An inspection apparatus for inspecting an inspection target surface arranged on an inspection plane, includes an X-ray generation tube having a target including an X-ray generation portion that generates X-rays by irradiation with an electron beam, and configured to emit X-rays to the inspection plane, and an X-ray detector configured to detect X-rays emitted from a foreign substance existing on the inspection target surface irradiated with the X-rays from the X-ray generation portion and totally reflected by the inspection target surface. The X-ray detector includes a long X-ray receiver.

An x-ray spectrometer system comprising an x-ray imaging system with at least one achromatic imaging x-ray optic and an x-ray detection system. The optical train of the imaging system is arranged so that its object focal plane partially overlaps an x-ray emitting volume of an object. An image of a portion of the object is formed with a predetermined image magnification at the x-ray detection system. The x-ray detection system has both high spatial and spectral resolution, and converts the detected x-rays to electronic signals. In some embodiments, the detector system may have a small aperture placed in the image plane, and use a silicon drift detector to collect x-rays passing through the aperture. In other embodiments, the detector system has an energy resolving pixel array x-ray detector. In other embodiments, wavelength dispersive elements may be used in either the optical train or the detector system.

Provided is an operation guide system for an X-ray analysis, including: a sample information acquisition portion for acquiring sample information on a sample to be measured for a predetermined analysis purpose with an X-ray measuring unit; a measurement condition acquisition portion for acquiring a plurality of measurement conditions different from one another; a virtual result acquisition portion for subjecting the sample information to simulations respectively based on the plurality of measurement conditions, to thereby acquire a plurality of virtual measurement results of measurements for the predetermined analysis purpose; and a comparison result output portion for outputting, as comparison results, at least two virtual measurement results among the plurality of virtual measurement results and at least two of the plurality of measurement conditions respectively corresponding to the at least two virtual measurement results.

An X-ray analysis system is provided with multi-source design and an X-ray analysis method is provided with multi-source design. According to the embodiments, the X-ray analysis system includes a ray source including a plurality of ray generating devices that generate a ray; a detector that detects a signal generated due to an analyzed object being irradiated by the ray from the ray source; and a controller that controls the ray source, so that two or more ray generating devices in the ray source simultaneously generate corresponding rays to irradiate the analyzed object.

To facilitate a reliable detection of age-related damage or delamination on components the following is proposed: [i] within the scope of radiofrequency reflectometry, scanning a component by radiofrequency signal irradiation in the micrometer or millimeter wavelength range and by measuring at least one reflection signal, which was reflected at the component, in punctiform, one-dimensional or two-dimensional fashion for the purposes of generating at least one first radiofrequency image representation; [ii] scanning the component in direct time offset fashion with respect to the radiofrequency signal irradiation by a combination of ultrasonic signal irradiation and the radiofrequency signal irradiation in the micrometer or millimeter wavelength range and by measuring at least one further reflection signal, which was reflected at the component; and [iii] comparing the radiofrequency image representations generated based on the reflection signals, wherein determined changes in the radiofrequency image representations indicate damage or delamination on the component.

Methods and systems for measuring structural parameters characterizing a measurement target based on changes in measurement signal values due to one or more perturbations of an effective illumination angle of incidence on the measurement target are presented herein. In some examples, a measurement model estimates values of the structural parameters based on the changes in measurement signal values. In some examples, at least one derivative of detected measurement signals with respect to effective illumination angle is determined, and values of the structural parameters are estimated based on the at least one derivative. In some examples, values of one or more tunable measurement model parameters are estimated based on at least one derivative. In some examples, the fitting performance of a measurement model is quantified based on measurements performed at both unperturbed and perturbed orientations of a structure under measurement with respect to the illumination beam.

An X-ray reflection analysis system applying multiple X-ray beams is provided. The X-ray reflection analysis system includes at least one X-ray source device, a diffraction component, at least one sensor, and a processing device. At least one X-ray source device is configured to generate a primary X-ray beam. The diffraction component is configured to split the primary X-ray beam into a plurality of sub X-ray beams in a matrix form. The at least one sensor is configured to receive a plurality of sensing signals respectively generated after a to-be-measured object is irradiated by the sub X-ray beams. The processing device is configured to control the X-ray source device to generate the primary X-ray beam and to analyze the plurality of sensing signals to generate a plurality of analysis results.

An X-ray measurement system and an X-ray measurement method. An optical receiver is used to collect multiple measurement signals generated from reflection of multiple X-ray beams having different energies by an inspection target. Multiple fitting models are established according to a target architecture of the inspection target. A spectrum fitting analysis is performed on the measurement signals respectively by the fitting models, so as to generate multiple to-be-optimized fitting results. The to-be-optimized fitting results are counted to generate multiple parameter fitting ranges. A set of to-be-verified parameters is generated according to the parameter fitting ranges, is input into the fitting models to verify an accuracy thereof, and is adjusted according to the accuracy and the parameter fitting ranges until an optimization condition is satisfied. The set of to-be-verified parameters that satisfies the optimization condition is configured as an optimized fitting result.

A method for determining parameters of nanostructures, wherein the method includes steps as follows: Firstly, an X-ray reflection intensity measurement curve of a nanostructure to be tested is obtained by radiating the nanostructure to be tested with X-ray. The X-ray reflection intensity measurement curve is compared with an X-ray reflection intensity standard curve to obtain a comparison result. Subsequently, at least one parameter existing in the nanostructure to be tested is determined according to the comparison result.

An X-ray reflection analysis system and an X-ray reflection analysis method utilizing multi-order mode signals are provided. The X-ray reflection analysis system includes an X-ray generator, an X-ray optical element group, an X-ray detector and a processing device. The X-ray generator generates a measurement X-ray beam. The X-ray optical element group guides the measurement X-ray beam to a to-be-measured sample. The X-ray detector receives the to-be-measured X-ray signal generated by the measurement X-ray beam irradiating the to-be-measured sample. The processing device collects the to-be-measured X-ray signal and extracts mode signals; performs a first fitting analysis process on the mode signals whose order is less than a predetermined order to generate initial parameter ranges; and based on the initial parameter ranges, performs a second fitting analysis process on the mode signals whose order is greater than or equal to the predetermined order, to generate parameter fitting results.