Patent classifications
G01N21/55
Inspection method and inspection system for pillar-shaped honeycomb structure
A method for inspecting a pillar-shaped honeycomb structure includes steps of: capturing a pattern of reflected light from an end face with a camera and generating an image data of the pattern of the reflected light; distinguishing positional information of each of cells adjacent to an outer peripheral side wall and cells that are not adjacent to the outer peripheral side wall based on the image data of the pattern of the reflected light, and storing the distinguished positional information in a memory; capturing a pattern of transmitted light from the end face with the camera and generating an image data of the pattern of the transmitted light; measuring intensity of each transmitted light from the cells adjacent to the outer peripheral side wall to detect the cells having defective plugged portions that are adjacent to the outer peripheral side wall based on the generated image data of the pattern of the transmitted light and the positional information; and measuring intensity of each transmitted light from the cells that are not adjacent to the outer peripheral side wall to detect the cells having defective plugged portions that are not adjacent to the outer peripheral side wall based on the generated image data of the pattern of the transmitted light and the positional information.
Inspection method and inspection system for pillar-shaped honeycomb structure
A method for inspecting a pillar-shaped honeycomb structure includes steps of: capturing a pattern of reflected light from an end face with a camera and generating an image data of the pattern of the reflected light; distinguishing positional information of each of cells adjacent to an outer peripheral side wall and cells that are not adjacent to the outer peripheral side wall based on the image data of the pattern of the reflected light, and storing the distinguished positional information in a memory; capturing a pattern of transmitted light from the end face with the camera and generating an image data of the pattern of the transmitted light; measuring intensity of each transmitted light from the cells adjacent to the outer peripheral side wall to detect the cells having defective plugged portions that are adjacent to the outer peripheral side wall based on the generated image data of the pattern of the transmitted light and the positional information; and measuring intensity of each transmitted light from the cells that are not adjacent to the outer peripheral side wall to detect the cells having defective plugged portions that are not adjacent to the outer peripheral side wall based on the generated image data of the pattern of the transmitted light and the positional information.
Method for measuring a height map of a test surface
A method for measuring a height map of a test surface having a varying reflectivity using a multi-sensor apparatus including a pre-scan sensor and a height measuring sensor is disclosed. The multi-sensor apparatus further comprises one or more light sources configured to illuminate the test surface and a spatial light modulator. The spatial light modulator is placed in a light path between the one or more light sources and a measuring location of the multi-sensor apparatus and is configured to modulate light emitted from at least one of the light sources. The method comprises performing a measurement for determining an illumination intensity map of the test surface and a measurement for performing a height map of the test surface.
Method for measuring a height map of a test surface
A method for measuring a height map of a test surface having a varying reflectivity using a multi-sensor apparatus including a pre-scan sensor and a height measuring sensor is disclosed. The multi-sensor apparatus further comprises one or more light sources configured to illuminate the test surface and a spatial light modulator. The spatial light modulator is placed in a light path between the one or more light sources and a measuring location of the multi-sensor apparatus and is configured to modulate light emitted from at least one of the light sources. The method comprises performing a measurement for determining an illumination intensity map of the test surface and a measurement for performing a height map of the test surface.
IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING
Embodiments of the present disclosure generally relate to apparatus, systems, and methods for in-situ film growth rate monitoring. A thickness of a film on a substrate is monitored during a substrate processing operation that deposits the film on the substrate. The thickness is monitored while the substrate processing operation is conducted. The monitoring includes directing light in a direction toward a crystalline coupon. The direction is perpendicular to a heating direction. In one implementation, a reflectometer system to monitor film growth during substrate processing operations includes a first block that includes a first inner surface. The reflectometer system includes a light emitter disposed in the first block and oriented toward the first inner surface, and a light receiver disposed in the first block and oriented toward the first inner surface. The reflectometer system includes a second block opposing the first block.
IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING
Embodiments of the present disclosure generally relate to apparatus, systems, and methods for in-situ film growth rate monitoring. A thickness of a film on a substrate is monitored during a substrate processing operation that deposits the film on the substrate. The thickness is monitored while the substrate processing operation is conducted. The monitoring includes directing light in a direction toward a crystalline coupon. The direction is perpendicular to a heating direction. In one implementation, a reflectometer system to monitor film growth during substrate processing operations includes a first block that includes a first inner surface. The reflectometer system includes a light emitter disposed in the first block and oriented toward the first inner surface, and a light receiver disposed in the first block and oriented toward the first inner surface. The reflectometer system includes a second block opposing the first block.
PECVD process
- Nagarajan Rajagopalan ,
- Xinhai Han ,
- Michael Wenyoung Tsiang ,
- Masaki Ogata ,
- Zhijun Jiang ,
- Juan Carlos Rocha-Alvarez ,
- Thomas Nowak ,
- Jianhua Zhou ,
- Ramprakash Sankarakrishnan ,
- Amit Kumar Bansal ,
- Jeongmin Lee ,
- Todd Egan ,
- Edward Budiarto ,
- Dmitriy Panasyuk ,
- Terrance Y. Lee ,
- Jian J. Chen ,
- Mohamad A. Ayoub ,
- Heung Lak Park ,
- Patrick Reilly ,
- Shahid Shaikh ,
- Bok Hoen Kim ,
- Sergey Starik ,
- Ganesh Balasubramanian
A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.
PECVD process
- Nagarajan Rajagopalan ,
- Xinhai Han ,
- Michael Wenyoung Tsiang ,
- Masaki Ogata ,
- Zhijun Jiang ,
- Juan Carlos Rocha-Alvarez ,
- Thomas Nowak ,
- Jianhua Zhou ,
- Ramprakash Sankarakrishnan ,
- Amit Kumar Bansal ,
- Jeongmin Lee ,
- Todd Egan ,
- Edward Budiarto ,
- Dmitriy Panasyuk ,
- Terrance Y. Lee ,
- Jian J. Chen ,
- Mohamad A. Ayoub ,
- Heung Lak Park ,
- Patrick Reilly ,
- Shahid Shaikh ,
- Bok Hoen Kim ,
- Sergey Starik ,
- Ganesh Balasubramanian
A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.
TEST DEVICE AND METHOD FOR TESTING THE RETROREFLECTION AND/OR FLUORESCENCE OF AN OBJECT
A hand-held test device and a method for testing an object having at least one retrore-flective region and at least one fluorescent region, e.g. an item of high-visibility clothing. The hand-held test device includes a white light LED, a UV LED, a connnon photoreceiver, and a control unit. In a reflection test mode, a reflective region is briefly irradiated with white light and reflects onto the photoreceiver. In at least one fluorescence test mode, ultraviolet light is emitted by the onto a fluorescent region, which generates fluorescent light of a corresponding colour via the fluorescence, which is received by the photoreceiver. In all test modes, a receive sig corresponding with the irradiation strength is generated at the photoreceiver and transmitted to the control unit for evaluation, e.g. for carrying out a threshold value comparison with a predefined threshold value for the receive signal. Every test mode can preferably have a separate predefined threshold value for this purpose.
TEST DEVICE AND METHOD FOR TESTING THE RETROREFLECTION AND/OR FLUORESCENCE OF AN OBJECT
A hand-held test device and a method for testing an object having at least one retrore-flective region and at least one fluorescent region, e.g. an item of high-visibility clothing. The hand-held test device includes a white light LED, a UV LED, a connnon photoreceiver, and a control unit. In a reflection test mode, a reflective region is briefly irradiated with white light and reflects onto the photoreceiver. In at least one fluorescence test mode, ultraviolet light is emitted by the onto a fluorescent region, which generates fluorescent light of a corresponding colour via the fluorescence, which is received by the photoreceiver. In all test modes, a receive sig corresponding with the irradiation strength is generated at the photoreceiver and transmitted to the control unit for evaluation, e.g. for carrying out a threshold value comparison with a predefined threshold value for the receive signal. Every test mode can preferably have a separate predefined threshold value for this purpose.