pressure detection unit is disposed. The pressure detection unit) includes a pressure sensor and a conductive protective film disposed in contact with the pressure sensor, the conductive protective film breaking contact between the pressure sensor and a fluid. The conductive protective film is formed of a conductive fluororesin material including a fluororesin material and a conductive material dispersed in the fluororesin material and is connected to a ground portion maintained at a ground potential.

The present disclosure relates to differential pressure transducers. The teachings thereof may be embodied in diaphragm-beam configurations for measuring small values of differential pressure and/or a bridge circuit for converting mechanical strains into an electric output signal. For example, a diaphragm-beam structure for measuring differential pressure may include: a frame; a paddle; a resilient beam member; a diaphragm; and a gap defined between the paddle and the frame. The diaphragm flexes under pressure on one surface. The resilient beam member anchors the paddle to the frame. The second surface of the diaphragm is mounted to the first surface of the paddle and the frame to bridge the gap. The paddle moves due to flexure of the diaphragm. The resilient beam member bends due to movement of the paddle. The thickness of the diaphragm is less than 50 micrometers.