A method of optical device metrology is provided. The method includes introducing a first type of light into a first optical device during a first time period, the first optical device including an optical substrate and an optical film disposed on the optical substrate, the first optical device further including a first surface, a second surface, and one or more sides connecting the first surface with the second surface; and measuring, during the first time period, a quantity of the first type of light transmitted from a plurality of locations on the first surface or the second surface during the first time period, wherein the measuring is performed by a detector coupled to one or more fiber heads positioned to collect the light transmitted from the plurality of locations.

A method, apparatus and system for minimally intrusive fiber identification includes imparting a time-varying modulation onto an optical signal propagating in an optical fiber and subsequently detecting the presence of the time-varying modulation in the optical signal transmitting through the fiber to identify the fiber. In a specific embodiment of the invention, a time-varying curvature is imposed on the fiber to be identified and the presence of the resultant time variation in the transmitted power of a propagating optical signal is subsequently detected for identification of the manipulated fiber.

An optical characteristic of a coupled multi-core optical fiber is evaluated without core alignment, one of plural cores thereof being arranged as a center core at the center of a cladding thereof, a total number of spatial modes being a number of the cores or greater, (a fiber length)(a power coupling coefficient between the cores) being 10 or greater. The coupled multi-core optical fiber is joined to a dummy fiber, having a core at the center of a cladding having the same shape and dimension as those of the coupled multi-core optical fiber, by causing one ends of the fibers to face each other and aligning the fibers with reference to the circumferences of the fibers. Light is launched to the coupled multi-core optical fiber joined to the dummy fiber, and a light measurement unit measures the light passing through the fibers.

Embodiments of the present invention provide an improved method of determining splice losses of mechanically terminated optical connectors in the field, without the need of terminating both sides of the fiber link. Embodiments of the present invention also provide means for improving the quality of mechanical splices as utilized in pre-polished fiber optic connectors for terminating single-mode and multimode optical fibers in the field.

A method, apparatus and system for minimally intrusive fiber identification includes imparting a time-varying modulation onto an optical signal propagating in an optical fiber and subsequently detecting the presence of the time-varying modulation in the optical signal transmitting through the fiber to identify the fiber. In a specific embodiment of the invention, a time-varying curvature is imposed on the fiber to be identified and the presence of the resultant time variation in the transmitted power of a propagating optical signal is subsequently detected for identification of the manipulated fiber.

A method, apparatus and system for minimally intrusive fiber identification includes imparting a time-varying modulation onto an optical signal propagating in an optical fiber and subsequently detecting the presence of the time-varying modulation in the optical signal transmitting through the fiber to identify the fiber. In a specific embodiment of the invention, a time-varying curvature is imposed on the fiber to be identified and the presence of the resultant time variation in the transmitted power of a propagating optical signal is subsequently detected for identification of the manipulated fiber.

Systems and methods for inspecting wound optical fiber to detect and characterize defects are disclosed. The method includes illuminating the wound optical fiber with light from a light source and capturing a digital image based on measurement light that is redirected by the wound optical fiber to a digital camera. The method also includes processing the digital image with a computer to detect and characterize the defects. The types of defects that can be detected using the systems and methods disclosed herein include bubbles, abrasions, punctures, scratches, surface contamination, winding errors, periodic dimensional errors, aperiodic dimensional errors and dents.

An apparatus is provided. The apparatus includes: a first main waveguide, configured to input and output a first optical signal; a first to-be-tested waveguide, configured to couple the first optical signal to generate a second optical signal, and transfer the second optical signal, an optical signal that is reflected by a second fiber Bragg grating, and an optical signal that is reflected by a first fiber Bragg grating. The apparatus also includes the first fiber Bragg grating, configured to totally reflect the optical signal that is reflected by the second fiber Bragg grating; the second fiber Bragg grating, configured to partially transmit and partially reflect the second optical signal and the optical signal that is reflected by the first fiber Bragg grating; and a first photoelectric detector, configured to receive an optical signal that is transmitted by the second fiber Bragg grating of the corresponding first to-be-tested waveguide.

A method, apparatus and system for minimally intrusive fiber identification includes imparting a time-varying modulation onto an optical signal propagating in an optical fiber and subsequently detecting the presence of the time-varying modulation in the optical signal transmitting through the fiber to identify the fiber. In a specific embodiment of the invention, a time-varying curvature is imposed on the fiber to be identified and the presence of the resultant time variation in the transmitted power of a propagating optical signal is subsequently detected for identification of the manipulated fiber.

A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.