A method of measuring physical properties includes: a preparation step of preparing a moisened member containing an organic material and having a known water absorption rate and a known mass; a heating and cooling step of performing cooling after heating the member; and a measurement step of measuring a mass of the member after cooling the member in the heating and cooling step, in which in the heating and cooling step, a deformation rate of the member is measured using a digital image correlation method.

The current invention relates to a method for monitoring defects in pipeline sections and/or containers with an insulation layer. A sensor line, comprising a single optical fiber or a bundle of optical fibers, is attached along the length of the pipeline section or over the surface of the container, and positioned on the exterior of the insulation layer. The sensor line is operatively coupled to a temperature sensing (DTS or FBG based) system. The method determines an exterior temperature profile over the length of the pipeline section or surface of the container via the temperature sensing system. Defects are detected, based on analysis of the measured exterior temperature profile and a locally averaged exterior temperature profile along the length of the pipeline section or surface over the container.

In some embodiments, a piezoelectric device is provided. The piezoelectric device includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A heating element is disposed over the semiconductor substrate. The heating element is configured to heat the piezoelectric structure to a recovery temperature for a period of time, where heating the piezoelectric structure to the recovery temperature for the period of time improves a degraded electrical property of the piezoelectric device.

In some embodiments, a piezoelectric device is provided. The piezoelectric device includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A heating element is disposed over the semiconductor substrate. The heating element is configured to heat the piezoelectric structure to a recovery temperature for a period of time, where heating the piezoelectric structure to the recovery temperature for the period of time improves a degraded electrical property of the piezoelectric device.

A method of measuring physical properties includes: a preparation step of preparing a moisened member containing an organic material and having a known water absorption rate and a known mass; a heating and cooling step of performing cooling after heating the member; and a measurement step of measuring a mass of the member after cooling the member in the heating and cooling step, in which in the heating and cooling step, a deformation rate of the member is measured using a digital image correlation method.

A method of measuring physical properties includes: a preparation step of preparing a moisened member containing an organic material and having a known water absorption rate and a known mass; a heating and cooling step of performing cooling after heating the member; and a measurement step of measuring a mass of the member after cooling the member in the heating and cooling step, in which in the heating and cooling step, a deformation rate of the member is measured using a digital image correlation method.

A measuring device includes: a support which supports a measurement target object; a furnace which heats the measurement target object; an elevating mechanism which moves the furnace; and an electronic balance which measures the weight of the measurement target object, the elevating mechanism moving the furnace so that the measurement target object which is supported by the support is housed in the furnace.

A measuring device includes: a support which supports a measurement target object; a furnace which heats the measurement target object; an elevating mechanism which moves the furnace; and an electronic balance which measures the weight of the measurement target object, the elevating mechanism moving the furnace so that the measurement target object which is supported by the support is housed in the furnace.

A method of measuring concentrations of gas mixtures is disclosed in which an ionic liquid and/or low vapor-pressure organic solvent is exposed to a gas mixture being tested to form a solution of the gas components in the liquid. The vapor pressure of the solution is then measured at one or more other temperatures and compared to predicted vapor pressures based on known individual vapor pressure profiles of the gas components in the liquid in order to determine the actual proportions of the components in the gas sample.

A method of measuring concentrations of gas mixtures is disclosed in which an ionic liquid and/or low vapor-pressure organic solvent is exposed to a gas mixture being tested to form a solution of the gas components in the liquid. The vapor pressure of the solution is then measured at one or more other temperatures and compared to predicted vapor pressures based on known individual vapor pressure profiles of the gas components in the liquid in order to determine the actual proportions of the components in the gas sample.