The present disclosure provides a method for detecting a defect of a film. The method includes obtaining a film image, determining one or more pieces of scratch information corresponding to the film image through processing the film image using a recognition model, the recognition model includes a convolution layer, a regression layer, and a classification layer, determining whether each piece of scratch information in the one or more pieces of scratch information meets a preset condition, each piece of scratch information includes position information, angle information, and size information, in response to a determination that each piece of scratch information meets the preset condition, adding one or more pieces of annotation information to the one or more pieces of scratch information that meets the preset condition, and generating prompt information based on the one or more pieces of annotation information.

Systems, devices, and methods for additive manufacturing are provided that allow for components being manufactured to be assessed during the printing process. As a result, changes to a print plan can be considered, made, and implemented during the printing process. More particularly, in exemplary embodiments, a spectrometer is operated while a component is being printed to measure one or more parameters associated with one or more layers of the component being printed. The measured parameter(s) are then relied upon to determine if any changes are needed to the way printing is occurring, and if such changes are desirable, the system is able to implement such changes during the printing process. By way of non-limiting examples, printed material in one or more layers may be reheated to alter the printed component, such as to remove defects identified by the spectrometer data. A variety of systems, devices, and methods for performing real-time sensing and control of an additive manufacturing process are also provided.

A device for detecting (D) at least one predetermined particle (P) includes an interferometric element (EI) arranged so as to be illuminated by an incident radiation (L.sub.in) and comprising at least one so-called thin layer (CM) disposed on top of a so-called substrate layer (Sub), the particle being attached to a surface (Sm) of the thin layer, the interferometric element (EI) forming a Fabry-Pérot cavity with or without attached particle P; a matrix sensor (Det) adapted to detect an image comprising a first portion (P.sub.1) deriving from the detection of the incident radiation transmitted (L.sub.TBG) by the interferometric element alone and a second portion (P.sub.2) deriving from the detection of the incident radiation transmitted (L.sub.TP) by the interferometric element and any particle (O, P) attached to a surface (Sm) of the thin layer; a processor (UT) linked to the sensor and configured: to calculate, as a function of wavelengths of the incident radiation λ.sub.i i∈[1,m], the variation of intensity of at least one first pixel of the first portion, called first variation (F.sub.BG) and of at least one second pixel of the second portion, called second variation (F.sub.P), to determine a trend, as a function of the wavelengths of the incident radiation λ.sub.i i∈[1,m], of a phase shift ϕ.sub.i between the first variation and the second variation; to detect the attached particle when the phase shift ϕ.sub.i is not constant as a function of the wavelengths of the incident radiation λ.sub.i i∈[1,m].

Disclosed is an instrument analyzing elemental composition of a sample, including a measurement assembly including: an exciter generating an excitation directed at a target position to cause emission from the sample; a detector assembly receiving the emission from the sample at the target position, arranged to generate one or more measurement signals that are descriptive of the emission; an imaging apparatus for capturing images of an area around the target position; and a controller for carrying out a measurement, arranged to operate the exciter to generate the excitation and to carry out analysis of the elemental composition of the sample based on the measurement signals. The controller performs reliability analysis associated with the measurement by operating the imaging apparatus to capture images of the sample, determining estimated reliability of the measurement based on the captured images, and selectively issuing an indication of measurement reliability based on the estimated reliability.

Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.

An object of the present invention is to provide a novel method for diagnosing film degradation which can identify the degraded state of a film based on a resin more efficiently and reliably than ever. In order to attain this object, a method for diagnosing the degradation of a film based on a resin is adopted, the method comprising using the following analysis method A and/or analysis method B, which is a non-destructive analysis method: analysis method A: confirming the presence or absence of abnormality in the film by visual observation and olfactometry, and analysis method B: confirming the presence or absence of an acid anhydride and a sign of hydrolysis reaction as to the film by Fourier transform infrared spectroscopy analysis.

An optical coherence tomography (OCT) system (63) is used to inspect bonding points (66A, 66B, 66C) sandwiched between two materials (layers 62, 64 of e.g. displays). The OCT differentiates between a bonding point, e.g. a weld, and air gaps between the two materials. The bonding points are identified as breaks in the air gap between the materials. By extracting various physical characteristics of the bonding points and the gap between the two materials, the present system determines whether the bonding is faulty.

A system and method for coating marine pipeline weld joints and wet inspection of the applied coating is provided. The coating system includes an anti-corrosion coating including a fluorescent pigment to enhance inspection of the applied coating. The system also includes a robotic crawler for traversing inside the pipe and carrying a coating apparatus and inspection apparatus respectively configured to apply the coating on the weld joints and facilitate inspection of the wet coating. The coating apparatus comprises a spraying nozzle provided on a forward end of the robotic crawler and configured to spray coating onto on the surrounding circumferential pipe surface. The inspection apparatus includes an ultraviolet radiation emitter for activating the fluorescent pigment in the coating and a camera for providing a live image feed of the coated weld joint area to an operator computing station for inspection of the applied coating.

Embodiments of the present disclosure generally relate to apparatus, systems, and methods for in-situ film growth rate monitoring. A thickness of a film on a substrate is monitored during a substrate processing operation that deposits the film on the substrate. The thickness is monitored while the substrate processing operation is conducted. The monitoring includes directing light in a direction toward a crystalline coupon. The direction is perpendicular to a heating direction. In one implementation, a reflectometer system to monitor film growth during substrate processing operations includes a first block that includes a first inner surface. The reflectometer system includes a light emitter disposed in the first block and oriented toward the first inner surface, and a light receiver disposed in the first block and oriented toward the first inner surface. The reflectometer system includes a second block opposing the first block.

A method for measuring the radiant exposure of energy curable inks or coatings on a printing press. The steps for measuring comprise: a) providing an ink or coating material comprising a fluorescent probe; b) transferring the ink or coating material onto a substrate using a printing process; c) exposing the ink or coating material to actinic radiation capable of initiating cure of the ink or coating material that also alters the luminescence of the probe; d) exposing the ink or coating to a first source of excitation light with wavelength and luminance capable of absorption by the fluorescent probe; and e) measuring the emitted light from the fluorescent probe by a first detector.