A test set-up for testing a system-in package with an integrated antenna is described herein. According to one exemplary embodiment, the test set-up includes a carrier with an RF probe arranged thereon and a test socket with resilient electric contacts. The test socket is mounted on the carrier and provides an electric contact to interconnects of the package when it is placed on the test socket. The test socket has an opening which is arranged superjacent to the RF probe.

A circuit configuration for high-voltage tests includes an AC voltage source and at least two circuit branches, each of which can be electrically connected to the AC voltage source. An electrical AC voltage can be applied to a test object by a first circuit branch, and an electrical DC voltage can be applied to the test object by a second circuit branch which rectifies an AC voltage.

A circuit configuration for high-voltage tests includes an AC voltage source and at least two circuit branches, each of which can be electrically connected to the AC voltage source. An electrical AC voltage can be applied to a test object by a first circuit branch, and an electrical DC voltage can be applied to the test object by a second circuit branch which rectifies an AC voltage.

A Kelvin probe according to one or more embodiments includes first and second probe pins in parallel to each other with a space in between. Each of the first and second probe pins includes: an elastic portion configured to expand and contract along a first line; a first contact on a second line parallel to the first line; and a second contact on the first line. The first and second contacts are directly electrically connected to each other, and supported such that at least one of the first and second contacts is reciprocally movable through an elastic force of the elastic portion. Both of the first contacts of the first and second probe pins are positioned between the first line of the first probe pin and the first line of the second probe pin when viewed on a plane comprising the first and second lines.

A Kelvin probe according to one or more embodiments includes first and second probe pins in parallel to each other with a space in between. Each of the first and second probe pins includes: an elastic portion configured to expand and contract along a first line; a first contact on a second line parallel to the first line; and a second contact on the first line. The first and second contacts are directly electrically connected to each other, and supported such that at least one of the first and second contacts is reciprocally movable through an elastic force of the elastic portion. Both of the first contacts of the first and second probe pins are positioned between the first line of the first probe pin and the first line of the second probe pin when viewed on a plane comprising the first and second lines.

A method of calibrating a thermal sensor device is provided. The method includes extracting an incremental voltage to temperature curve for a diode array from a first incremental voltage of the diode array at a first temperature. The diode array and a device under test (DUT) which includes a thermal sensor are heated. After heating the diode array, a first incremental temperature is determined from the incremental voltage to temperature curve for the diode array and a second incremental voltage of the diode array after heating the diode array. An incremental voltage to temperature curve is extracted for the DUT from the first incremental temperature, a first incremental voltage for the DUT at the first temperature, and a second incremental voltage of the DUT after heating the device under test. A temperature error for the thermal sensor is determined from the incremental voltage to temperature curve for the DUT.

To provide an electric component socket in which a pressing surface of a pressing member is prevented from contacting a contact pin when the socket is pressed by the pressing surface in a state where a first electric component is not housed in the socket. A pressing surface of a pressing mechanism contacts a first electric component when the pressing mechanism is moved downward in a state where the first electric component is housed in a plate. On the other hand, when the pressing mechanism is moved downward in a state where the first electric component is not housed in the plate, a push-up member is lifted up with the plate to push up the pressing surface. Therefore, the pressing surface is moved upward to prevent the pressing surface from contacting the contact pin.

As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of the electrode pads of a TEG so as to facilitate the evaluation of electrical characteristics. According to an evaluation apparatus for a semiconductor device of the present invention, the above described problems can be solved by providing a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology.

A battery system includes battery cells to store electrical energy and to output electrical power. The battery system further includes a housing, a shunt, a control board, and a connector assembly. The housing includes a cavity that the shunt is disposed in and is in direct contact with, where the cavity facilitates dissipating torsional force exerted on the shunt. The control board is disposed within the housing and includes sensing circuitry to determine an operational parameter of the battery cells and control circuitry to facilitate controlling operation of the battery cells based on the operational parameter. The connector assembly electrically couples the shunt to the sensing circuitry via a spacing connector and a securing connector. The spacing connector is disposed between the control board and an inner surface of the housing while the securing connector extends through the shunt to couple to the spacing connector through the housing.

An inspection device comprising: a plurality of plungers; and a connection part electrically connecting at least some of the plungers of the plurality of plungers to each other.