A support unit for a circuit board in a sensor unit comprises a main body that defines an outer contour and includes a first joining geometry and a second joining geometry. The first joining geometry is configured to at least one of guide and electrically contact external contact elements, and includes contact receiving pockets configured to guide the external contact elements, and at least one reinforcement web that separates two adjacent contact receiving pockets. The second joining geometry is configured to join the support unit to the circuit board. The first joining geometry defines at least in part an external interface via which at least one electrical output signal of the circuit board is tapped.

A differential pressure sensor comprises a cavity having a base including a base electrode and a membrane suspended above the base which includes a membrane electrode, wherein the first membrane is sealed with the cavity defined beneath the first membrane. A first pressure input port is coupled to the space above the sealed first membrane. A capacitive read out system is used to measure the capacitance between the base electrode and membrane electrode. An interconnecting channel is between the cavity and a second pressure input port, so that the sensor is responsive to the differential pressure applied to opposite sides of the membrane by the two input ports.

A support (17) for an electronic module (7) for generating a signal, this module being intended to be inserted into a sensor (1) for measuring the pressure of the gases contained in a vehicle cylinder, the support (17) including a portion (19) for receiving the electronic module (7) and elements (25) for retaining the electronic module (7) on the receiving portion (19), the electronic module (7) including a body (8), the receiving portion (19) including elements (31a, 31b) for attaching the retaining elements (25), and the retaining elements (25) being configured to pivot between an open position (PO) in which the electronic module (7) can be placed on the receiving portion (19) and a closed position in which the retaining elements (25) are attached to the attachment elements (31a, 31b) in order to retain the body (8) of the electronic module (7) on the support (17).

A pressure sensor has a circuit arrangement supported by a sensor body and includes: a first electrical-circuit pattern, having respective tracks made of electrically conductive material deposited on a first face of an electrically insulating material, a second electrical-circuit pattern having respective tracks made of electrically conductive material deposited on a region of the second face of the material, and connection means, which electrically connect the first electrical-circuit pattern to the second electrical-circuit pattern. Tracks of the second electrical-circuit pattern have at least one first track defining a plurality of first pads and one second track defining a plurality of second pads, for connection of a first terminal and of a second terminal of the second circuit component, respectively. The first and second track are prearranged so that the first terminal and the second terminal can be connected to any one of the first pads and the second pads.

A sensor for detecting pressure, filling level, density, temperature, mass and/or flow rate, wherein at least one central sensor component is coupled to a further component by nanowires and wherein the sensor component is stiffened, fixed and/or electrically contacted this way.

Methods, apparatuses and systems for providing pressure sensing components for apparatuses are disclosed herein. An example pressure sensing component may comprise: a pressure sensing element defining a microfluidic channel containing a pressure transfer fluid configured to absorb a pressure of a media applied to the pressure sensing element, wherein at least one dimension of the microfluidic channel is in a micrometer range; and a pressure measuring element in electronic communication with the pressure sensing element, wherein the pressure measuring element is configured to convert a pressure of a media absorbed by the pressure sensing element into a measurable electrical signal.

A pressure sensor system having at least one pressure sensor device. The pressure sensor device has a stack having a ceramic substrate, at least one signal processing element, and at least one sensor element. The pressure sensor device is placed in a sensor housing provided with a membrane, and a residual volume of the sensor housing provided with the membrane is filled with an incompressible fluid. A method for producing such a pressure sensor system, and to a measuring device, are also described.

Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

A pressure sensor that includes a housing with an upper housing part and a lower housing part, the upper housing part and the lower housing part being configured such that a chamber is formed between them. A diaphragm is provided between the upper housing part and the lower housing part, and dividing the chamber into an upper chamber and a lower chamber. A magnetic core is linked to the diaphragm. An operating spring includes a top end and a bottom end, the top end being supported against the upper housing part and the bottom end being supported against the magnetic core. At least one of the top end and the bottom end of the operating spring is provided with an adhesive layer. The pressure sensor enables the operating spring and the magnetic core to move integrally with each other, thereby improving the precision of the pressure sensor.

A semiconductor device includes a base substrate, a detection device provided on the base substrate and including a detector, a first connector electrically connecting the base substrate and the detection device, and a resin package provided on the base substrate and embedded with the detection device and the first connector. The resin package includes an exposure hole exposing the detector of the detection device to the outside, and a concave-convex portion.