A pressure sensor comprises a sensor housing, a diaphragm provided in the sensor housing, and a snubber insertable into the sensor housing. The sensor housing includes a coupler coupling with a pressure measurement target and a housing passage passing through the coupler and guiding a fluid that flows into the sensor housing from the pressure measurement target. The diaphragm is deformable by a pressure of the fluid that flows into the sensor housing from the pressure measurement target. The snubber is inserted into the sensor housing through the housing passage and fastens to the sensor housing in a state in which at least a portion of the sensor housing forming the housing passage is deformed. The snubber guides flow of the fluid and transmits the pressure of the fluid to the diaphragm.

A pressure sensor assembly and method for manufacturing a pressure sensor assembly is disclosed and includes a pressure responsive component having a pressure sensitive element and an output signal generator disposed on a common substrate. The substrate has an aperture extending completely there through and the pressure sensitive element is disposed in communication with the aperture. The aperture is open to the ambient environment. The pressure responsive component is received in a connector which is received in a housing. Multiple seal structures isolate the pressure responsive component within the housing.

A pressure sensor detects a pressure of a pressure transmitting medium. The pressure sensor includes a sensor substrate and a protection film. The sensor substrate includes a recess recessed relative to a periphery thereof and a thin portion thinner than the periphery due to the recess. The protection film is provided on a bottom surface of the recess that is one side of the thin portion and a part of a lateral surface of the recess, and the protection film suppresses an adhesion of a contamination contained in the pressure transmitting medium. The pressure sensor includes an adhesion suppressing portion that includes an uneven section formed in at least a part of the lateral surface, and a liquid repellent film repellent to liquid in the pressure transmitting medium and provided as the protection film on the uneven section to exhibit a lotus effect.

Sensor assemblies and systems comprise a housing configured to accommodate an electrical sensor device therein, mechanically retain the same, and provide a protective surrounding thereto. The housing may include display indicia relating to some aspect of the sensor assembly. The electrical sensor device include electrical components useful for the purpose of monitoring and transmitting desired data relating to operating parameters/conditions of the dynamic article that the sensor assembly is attached with, e.g., a vehicle tire. The data is transmitted wirelessly from the electrical sensor device. The housing is removably attached with a retaining member that is also attached with the dynamic article. A receiver external from the dynamic article receives the data for the purpose of determine such operating parameter/or conditions, when the dynamic article is a vehicle tire, as tire tread depth, tire pressure, vehicle camber and toe alignment variations, and tire/vehicle location, which may be stored.

An embodiment can provide a torque sensor comprising: a housing; a rotor that is arranged inside the housing; a stator that is arranged on an outer side of the rotor; a circuit board that is arranged in the housing; a Hall-effect sensor that is arranged on the circuit board; and a collector that is arranged adjacent to the Hall-effect sensor, wherein the collector includes a body portion and an extension portion extending from the body portion, the body portion is arranged to be spaced apart from the housing, and the extension portion is directly in contact with the housing.

A method of monitoring microelectromechanical system (MEMS) pressure sensors arranged on a carrier includes: generating a first measurement value by a first MEMS pressure sensor arranged on the carrier; generating a second measurement value by a second MEMS pressure sensor arranged on the carrier; and determining, by an integrated circuit, whether the first measurement value of the first MEMS pressure sensor corresponds to the second measurement value of the second MEMS pressure sensor in accordance with a predefined criterion, wherein the integrated circuit is arranged on the carrier and is coupled to the first MEMS pressure sensor and the second MEMS pressure sensor.

A pressure sensor for detecting a pressure of a fluid medium in a measuring chamber and a method for manufacturing the pressure sensor are provided. The pressure sensor includes a pressure connector, with the aid of which the pressure sensor is attachable to or in the measuring chamber, and a sensor element for detecting the pressure of the fluid medium. A feed channel is formed in the pressure connector. The sensor element is situated on a substrate. The feed channel is sealed off by the substrate and is designed to feed the fluid medium to the sensor element. The pressure connector and the substrate are designed as one piece and the sensor element is printed onto the substrate.

A pressure sensing module for an electronic device includes a substrate and a module housing coupled to the substrate. The module housing defines a first chamber and a second chamber. The second chamber is separate from the first chamber. The first chamber is configured to connect to an environment around an electronic device. The second chamber is configured to connect to an internal volume of the housing of the electronic device. A first pressure sensing element is electrically coupled to the substrate and disposed in the first chamber and is operative to detect an external pressure around the electronic device. A second pressure sensing element is electrically coupled to the substrate and disposed in the second chamber and is operative to detect an internal pressure within the electronic device housing.

A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.