Apparatuses and processes for generating data for three-dimensional reconstruction are disclosed herein. An example method at least includes exposing a subsequent surface of a sample, acquiring an image of the subsequent surface, comparing the image of the subsequent surface to an image of a reference surface, based on the comparison exceeding a threshold, acquiring a compositional or crystalline map of the subsequent surface, and based on the comparison not exceeding the threshold, exposing a next surface.

According to an embodiment, a nondestructive inspection method includes: detecting, by a plurality of sensors installed in a truck that supports a vehicle body, an elastic wave generated when a lifting member inserted between the vehicle body and the truck moves the vehicle body up and down; and estimating, by an evaluation device, a position of a defect in the truck, based on the elastic wave detected by the plurality of sensors.

According to an embodiment, a nondestructive inspection method includes: detecting, by a plurality of sensors installed in a truck that supports a vehicle body, an elastic wave generated when a lifting member inserted between the vehicle body and the truck moves the vehicle body up and down; and estimating, by an evaluation device, a position of a defect in the truck, based on the elastic wave detected by the plurality of sensors.

The present invention has a computation device for measuring the dimensions of patterns formed on a sample on the basis of a signal obtained from a charged particle beam device. The computation device has a positional deviation amount calculation unit for calculating the amount of positional deviation in a direction parallel to a wafer surface between two patterns having different heights on the basis of an image acquired at a given beam tilt angle; a pattern inclination amount calculation unit for calculating an amount of pattern inclination from the amount of positional deviation using a predetermined relational expression for the amount of positional deviation and the amount of pattern inclination; and a beam tilt control amount calculation unit for controlling the beam tilt angle so as to match the amount of pattern inclination. The pattern measurement device sets the beam tilt angle to a calculated beam tilt angle, reacquires an image and measures the patterns.

The present invention has a computation device for measuring the dimensions of patterns formed on a sample on the basis of a signal obtained from a charged particle beam device. The computation device has a positional deviation amount calculation unit for calculating the amount of positional deviation in a direction parallel to a wafer surface between two patterns having different heights on the basis of an image acquired at a given beam tilt angle; a pattern inclination amount calculation unit for calculating an amount of pattern inclination from the amount of positional deviation using a predetermined relational expression for the amount of positional deviation and the amount of pattern inclination; and a beam tilt control amount calculation unit for controlling the beam tilt angle so as to match the amount of pattern inclination. The pattern measurement device sets the beam tilt angle to a calculated beam tilt angle, reacquires an image and measures the patterns.

Methods and systems for feed-forward of multi-layer and multi-process information using XPS and XRF technologies are disclosed. In an example, a method of thin film characterization includes measuring first XPS and XRF intensity signals for a sample having a first layer above a substrate. The first XPS and XRF intensity signals include information for the first layer and for the substrate. The method also involves determining a thickness of the first layer based on the first XPS and XRF intensity signals. The method also involves combining the information for the first layer and for the substrate to estimate an effective substrate. The method also involves measuring second XPS and XRF intensity signals for a sample having a second layer above the first layer above the substrate. The second XPS and XRF intensity signals include information for the second layer, for the first layer and for the substrate.

Methods and systems for feed-forward of multi-layer and multi-process information using XPS and XRF technologies are disclosed. In an example, a method of thin film characterization includes measuring first XPS and XRF intensity signals for a sample having a first layer above a substrate. The first XPS and XRF intensity signals include information for the first layer and for the substrate. The method also involves determining a thickness of the first layer based on the first XPS and XRF intensity signals. The method also involves combining the information for the first layer and for the substrate to estimate an effective substrate. The method also involves measuring second XPS and XRF intensity signals for a sample having a second layer above the first layer above the substrate. The second XPS and XRF intensity signals include information for the second layer, for the first layer and for the substrate.

An electron beam additive manufacturing system includes an electron beam source, an x-ray detection sensor configured to generate a waveform corresponding to an amount of x-rays detected by the x-ray detection sensor, and an electronic control unit comprising a processor and a non-transitory computer-readable memory, the electronic control unit communicatively coupled to the electron beam source and the x-ray detection sensor. The electronic control unit is configured to cause the electron beam source to emit an electron beam such that the electron beam impinges a verification plate, receive the waveform generated by the x-ray detection sensor in response to the x-ray detection sensor capturing x-rays emitted from the impingement of the electron beam with the verification plate, and determine a melt performance of a surface material of the verification plate based on the waveform.

Non-destructive sensing methods and devices for inspection and measuring in manufacturing applications for removal of contaminants from composite surfaces coupled with sensing and activation of the composite surfaces.

Non-destructive sensing methods and devices for inspection and measuring in manufacturing applications for removal of contaminants from composite surfaces coupled with sensing and activation of the composite surfaces.