Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

A pressure sensor which detects a combustion pressure of an engine includes: a contact part which is in direct or indirect contact with a casing of the engine when the pressure sensor is attached to the engine; and a pressure detection unit which detects the combustion pressure and outputs a signal corresponding to the combustion pressure, wherein the pressure detection unit includes a pressure detection element which detects the combustion pressure and outputs a signal, and a circuit unit which converts the signal obtained from the pressure detection element into a signal corresponding to the combustion pressure, and the pressure detection unit is provided at a location positioned more inside the engine than the contact part when the pressure sensor is attached to the engine.

The example embodiment relates to a pressure measuring unit for determining the oil pressure in a motor vehicle transmission, including a circuit carrier, a pressure sensor, an electrical interface, a mechanical interface and a hydraulic interface. The pressure sensor is electrically connected to the circuit carrier by means of the electrical interface and mechanically connected to the circuit carrier by means of the mechanical interface on the first side of the circuit carrier. The hydraulic interface connecting the pressure measuring unit to a user hydraulic component is arranged on a side of the circuit carrier that is situated opposite the first side, and wherein an opening is arranged in the circuit carrier for pressure equalization between the pressure sensor and the hydraulic interface.

Pressure measuring device, comprising a connector extending along a longitudinal direction around a central longitudinal axis, the connector comprising a first longitudinal end intended to be fixed to an element containing pressurized gas, and a second longitudinal end provided with a diaphragm intended to be subjected to the pressure, the diaphragm comprising a pressure sensor of the piezoelectric type generating an electrical signal representative of the pressure measured, the pressure sensor being connected to an electronics board comprising electronic logic for processing the electrical signal of the sensor, the device furthermore comprising a transmission/reception antenna of the radiofrequency type fitted on the electronics board in order to receive and transmit data from and to the electronic logic, the electronics board being housed in a protective casing fixed to the connector, wherein the antenna is located on or adjacent to an axis passing through the central longitudinal axis of the connector.

A pressure sensor includes an SOI substrate which has a first silicon layer, a second silicon layer placed on one side of the first silicon layer, and a silicon oxide layer placed between the first and second silicon layers, and a concave section which opens to the surface on the first silicon layer side of the SOI substrate, wherein in a plan view of the SOI substrate, a portion overlapping the concave section of the SOI substrate becomes a diaphragm which is flexurally deformed by receiving a pressure, and the second silicon layer is exposed on the bottom surface of the concave section.

A pressure sensor includes a sensor element, an inner frame configured to receive at least a portion of the sensor element, and a housing configured to receive the inner frame therein. The inner frame is formed of a metal material and includes a printed circuit board assembly to be electrically connected to the sensor element. The housing is formed of a resin material.

The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.

The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.

In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

A sensor for detecting pressure and/or filling level and/or flow rate and/or density and/or mass and/or temperature, wherein a sensor component is coupled to a further sensor component by nanowires, and wherein the sensor components are fixed, sealed or electrically contacted to one another. For example, a sensor component is connected directly to a printed circuit board through nanowires.