Apparatuses and methods of X-ray fluorescence (XRF) imaging use a radiation source to stimulate XRF from only a slice of an object by projecting a radiation beam through only the slice. An X-ray detector having a plurality of pixels is provided. A collimator having a plurality of parallel collimator plates is positioned between the object and the X-ray detector. The radiation beam is not parallel to the collimator plates. Neighboring pairs of the collimator plates allow XRF from only respective portions of the slice to reach respective subsets of the pixels. For each of the respective pixel subsets the X-ray detector sums signals generated in the pixel or pixels of the respective subset. The radiation beam is a fan beam or a pencil beam. A pixel pitch of the X-ray detector is an integer multiple of a plate pitch of the collimator.

A device that uses a grating to carry out high sensitivity radiographic image shooting using the wave nature of x-rays or the like can shoot a sample that moves relative to a device. A pixel value computation section determines, using a plurality of intensity distribution images of a sample that moves in a direction that traverses the path of radiation, whether or not a point (p, q) on the sample belongs in a region (Ak) on each intensity distribution image. Further, the pixel value computation section obtains a sum pixel value (Jk) for each region (Ak) by summing pixel values on the each intensity distribution image for point (p, q) that belongs to each region (Ak). An image computation section creates a required radiographic image using the sum pixel values (Jk) of the region (Ak).

An X-ray apparatus which aligns an X-ray radiator with an X-ray detector, an X-ray apparatus which aligns an X-ray radiator with an X-ray detector while maintaining a Source to Image-receptor Distance (SID) and a Source to Object Distance (SOD) therebetween, and methods of operating the X-ray apparatuses are provided.

A reaching and grabbing assist device is provided having a reaching extension for aid in reaching out of distance objects. The distal terminus of the extension has an articulating grapnel that may be angularly positioned about the lateral centerline of the shaft. A support strip on the user's wrist allows total control without the risk of the device falling out of one's grasp or reach. Made of a hard outer casing, the shaft may allow internal rigging to connect the articulating grapnel to controls at the handle. The instant abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.

An x-ray imaging system includes at least one detector and an x-ray source including an x-ray transmissive vacuum window. The x-ray source is configured to produce diverging x-rays emerging from the vacuum window and propagating along an x-ray propagation axis extending through a region of interest of an object to the at least one detector. The diverging x-rays have propagation paths within an angular divergence angle greater than 1 degree centered on the x-ray propagation axis. The system further includes at least one first motion stage configured to rotate the object about a rotation axis. The system further includes at least one second motion stage configured to move the x-ray source and the at least one detector relative to the object to switch between a laminography configuration and a tomography configuration.

A method for detecting defects in a semiconductor structure is provided. The method includes the following operations. A semiconductor structure having a plurality of conductive structures is received. An electron beam inspection operation is performed on the plurality of conductive structures of the semiconductor structure to obtain an inspection data, wherein a pulsed electron beam utilized in the electron beam inspection operation is selected from the group consisting of a nanosecond pulsed beam, a picosecond pulsed beam, and a femtosecond pulsed beam. A first conductive structure having a non-open defect is identified from the inspection data. A method for classifying semiconductor structure is also provided.

A method of 3D-inspection of a semiconductor object inside of an inspection volume of a wafer or wafer sample comprises a 3D data processing and a step for acquiring a plurality of two-dimensional images. The acquiring step comprises a monitoring step for determining whether a two-dimensional image is in conformity with a desired property of the 3D data processing. The disclosure further comprises a method of configuring the method of 3D-inspection and a system configured to execute the method of 3D inspection as well as the method of configuring the method of 3D-inspection.

An x-ray imaging system includes at least one detector and an x-ray source including an x-ray transmissive vacuum window. The x-ray source is configured to produce diverging x-rays emerging from the vacuum window and propagating along an x-ray propagation axis extending through a region of interest of an object to the at least one detector. The diverging x-rays have propagation paths within an angular divergence angle greater than 1 degree centered on the x-ray propagation axis. The system further includes at least one first motion stage configured to rotate the object about a rotation axis. The system further includes at least one second motion stage configured to move the x-ray source and the at least one detector relative to the object to switch between a laminography configuration and a tomography configuration.

Regarding to a fiber-reinforced material formed by deforming a reinforcing material composed of a plurality of fiber layers from an initial shape and molding into a predetermined shape, an identification device, an identification method, and an identification program generate a first data in which a physical quantity distribution inside the fiber-reinforced material is mapped to the initial shape, perform binarization of the first data to generate a second data in which a label identifying the fiber layer is mapped to the initial shape, and map the second data to a predetermined shape, based on a deformation data.

Integrated backscatter X-ray assemblies for detecting backscatter X-rays reflected by a target area of an article under test are disclosed. The integrated backscatter X-ray assembly includes an enclosure, an X-ray power supply, an X-ray tube, a backscatter X-ray detector and a cooling fluid. The X-ray power supply disposed within the enclosure. The X-ray tube disposed within the enclosure and operatively coupled to the X-ray power supply. The backscatter X-ray detector is disposed within the enclosure. The cooling fluid disposed within the enclosure such that the X-ray power supply, the X-ray tube and the backscatter X-ray detector are immersed in the cooling fluid. In various examples, integrated backscatter X-ray assemblies may also include a movable base and/or a mobile platform. Methods for detecting backscatter X-rays reflected by a target area of an article under test are also disclosed.