To enable evaluation of a shape of a fine particle and a fine particle type, a substrate is set as a substrate on which an isolated fine particle to be measured and an isolated standard fine particle in the vicinity of the isolated fine particle to be measured are disposed, and a scanning electron microscope body including a detector configured to detect secondary charged particles obtained by scanning a surface of the substrate with an electron beam probe, and a computer that processes a detection signal and generates an image of the isolated fine particle to be measured and the isolated standard fine particle are provided. The computer corrects a shape of the isolated fine particle to be measured by using a measurement result of the isolated standard fine particle disposed in the vicinity of the isolated fine particle to be measured. Further, by attaching a fine particle spreading tank equipped with a fine particle suspension dropping device inside the microscope body, automatic measurement including dropping of fine particle suspension onto a surface of a surface-modified substrate is possible.

An inspection device includes a ray source that irradiates an object to be inspected with energy rays, a detection unit that detects energy rays that have passed through the object to be inspected, a displacement mechanism that sets a relative position of the object to be inspected and the ray source by displacing at least one of the object to be inspected and the ray source in relation to the other, an internal image generation unit that generates an internal image of the object to be inspected based on a detection amount distribution of the energy rays detected by the detection unit, and a control unit that controls the displacement mechanism based on the detection amount distribution of the energy rays detected by the detection unit.

In a method of detecting a defect, a region of a substrate may be primarily scanned using a first electron beam to detect a first defect. A remaining region of the substrate, which may be defined by excluding a portion in which the first defect may be positioned from the region of the substrate, may be secondarily scanned using a second electron beam to detect a second defect. Thus, the portion with the defect may not be scanned in a following scan process so that a scanning time may be remarkably decreased.

A method of detecting an anomaly in a crystallographic structure, the method comprising: illuminating the structure with x-ray radiation in a known direction relative to the crystallographic orientation; positioning the structure such that its crystallographic orientation is known; detecting a pattern of the diffracted x-ray radiation transmitted through the structure; generating the simulated pattern based on the known direction relative to the crystallographic orientation; comparing the detected pattern to a simulated pattern for x-ray radiation illuminating in the known direction; and, detecting the anomaly in the crystallographic structure based on the comparison.

An electron beam inspection apparatus according to an embodiment includes a stage holding a substrate with a pattern; an electron beam column irradiating the substrate with multiple beams including a plurality of electron beams such that adjacent regions irradiated with the electron beams have an overlap portion therebetween; a first image storage unit storing a first inspection image acquired by irradiating a first inspection region of the substrate with the multiple beams; a second image storage unit storing a second inspection image acquired by irradiating a second inspection region of the substrate with the multiple beams; a correction coefficient storage unit storing a correction coefficient for correcting an image of the overlap portion; an image correction unit correcting an image of the overlap portion using the correction coefficient; and a comparison unit comparing the first inspection image with the second inspection image.

A method for identifying a material contained in a sample. The sample is subjected to irradiation via ionizing electromagnetic radiation, for example X-rays. The sample is inserted between a source emitting the radiation and a spectrometric detector configured to acquire a spectrum of the radiation transmitted by the sample. The spectrum is subject to different treatment operations to enable classification of the material. The steps are, consecutively: reducing dimensionality, followed by projecting along the predefined projection vectors. Projection makes it possible to establish classification parameters, on the basis of which classification is established.

An X-ray phase imaging apparatus includes an X-ray source; a detector; a plurality of gratings; a rotation mechanism; an image processor configured to generate a phase contrast image and to generate a preview image prior to capture of the phase contrast image; and a controller configured to control function of displaying on a display the preview image, and function of discriminatively displaying on the display an image coverage area for the phase contrast image that is associated with a relative rotation angle between the plurality of gratings and a subject.

A method is disclosed for providing a component. During this method, braze powder is deposited with a substrate. The braze powder is sintered together during the depositing of the braze powder to provide the substrate with sintered braze material. The sintered braze material is heated to melt the sintered braze material and to diffusion bond the sintered braze material to the substrate to provide braze filler material. A first object is scanned using computed tomography to provide first object scan data. The first object includes the substrate and the braze filler material diffusion bonded to the substrate. The first object scan data is compared to first object reference data to provide machining data. The first object is machined using the machining data to provide a second object.

A method includes determining a predicted contrast-to-noise ratio sensitivity function (CNR SF) for crack detection of a predetermined target flaw size with the radiographic inspection system in the selected set-up. The method also includes qualifying an inspection image quality indicator (IQI) for the predetermined target flaw size for use in the radiographic inspection system in the selected set-up. The method also includes performing an inspection process. The inspection process includes selecting the qualified inspection IQI for the predetermined target flaw size. The inspection process also includes performing an inspection test on the qualified inspection IQI using the radiographic inspection system in the selected set-up. The inspection process also includes determining one or more inspection output parameters. The inspection process also includes verifying that the one or more inspection output parameters meet or exceed minimum qualified values to qualify the radiographic inspection system in the selected set-up.

An electron beam inspection apparatus according to an embodiment includes a stage holding a substrate with a pattern; an electron beam column irradiating the substrate with multiple beams including a plurality of electron beams such that adjacent regions irradiated with the electron beams have an overlap portion therebetween; a first image storage unit storing a first inspection image acquired by irradiating a first inspection region of the substrate with the multiple beams; a second image storage unit storing a second inspection image acquired by irradiating a second inspection region of the substrate with the multiple beams; a correction coefficient storage unit storing a correction coefficient for correcting an image of the overlap portion; an image correction unit correcting an image of the overlap portion using the correction coefficient; and a comparison unit comparing the first inspection image with the second inspection image.