A sensor includes a sensor element configured to measure a physical variable. At least one elastic damping element is configured to damp external interfering vibrations. The at least one elastic damping element is configured to electrically and/or mechanically contact the sensor element.

A vibration angular velocity sensor includes a substrate and a vibrator. The vibrator includes support members, linear drive beams, and a plurality of weight portions connected by the drive beams. The vibrator vibrates the plurality of weight portions by bending of the drive beams. The vibrator is fixed to the substrate through the support members at fixed points of the drive beam. A spring property of the support members is smaller than a spring property of the drive beams.

A vibration angular velocity sensor includes a substrate and a vibrator. The vibrator includes support members, linear drive beams, and a plurality of weight portions connected by the drive beams. The vibrator vibrates the plurality of weight portions by bending of the drive beams. The vibrator is fixed to the substrate through the support members at fixed points of the drive beam. A spring property of the support members is smaller than a spring property of the drive beams.

A physical quantity sensor includes: a sensor element which detects predetermined physical quantity; a driving circuit which generates a driving signal of the sensor element; and an AGC circuit which controls the driving signal at a constant level according to a reference voltage, based on an output signal of the sensor element, in which the reference voltage is variable.

A physical quantity sensor includes: a sensor element which detects predetermined physical quantity; a driving circuit which generates a driving signal of the sensor element; and an AGC circuit which controls the driving signal at a constant level according to a reference voltage, based on an output signal of the sensor element, in which the reference voltage is variable.

A microelectromechanical device structure comprises a supporting structure wafer. A cavity electrode is formed within a cavity in the supporting structure wafer. The cavity electrode forms a protruding structure from a base of the cavity towards the functional layer, and the cavity electrode is connected to a defined electrical potential. The cavity electrode comprises a silicon column within the cavity in the supporting structure wafer, which is partially or entirely surrounded by a cavity. One or more cavity electrodes may be utilized for adjusting a frequency of an oscillation occurring within the functional layer.

A micromechanical component is provided having a substrate having a main plane of extension, a first electrode extending mainly along a first plane in planar fashion, a second electrode extending mainly along a second plane in planar fashion, and a third electrode extending mainly along a third plane in planar fashion, the first, second, and third plane being oriented essentially parallel to the main plane of extension and being situated one over the other at a distance from one another along a normal direction that is essentially perpendicular to the main plane of extension, the micromechanical component having a deflectable mass element, the mass element being capable of being deflected both essentially parallel and also essentially perpendicular to the main plane of extension, the second electrode being connected immovably to the mass element, the second electrode having, in a rest position, a first region of overlap with the first electrode along a projection direction essentially parallel to the normal direction, and having a second region of overlap with the third electrode along a projection direction parallel to the projection direction, the mass element extending in planar fashion mainly along the third plane, the mass element having a recess that extends completely through the mass element, extending in planar fashion along the third plane and parallel to the normal direction, the third electrode being situated at least partly in the recess.

A micromechanical component is provided having a substrate having a main plane of extension, a first electrode extending mainly along a first plane in planar fashion, a second electrode extending mainly along a second plane in planar fashion, and a third electrode extending mainly along a third plane in planar fashion, the first, second, and third plane being oriented essentially parallel to the main plane of extension and being situated one over the other at a distance from one another along a normal direction that is essentially perpendicular to the main plane of extension, the micromechanical component having a deflectable mass element, the mass element being capable of being deflected both essentially parallel and also essentially perpendicular to the main plane of extension, the second electrode being connected immovably to the mass element, the second electrode having, in a rest position, a first region of overlap with the first electrode along a projection direction essentially parallel to the normal direction, and having a second region of overlap with the third electrode along a projection direction parallel to the projection direction, the mass element extending in planar fashion mainly along the third plane, the mass element having a recess that extends completely through the mass element, extending in planar fashion along the third plane and parallel to the normal direction, the third electrode being situated at least partly in the recess.

This invention relates to the fiber optic distributed acoustic sensing to detect P and S waves in a solid medium. Distributed acoustic sensing can be achieved using an unmodified fiber optic by launching optical pulses into the fiber and detecting radiation which is Rayleigh backscattered there from. By analyzing the returns in analysis bins, acoustic disturbances can be detected in a plurality of discrete longitudinal sections of the fiber. The present invention extends such fiber distributed acoustic sensing to detection of S and P waves.

This invention relates to the fiber optic distributed acoustic sensing to detect P and S waves in a solid medium. Distributed acoustic sensing can be achieved using an unmodified fiber optic by launching optical pulses into the fiber and detecting radiation which is Rayleigh backscattered there from. By analyzing the returns in analysis bins, acoustic disturbances can be detected in a plurality of discrete longitudinal sections of the fiber. The present invention extends such fiber distributed acoustic sensing to detection of S and P waves.