An evaluation method of a SiC epitaxial wafer includes: a first observation step of preparing a SiC epitaxial wafer having a high-concentration epitaxial layer having an impurity concentration of 1×10.sup.18 cm.sup.−3 or more, irradiating a surface of the high-concentration epitaxial layer having an impurity concentration of 1×10.sup.18 cm.sup.−3 or more with excitation light, and observing a surface irradiated with the excitation light via a band-pass filter having a wavelength band of 430 nm or less.

A method for removing foreign matter from an agricultural product stream of a manufacturing process. The method includes conveying a product stream past an inspection station; scanning a region of the agricultural product stream as it passes the inspection station using at least one light source of a single or different wavelengths; generating hyperspectral images from the scanned region; determining a spectral fingerprint for the agricultural product stream from the hyperspectral images; comparing the spectral fingerprint obtained in step (c) to a spectral fingerprint database containing a plurality of fingerprints using a computer processor to determine whether foreign matter is present and, if present, generating a signal in response thereto; and removing a portion of the conveyed product stream in response to the signal. A system for detecting foreign matter within an agricultural product stream is also provided.

Disclosed are embodiments of an improved apparatus and system, and associated methods for optically diagnosing a semiconductor manufacturing process. A hyperspectral imaging system is used to acquire spectrally-resolved images of emissions from the plasma, in a plasma processing system. Acquired hyperspectral images may be used to determine the chemical composition of the plasma and the plasma process endpoint. Alternatively, a hyperspectral imaging system is used to acquire spectrally-resolved images of a substrate before, during, or after processing, to determine properties of the substrate or layers and features formed on the substrate, including whether a process endpoint has been reached; or before or after processing, for inspecting the substrate condition.

A SiC epitaxial wafer including a high-concentration epitaxial layer having an impurity concentration of 1×10.sup.18 cm.sup.−3 or more, and the number or positions of basal plane dislocations included in the high-concentration epitaxial layer have been identified

An optical apparatus includes a stage configured to support a semiconductor device, a solid immersion lens configured to be brought into contact with the semiconductor device supported by the stage, and a photodetector disposed at a position opposite to the stage with respect to the solid immersion lens on an optical path passing through the solid immersion lens. The solid immersion lens includes a base part having a first surface to be brought into contact with the semiconductor device and a second surface opposite to the first surface, and a meta-lens disposed on the second surface.

Provided is a method for monitoring a manufacturing process of an agricultural product. The method utilizes hyperspectral imaging and comprises scanning at least one region along a sample of agricultural product using at least one light source of a single or different wavelengths; generating hyperspectral images from the at least one region; determining a spectral fingerprint for the sample of agricultural product from the hyperspectral images; and comparing the spectral fingerprint so obtained to a spectral fingerprint database containing a plurality of fingerprints obtained at various points of the manufacturing process, using a computer processor, to determine which point in the manufacturing process the sample has progressed to.

Provided is a method for blending of agricultural product utilizing hyperspectral imaging. At least one region along a sample of agricultural product is scanned using at least one light source of different wavelengths. Hyperspectral images are generated from the at least one region. A spectral fingerprint for the sample of agricultural product is formed from the hyperspectral images. A plurality of samples of agricultural product is blended based on the spectral fingerprints of the samples according to parameters determined by executing a blending algorithm.

Provided is a method for blending of agricultural product utilizing hyperspectral imaging. At least one region along a sample of agricultural product is scanned using at least one light source of different wavelengths. Hyperspectral images are generated from the at least one region. A spectral fingerprint for the sample of agricultural product is formed from the hyperspectral images. A plurality of samples of agricultural product is blended based on the spectral fingerprints of the samples according to parameters determined by executing a blending algorithm.

A photoluminescence measurement device may include: a sample holder; a detector configured to collect a photoluminescence signal; a processing unit configured to process a signal collected by the detector; and a support disposed facing a rear face of the sample holder, opposite to the front face, and on one face, called the main face, of which rests at least one radiation source for emitting light radiation illuminating the rear face and likely to be collected, by transparency of the sample holder with respect to the light radiation, by the detector.

Inspection data that corresponds to potential defects of an object may be received. A first set of locations of first potential defects can be identified. The first set of locations of the first potential defects can be imaged with a review tool to obtain a first set of review images. The first potential defects can be classified based on the first set of review images to obtain first classification results of the first potential defects. An instruction can be determined for the review tool based on the first classification results, the instruction being associated with detecting potential defects. Using the instruction, a second set of locations of second potential defects of the plurality of potential defects to be imaged with the review tool can be identified.