G01N21/88

Method for laser stimulated lock-in thermography for micro-crack detection

Systems and methods for laser stimulated lock-in thermography (LLT) crack detection are provided. The system includes a spatial light modulator and a controller. The spatial light modulator reflects a laser beam to focus the laser beam onto a sample for detection of a crack, hole or scratch. The controller is coupled to the spatial light modulator and controls operation of the spatial light modulator to switch focus of the laser beam onto the sample between a plurality of LLT focus configurations for detection of the crack, hole or scratch on the sample. The method includes using a first one of the plurality of LLT configurations for coarse scanning of the sample to detect a crack, hole or scratch on the sample and, when a crack, hole or scratch is detected on the sample, switching to a second one of the plurality of LLT configurations for fine scanning of the crack, hole or scratch on the sample to determine one or more parameters of the crack, hole or scratch on the sample.

Method for laser stimulated lock-in thermography for micro-crack detection

Systems and methods for laser stimulated lock-in thermography (LLT) crack detection are provided. The system includes a spatial light modulator and a controller. The spatial light modulator reflects a laser beam to focus the laser beam onto a sample for detection of a crack, hole or scratch. The controller is coupled to the spatial light modulator and controls operation of the spatial light modulator to switch focus of the laser beam onto the sample between a plurality of LLT focus configurations for detection of the crack, hole or scratch on the sample. The method includes using a first one of the plurality of LLT configurations for coarse scanning of the sample to detect a crack, hole or scratch on the sample and, when a crack, hole or scratch is detected on the sample, switching to a second one of the plurality of LLT configurations for fine scanning of the crack, hole or scratch on the sample to determine one or more parameters of the crack, hole or scratch on the sample.

Metrology system configured to measure apertures of workpieces

A metrology system includes front and back vision components portions. The front vision components portion includes a light source, camera, variable focal length (VFL) lens, and objective lens defining an optical axis. The back vision components portion may include a reflective surface and a polarization altering component. A workpiece with apertures is located between the front and back vision components portions. For each aperture of the workpiece, the system adjusts a relative position between the front vision components portion and the workpiece to align its optical axis with each aperture such that light from the light source passes through the aperture and is reflected by the reflective surface of the back vision components portion. The system uses the VFL lens and camera to acquire an image stack including images of the aperture, and analyzes the image stack to determine a measurement related to a workpiece feature of the aperture.

Machine learning-based circuit board inspection

Circuit board inspection by receiving a near infrared (NIR) image of at least a portion of a circuit board, analyzing the NIR image using a machine learning model, and detecting anomalous circuit board portions according to the analysis.

Container Visual Inspection Assembly and Method
20230027008 · 2023-01-26 ·

Assemblies (10), devices, and methods are described herein that allow an examiner to inspect a container (12) of liquid product (14) through a bottom wall (18) of the container using a line-of-sight diversion member (28, e.g. beam splitter, mirror or prism). In some forms, the assemblies described herein can be provided with mounts and connecting arms to couple the devices to inspection booths.

ANALYSIS DEVICE AND ANALYSIS METHOD

An analysis device for visualizing an accuracy of a trained determination device includes an acquisition unit acquiring an image pair of a non-defective product image and a defective product image, an extraction unit extracting an image region of a defective part of the defective product, a generation unit generating a plurality of image regions of pseudo-defective parts, a compositing unit synthesizing each of the image regions of the plurality of pseudo-defective parts with the non-defective product image to generate a plurality of composite images having different feature quantities, an unit outputting the plurality of composite images to the determination device and acquiring a label corresponding to each of the plurality of composite images from the determination device, and a display control unit displaying an object indicating the label corresponding to each of the plurality of composite images in an array based on the feature quantities.

Method and apparatus for checking the production quality of cables that are provided with a protective sheath, in particular electrical cables
11709140 · 2023-07-25 · ·

A method for checking the production quality of a cable that is provided with a protective sheath, in particular an electrical cable, includes the steps of acquiring images of an external surface of the cable by way of one or more digital video cameras, while the cable is moved along an advancement axis. The method also includes processing the images by way of one or more algorithms in order to calculate one or more numeric indices, each one of which is proportional to a respective optically-detectable characteristic of the external surface of the cable.

FOREIGN OBJECT DEBRIS DISCRIMINATION WITH MODULATED LASER LIGHT

A method of foreign object debris discrimination includes illuminating a particle located within a sensing volume with a modulated electromagnetic radiation pulse emitted from a source; receiving one or more electromagnetic radiation return signals that have been scattered by the particle illuminated by the modulated electromagnetic radiation pulse at a detector; mixing, using a controller, the electromagnetic radiation return signal of amplitude I.sub.RS and frequency f.sub.RS with a reference signal of amplitude I.sub.LS and frequency f.sub.RS; analyzing, using the controller, an amplitude of the mixed signal √{square root over (I.sub.LSI.sub.RS)}, and frequency of the mixed signal, f.sub.RS−f.sub.LS; and classifying, using the controller, a particle position, a velocity, and electromagnetic characteristic of the particle based on the amplitude, √{square root over (I.sub.LSI.sub.RS)}, and frequency, f.sub.RS−f.sub.LS of the mixed signal.

PLANAR OBJECT SEGMENTATION

Robots might interact with planar objects (e.g., garments) for process automation, quality control, to perform sewing operations, or the like. It is recognized herein that robots interacting with such planar objects can pose particular problems, for instance problems related to detecting the planar object and estimating the pose of the detected planar object. A system can be configured to detect or segment planar objects, such as garments. The system can include a three-dimensional (3D) sensor positioned to detect a planar object along a transverse direction. The system can further include a first surface that supports the planar object. The first surface can be positioned such that the planar object is disposed between the first surface and the 3D sensor along the transverse direction. In various examples, the 3D sensor is configured to detect the planar object without detecting the first surface.

MEASUREMENT DEVICE AND METHOD FOR SEMICONDUCTOR STRUCTURE
20230024724 · 2023-01-26 ·

A measurement device and method for a semiconductor structure are provided. The measurement device for the semiconductor structure includes a bearing platform, a clamping mechanism, and an image acquisition system. The clamping mechanism is installed on the bearing platform and includes a clamp disposed along a vertical direction. The clamp is configured to clamp the semiconductor structure such that the semiconductor structure is clamped with a to-be-measured surface facing a side. The image acquisition system is disposed by a side of the clamping mechanism, and is configured to acquire a three-dimensional morphology of the semiconductor structure from the side.