Aspects of the technology employ real-time monitoring and feedback for a printed circuit board fabrication system. An x-ray simulator can be used to aid in understanding metallurgical phase transformations in real time to ensure acceptable and reliable solder connections. This includes real-time data gathering and evaluation of solder-related printed circuit board data, including peak temperature, time above liquidus (TAL), ramp up and ramp down rates. Such information is used to identify the exact melting point and view specific soldering behavior in order to achieve an optimized soldering solution. This approach can provide effective solder joint analysis, which can reduce the likelihood of failure of a circuit board intended to operate in extreme environments for an extended period of time, such as the stratosphere.

Aspects of the technology employ real-time monitoring and feedback for a printed circuit board fabrication system. An x-ray simulator can be used to aid in understanding metallurgical phase transformations in real time to ensure acceptable and reliable solder connections. This includes real-time data gathering and evaluation of solder-related printed circuit board data, including peak temperature, time above liquidus (TAL), ramp up and ramp down rates. Such information is used to identify the exact melting point and view specific soldering behavior in order to achieve an optimized soldering solution. This approach can provide effective solder joint analysis, which can reduce the likelihood of failure of a circuit board intended to operate in extreme environments for an extended period of time, such as the stratosphere.

Dilatometer systems for measuring characteristics of material samples are disclosed. In one embodiment, a dilatometer system includes a reactor adapted to receive the test sample, a density trap in fluid communication with the reactor, a first fluid selectively filling the reactor and a portion of the density trap, and a second fluid selectively filling a portion of the density trap. The first fluid and the second fluid are immiscible with one another and selectively form an immiscible fluid boundary in the density trap. The dilatometer system further includes a heater that selectively heats the first fluid.

A method of background removal from melting curves generated using a fluorescent dye is provided for analyzing a melting profile of a nucleic acid sample. The method comprises measuring the fluorescence of the nucleic acid sample as a function of temperature to produce a raw melting curve having a melting transition, the nucleic acid sample comprising a nucleic acid and a molecule that binds the nucleic acid to form a fluorescently detectable complex, the raw melting curve comprising a background fluorescence signal and a nucleic acid sample signal; and separating the background signal from the nucleic acid sample signal by use of a quantum algorithm to generate a corrected melting curve, the corrected melting curve comprising the nucleic acid sample signal.

A method of background removal from melting curves generated using a fluorescent dye is provided for analyzing a melting profile of a nucleic acid sample. The method comprises measuring the fluorescence of the nucleic acid sample as a function of temperature to produce a raw melting curve having a melting transition, the nucleic acid sample comprising a nucleic acid and a molecule that binds the nucleic acid to form a fluorescently detectable complex, the raw melting curve comprising a background fluorescence signal and a nucleic acid sample signal; and separating the background signal from the nucleic acid sample signal by use of a quantum algorithm to generate a corrected melting curve, the corrected melting curve comprising the nucleic acid sample signal.

The present disclosure relates to a method for determining a softening temperature of copper and copper alloy, including: selecting a plurality of samples of the same material, annealing the plurality of samples at different temperatures, air-cooling the plurality of samples; measuring the tensile strength of an original sample and the plurality of samples after the annealing; plotting a data of the measured tensile strength into a temperature-tensile strength curve; a temperature at which the tensile strength in the temperature-tensile strength curve drops to a certain value of an original sample tensile strength is the softening temperature of the material. The above technical solution in the present disclosure uses the tensile strength instead of hardness to measure the softening temperature. It can effectively improve the detection efficiency and reduce the cost, and can be widely used in determination of the softening temperature of fine materials of copper and copper alloy.

The present disclosure relates to a method for determining a softening temperature of copper and copper alloy, including: selecting a plurality of samples of the same material, annealing the plurality of samples at different temperatures, air-cooling the plurality of samples; measuring the tensile strength of an original sample and the plurality of samples after the annealing; plotting a data of the measured tensile strength into a temperature-tensile strength curve; a temperature at which the tensile strength in the temperature-tensile strength curve drops to a certain value of an original sample tensile strength is the softening temperature of the material. The above technical solution in the present disclosure uses the tensile strength instead of hardness to measure the softening temperature. It can effectively improve the detection efficiency and reduce the cost, and can be widely used in determination of the softening temperature of fine materials of copper and copper alloy.

A casting solidification analysis method, which can analyze positions of shrinkage cavities more accurately than in the past, a casting method using the above method, and an electronic program are provided.

A following casting solidification analysis method is provided. An amount of expansion/shrinkage for each solidification step length separated by inflection points in a cooling curve is determined, by setting a solid phase ratio at a completion of pouring to 0, setting a solid phase ratio at an end of solidification to 1.0, and determining the expansion/shrinkage amount for the each solidification step length by proportionally distributing the each solidification step length to the total solid phase ratio length.

The present invention relates to the use of one or more amplicons as temperature calibrators. In some embodiments, the calibrators may be used to calibrate the temperature of a microfluidic channel in which amplification and/or melt analysis is performed. In some embodiments, the amplicons may be genomic, ultra conserved elements and/or synthetic. The amplicon(s) may have a known or expected melt temperature(s). The calibrators may be added to primers of study or may follow or lead the primers of study in the channel. The amplicon(s) may be amplified and melted, and the temperature(s) at which the amplicon(s) melted may be determined. The measured temperature(s) may be compared to the known temperature(s) at which the amplicon(s) was expected to melt. The difference(s) between the measured and expected temperatures may be used to calibrate/adjust one or more temperature control elements used to control and/or detect the temperature of the channel. In other embodiments, the UCE primers may function as a positive control to validate amplification has occurred.

The present invention relates to the use of one or more amplicons as temperature calibrators. In some embodiments, the calibrators may be used to calibrate the temperature of a microfluidic channel in which amplification and/or melt analysis is performed. In some embodiments, the amplicons may be genomic, ultra conserved elements and/or synthetic. The amplicon(s) may have a known or expected melt temperature(s). The calibrators may be added to primers of study or may follow or lead the primers of study in the channel. The amplicon(s) may be amplified and melted, and the temperature(s) at which the amplicon(s) melted may be determined. The measured temperature(s) may be compared to the known temperature(s) at which the amplicon(s) was expected to melt. The difference(s) between the measured and expected temperatures may be used to calibrate/adjust one or more temperature control elements used to control and/or detect the temperature of the channel. In other embodiments, the UCE primers may function as a positive control to validate amplification has occurred.