Optical fabrication monitor structures can be included in a design fabricated on a wafer from a mask or fabrication reticle. A first set of components can be formed in an initial fabrication cycle, where the first set includes functional components and monitor structures. A second set of components can be formed by subsequent fabrication processes that can potentially cause errors or damage to the first set of components. The monitor structures can be implemented during fabrication (e.g., in a cleanroom) to detect fabrication errors without pulling or scrapping the wafer.

An integrated circuit comprises: at least one photonic layer that includes one or more optical waveguides; a first optical coupler that couples at least a first optical mode outside of the photonic layer to a first waveguide in the photonic layer; a photonic device that includes one or more ports in the photonic layer; a first multi-port optical coupler that includes three or more ports in the photonic layer, including a first port optically coupled to the first optical coupler, a second port optically coupled to a first port of the photonic device, and a third port optically coupled to a first optical reflector configured to send substantially all optical power emitted from the third port of the first multi-port optical coupler back to the third port of the first multi-port optical coupler.

The systems and methods disclosed herein are used to estimate the insertion loss of an anticipated optical connection between a first optical connector having least one first optical fiber and a second optical connector having at least one second optical fiber. The method includes extracting first connector information stored on the first optical connector to obtain extracted first connector information and extracting second connector information stored on the second optical connector to obtain extracted second connector information. The estimated insertion loss of the anticipated optical connection between the first optical connector and the second optical connector is calculated using the extracted first connector information and the extracted second connector information. The total estimated insertion loss of a fiber link that includes one or more such optical connections can be used to qualify the fiber link without having to directly measure the fiber link insertion loss.

An optical fiber characteristic measurement apparatus (1) includes: a light source (11) configured to output a laser beam of which frequency is modulated; an incident part (12, 13, 14, and 15) configured to make the laser beam output from the light source be incident from one end and another end of an optical fiber (FUT) as continuous light (L1) and pulsed light (L2), respectively; a light detector (16) configured to detect light projected from the optical fiber and output a detection signal (D1); and a detector (17 and 18a) configured to detect, in a first period (T1) in which scattering light based on the continuous light and the pulsed light is projected from the optical fiber and a second period (T2) shorter than the first period, in which the scattering light is not projected from the optical fiber, the scattering light based on integrated values acquired by integrating the detection signal for a predetermined time.

An optical transmission device includes: a substrate; a waveguide that is provided in the substrate and transmits an optical signal; a signal wiring that is provided in the substrate and transmits an electric signal; and a silicon wiring that is provided in the substrate and is silicon added with an impurity. The signal wiring is placed in an area of the substrate, the area being away from an end of the substrate by a predetermined distance or more. One end of the silicon substrate is connected to the signal wiring, and the other end of the silicon wiring extends to the end of the substrate.

A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

An intermediate signal is separated into a first sub-signal and a second sub-signal according to a separation coefficient having a known real value. The first sub-signal is delivered to a first photonic circuit containing at least one photonic device to be characterized and a first photonic part. The second sub-signal is delivered to a second photonic circuit containing a second photonic part having a same transfer function as the first photonic part but lacking the at least one photonic device. Optical output signals from the first and second photonic circuits are converted into first and second electrical signals. Losses of the at least one photonic device are determined from processing the electrical signals and from the known real value of the separation coefficient.

Beam combining optical systems include a fiber beam combiner having multiple inputs to which output fibers of laser diode sources are spliced. Cladding light stripping regions are situated at the splices, and include exposed portions of fiber claddings that are at least partially encapsulated with an optical adhesive or a polymer. A beam combiner fiber that is optically downstream of a laser source has an exposed cladding secured to a thermally conductive support with a polymer or other material that is index matched to the exposed cladding. This construction permits attenuation of cladding light propagating toward a beam combiner from a splice.

A measurement system includes a measurement device including a light source, and a first power meter, and one or a plurality of connection members each configured to optically connect a pair of optical fiber lines of the plurality of optical fiber lines. A first optical fiber line of the pair of optical fiber lines includes a first end and a second end, a second optical fiber line of the pair of optical fiber lines includes a third end and a fourth end, the one or plurality of connection members optically connect the second end to the fourth end, the light source causes testing light to be incident on the first end, and the first power meter measures first intensity of first output light output from the third end by causing the testing light to propagate through the pair of optical fiber lines.

A pulse testing method and device, a testing apparatus, and a storage medium are disclosed, the pulse testing method includes: performing a pulse test on an optical fiber by using a plurality of pulses of different pulse widths respectively to obtain test data; and fitting the test data corresponding to the plurality of pulses of different pulse widths.