An optical probe for optoelectronic integrated circuits is provided, applicable to a test environment for testing a plurality of optical chips on a wafer. The optical chips include at least one optical waveguide, and the optical probe includes a substrate and an optical fiber. The facet of the optical fiber has a first angle, and the first angle causes the optical signal transmitted by the optical fiber to generate total reflection, and the optical signal after total reflection enters the optical waveguide of the optical chip. Thereby, an optical probe able to perform testing before wafer cutting and polishing is provided, and a high-speed, effective and reliable detection is achieved.

A wavelength checker includes an optical converter composed of a conversion material that converts infrared light into visible light. The optical converter is disposed, on an output side (side from which light is output to an external space) of a plurality of first output waveguides of an optical waveguide chip, to receive emitted light that is guided through the first output waveguides and reflected on and emitted from the light emitting-side end surface. The light emitting-side end surface is a reflection surface that is inclined to face a main substrate.

An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

A method of optical device metrology is provided. The method includes introducing a first type of light into a first optical device during a first time period, the first optical device including an optical substrate and an optical film disposed on the optical substrate, the first optical device further including a first surface, a second surface, and one or more sides connecting the first surface with the second surface; and measuring, during the first time period, a quantity of the first type of light transmitted from a plurality of locations on the first surface or the second surface during the first time period, wherein the measuring is performed by a detector coupled to one or more fiber heads positioned to collect the light transmitted from the plurality of locations.

Embodiments of the present disclosure disclose a waveguide measurement device. The waveguide measurement device comprises: a receiver device comprising a lens, the lens being configured to receive light coupled out of a predetermined region of a waveguide; a fiber optic device configured to conduct light received by the lens; and a detection device coupled to the receiver device via the fiber optic device, the detection device being configured to be able to calculate an intensity of light coupled out of the predetermined region of the waveguide.

An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

The present invention relates to a glass article with low optical loss. The present invention also relates to the use of the glass article, in particular as optical waveguide, for example as light guide plate, in particular in augmented reality devices.

A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Embodiments of the present invention provide an improved method of determining splice losses of mechanically terminated optical connectors in the field, without the need of terminating both sides of the fiber link. Embodiments of the present invention also provide means for improving the quality of mechanical splices as utilized in pre-polished fiber optic connectors for terminating single-mode and multimode optical fibers in the field.

Embodiments described herein relate to apparatus for measuring and characterizing performance of augmented and virtual reality waveguide structures utilizing glass substrates. The waveguide performance measuring systems generally include a light source configured to direct light towards an incoupling grating area on waveguide and one or more light detectors configured to collect light from an outcoupling grating area on a second side of the waveguide. The light source and one or more light detectors are disposed on one or more adjustable stages positioned about the waveguide. In certain embodiments, the one or more adjustable stages are configured to move in a linear fashion or revolve and/or rotate around the waveguide in an orbital motion.