Disclosed is a method for forming a spacer extending at least partially within the length of a central bore passing from one side to the other of a barrel of a mounting base of an accelerometer sensor, the central bore being designed to receive a fastening element for fixing the mounting base onto a support element, the fastening element being centered by the spacer in the central bore, the mounting base being at least partially surrounded by an encapsulation of overmolded plastic material. When the plastic material is overmolded around the mounting base to form the encapsulation, a part of the plastic material passes through the barrel to form the spacer while fixing it to the encapsulation. Also described is a mounting base with at least one channel for the passage of the plastic material, and to an accelerometer sensor equipped with such a mounting base.

The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.

A measuring sensor includes a housing in which an acceleration sensor is arranged and in which a circuit board is retained with a sensor electronics arranged thereon and a mounting element functions to secure the measuring sensor to a test object, wherein the acceleration sensor is mechanically rigidly coupled to the mounting element and connected to the sensor electronics via a flexible line connection, where in order to optimize the coupling of the acceleration sensor to the test object to be monitored, in terms of detecting oscillations, vibrations or structure-borne noise, the acceleration sensor is directly connected to the mounting element without mechanical contact with the housing, and the housing is retained elastically on the mounting element and supported by the mounting element.

A low-stress packaging structure for a MEMS acceleration sensor chip includes a MEMS sensor chip and a chip carrier. Two sides of the bottom of the sensor chip are provided with a first metal layer and a second metal layer respectively. Two sides of a die attach area of the chip carrier are correspondingly provided with a third metal layer and a fourth metal layer. The first metal layer of the sensor chip and the third metal layer of the chip carrier are bonded together. The second metal layer of the sensor chip and the fourth metal layer of the chip carrier are only in contact but not bonded. A groove is arranged between the first metal layer and the second metal layer at the bottom of the sensor chip. A certain gap is defined between the sensor chip and cavity walls of chip carrier.

An inertia sensor (10), in particular provided on a belt retractor (12), includes at least two components which are reversibly movable relative to each other and each of which includes at least one contact surface (20, 22, 34, 36) on which the components are in contact with each other, wherein at least one of the contact surfaces (20, 22, 34, 36) is coated with graphite powder (38).

An apparatus for measuring vehicle acceleration includes a housing comprising an interior space and one or more contacts supported in the housing. Each of the contacts includes a pin portion that extends outside the housing and a spring contact portion positioned above an ASIC receptacle inside the housing. The apparatus also includes an accelerometer ASIC positioned the ASIC receptacle in the housing. The accelerometer ASIC includes contact pads that engage the spring contact portions of the one or more contacts and cause the spring contact portions to deflect. The resilient spring characteristics of the spring contact portions applying a retention force on the accelerometer ASIC. The apparatus further includes a retention clip connected to the housing and having a portion extending into the interior space. The retention clip includes a portion that engages the housing to secure the retention clip in an installed condition in the housing. The retention clip includes portions that engage the one or more contacts and maintain the position of the one or more contacts inside the housing, and portions that engage the accelerometer ASIC and maintain the position of the accelerometer ASIC inside the housing.

A structure sensor device monitors physical properties within a body of concrete, rock, soil or other structure. The structure sensor device can be embedded inside the body of the structure in use. The structure sensor device includes: a sealed housing; sensors for measuring physical properties within the body of structure, such as a temperature sensor and a moisture sensor; and a wireless transceiver for wirelessly communicating with a gateway device located outside of the body of structure. The wireless transceiver is configured for wirelessly communicating at frequencies of less than 1 GHz. There is a controller configured to obtain sensor data from the sensors, generate monitoring data using at least some of the sensor data, and cause the monitoring data to be transmitted to the gateway device using the wireless transceiver, at predetermined intervals.

The invention relates to sensors, and more particularly, a sensor device having accelerometer and gyroscope integrated into a low cost compact package. The device includes: MEMs wafer; and an ASIC wafer bonded to the MEMs wafer; a wafer-level-package redistribution layer (WLP RDL) formed on a surface of the ASIC wafer; and a ball grid array having a plurality of solder balls that electrically connect the package to a circuit board. The MEMs wafer includes the accelerometer and gyroscope, while the ASIC wafer includes two separate cavities corresponding to the accelerometer and gyroscope, respectively. The ASIC wafer includes electrical circuits/components to process the readout signals received from the accelerometer and gyroscope.

Provided is a highly reliable acceleration sensor having little 0-point drift. For example, an acceleration sensor having a support substrate having a first direction and a second direction orthogonal thereto in a single surface, a device layer disposed on the support substrate with a space interposed therebetween and having a weight that deforms according to the application of acceleration, and a cap layer disposed on the device layer with a space interposed therebetween, wherein a fixed part fixed to the support substrate is provided in the center of the weight, a beam is provided that extends from the fixed part and makes the weight mobile by being connected thereto, a plurality of posts for coupling the support substrate and the cap layer are disposed on the fixed part, and electric signals are applied to and received from the weight via the posts.

A hybrid sensor assembly is configured to be mounted on a vehicle to sense structure borne and airborne noises generated as the vehicle travels over the roads. The sensor assembly includes a housing having a circuit board mounted therein, an accelerometer mounted on the circuit board, a microphone mounted on the circuit board, an acoustic port through the housing and in communication with the microphone, and an acoustic fabric attached to the housing over the port. An acoustic shield covers the acoustic port and substantially deters the entry of fluid and debris into the acoustic port.