A pressure sensor includes: a pressure sensor element; an adapter integrally attached to the pressure sensor element and defining therein a hole where a pressure of a fluid to be measured is introduced to the pressure sensor element; a fitting member having a housing recess housing the adapter and connectable to a connected member; and a pressing member pressing a valve of the connected member and defining a communicating path through which a flow path where the pressure of the fluid is introduced is in communication with the hole of the adapter. The fitting member is made of a synthetic resin. An O-ring is interposed between a circumferential surface of the adapter and the fitting member. The adapter is a synthetic resin member, and includes a contact portion brought into contact with the adapter and a pressing portion pressing the valve. The pressing member is welded to the fitting member.

An electronic part (air pressure detecting device) 1 includes a sensor element (air pressure sensor element) 2 that includes an ambient air contacting surface S including an ambient air contacting region Sa to be exposed to ambient air, and a supporting substrate 4, arranged to support the sensor element 2. The sensor element 2 is bonded to one surface 4a of the supporting substrate 4 in a state where its ambient air contacting surface S faces the one surface 4a of the supporting substrate 4 and a gap, through which the ambient air flows, is formed between the ambient air contacting surface S and the one surface 4a of the supporting substrate 4.

According to embodiments of the present invention, a sensor for determining a flow parameter of a fluid is provided. The sensor includes a polymer membrane, an elongate microstructure extending from the polymer membrane, and a hydrogel coupled to at least a portion of the elongate microstructure, wherein the hydrogel and the elongate microstructure are arranged to cooperate to cause a displacement of the polymer membrane in response to a fluid flowing and interacting with the sensor, and wherein the sensor is configured to provide a measurement indicative of a flow parameter of the fluid based on the displacement of the polymer membrane. According to further embodiments of the present invention, a method for forming a sensor and a method of controlling a sensor are also provided.

Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.

According to one embodiment, a pressure sensor includes a film portion, a sensor unit, and a structure body. The film portion has a front surface and is deformable. The sensor unit includes a plurality of sensing elements arranged along the front surface. One of the plurality of sensing elements includes a magnetic layer, a opposing magnetic layer, and a nonmagnetic intermediate layer. The structure body is arranged with the first sensor unit along the arrangement direction of the plurality of sensing elements. The structure body includes a structure body layer, a opposing structure body layer, and a intermediate structure body layer. The structure body layer has at least one of a floating potential with respect to the opposing structure body layer or same potential as a potential of the opposing structure body layer.

A pressure detecting device is mounted in a measurement target and instrument includes a strain inducer to which pressure of a pressure medium is applied and which generates strain in accordance with the pressure and a strain detecting element that is bonded onto a surface opposite to a pressure receiving surface of the strain inducer, in which the strain detecting element includes one or multiple central strain resistant bridges which are arranged at a central portion of the strain detecting element in a bonded surface direction, and one or multiple outer peripheral strain resistant bridges which are arranged at an outer periphery, and in which, for example, deformation of the strain detecting element caused by an external force when being screw-fixed to the measurement target instrument is obtained through the multiple strain resistant bridges. An error of detection pressure caused by the deformation in a pressure value detected through the central strain resistant bridge is corrected.

A sensor for detecting pressure and/or filling level and/or flow rate and/or density and/or mass and/or temperature, wherein a sensor component is coupled to a further sensor component by nanowires, and wherein the sensor components are fixed, sealed or electrically contacted to one another. For example, a sensor component is connected directly to a printed circuit board through nanowires.

Pressure sensors having vertical diaphragms or membranes. A vertical diaphragm may be located in a first silicon wafer between a first and second cavity, where the first and second cavities are covered by a second silicon wafer. One or more active or passive devices or components may be located on a top of the vertical diaphragm.

A microelectromechanical system (MEMS) strain gauge pressure sensor includes a top wafer stack having a top surface and a first cavity that is configured to receive a first fluid at a first pressure, a backing wafer having a bottom surface opposite the top surface of the top wafer stack; a diaphragm wafer positioned between the top wafer stack and the backing wafer and having a second cavity that is configured to receive a second fluid at a second pressure, and a pedestal connected laterally to the top wafer stack, the backing wafer, and the diaphragm wafer. The diaphragm wafer includes a diaphragm extending between the first cavity and the second cavity, and a resistor positioned on the diaphragm. The MEMS strain gauge pressure sensor has a central axis such that the MEMS strain gauge pressure sensor has mechanical symmetries about the central axis.

A sensor has an electronic chip and a sensor chip which are arranged within a functional volume which is at the most 4-5 mm long, a maximum 2-3 mm wide, and the maximum height is 0.5-0.8 mm, thereby potentially providing a compact sensor.